Electronic control unit with separable cooling and memory modules

US12557239B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12557239-B2
Application numberUS-202318169704-A
CountryUS
Kind codeB2
Filing dateFeb 15, 2023
Priority dateMar 8, 2022
Publication dateFeb 17, 2026
Grant dateFeb 17, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic control unit (ECU) with separable cooling and memory modules is described. The cooling module has an integrated liquid-cooling circuit with a direct connection to the cooling circuit. The memory module includes an independent memory that can store data and be tested independent of the cooling module. The cooling module and the memory module contact at thermal-contact surfaces to enable cooling when installed in a vehicle. In this way, the cooling module may provide cooling through the thermal-contact surface to one or more memory modules and the memory module may be implemented without an internal cooling system.

First claim

Opening claim text (preview).

What is claimed is: 1 . An electronic control unit (ECU) comprising a cooling module including: a first electrical connection; a housing; a liquid-cooling circuit; and a first thermal-contact surface in thermal connection with the liquid-cooling circuit, wherein: the first thermal-contact surface is configured to contact a second thermal-contact surface of a memory module to provide thermal connection between the liquid-cooling circuit and the memory module, the housing is independent of a housing of the memory module, the cooling module is configured to be separable from the memory module without emptying liquid from the liquid-cooling circuit, the cooling module is separable from the memory module through one or more physical-connection elements, and the first electrical connection is configured to communicatively couple the memory module through a second electrical connection of the memory module to provide electrical communication between the cooling module and the memory module. 2 . The ECU of claim 1 , further comprising the memory module, wherein: the memory module includes: memory; the second electrical connection; and the second thermal-contact surface, the second electrical connection is configured to communicatively couple the memory module and the cooling module, and the second thermal-contact surface is in thermal contact with the first thermal-contact surface. 3 . The ECU of claim 2 , wherein the memory module does not include a liquid-cooling circuit. 4 . The ECU of claim 2 , wherein: the cooling module includes one or more computer processors, and the memory of the memory module stores processor-executable instructions that, responsive to execution by the one or more computer processors of the cooling module, perform control functions to control one or more systems within a vehicle. 5 . The ECU of claim 2 , wherein: the second electrical connection is configured to receive at least one of power or sensor data from the cooling module, and the memory module does not include a vehicle electrical connection. 6 . The ECU of claim 1 , wherein the cooling module includes one or more vehicle electrical connections configured to couple the cooling module to a vehicle. 7 . The ECU of claim 6 , wherein the one or more vehicle electrical connections are further configured to enable at least one of receipt of power from the vehicle, receipt of sensor data from the vehicle, or provision of control functions to the vehicle. 8 . The ECU of claim 1 , wherein the cooling module includes a coolant-circulation connector configured to receive and expel a coolant to and from the liquid-cooling circuit. 9 . An electronic control unit (ECU) comprising: a memory module including: a memory module electrical connection; a housing; a memory; one or more computer processors; and a memory module thermal-contact surface, wherein: the memory module thermal-contact surface is configured to contact a thermal-contact surface of a cooling module, the cooling module thermal-contact surface is configured to provide thermal connection between a liquid-cooling circuit of the cooling module and the memory module, the housing is independent of a housing of the cooling module, the memory module is configured to be separable from the cooling module without emptying liquid from the liquid-cooling circuit, the memory module is separable from the cooling module through one or more physical-connection elements, and the memory module electrical connection is configured to communicatively couple the memory module to the cooling module through an electrical connection of the cooling module. 10 . The ECU of claim 9 , further comprising the cooling module, wherein: the cooling module includes: the liquid-cooling circuit; the cooling module electrical connection; and the cooling module thermal-contact surface, the cooling module electrical connection is configured to communicatively couple the memory module and the cooling module, and the cooling module thermal-contact surface is in thermal contact with the memory module thermal-contact surface. 11 . The ECU of claim 9 , wherein the memory module does not include the liquid-cooling circuit or another liquid-cooling circuit. 12 . The ECU of claim 9 , wherein the memory of the memory module stores processor-executable instructions that, responsive to execution by the one or more computer processors, perform control functions to control one or more systems within a vehicle. 13 . The ECU of claim 12 , wherein: the one or more systems within the vehicle is an assisted-driving system, and the control functions enable at least one of self-driving or assisted-driving of the vehicle. 14 . The ECU of claim 12 , wherein: the one or more systems within the vehicle is a braking system, and the control functions enable at least one of automatic braking or electronic stability control of the vehicle. 15 . The ECU of claim 12 , wherein: the one or more systems within the vehicle is a battery-management system, and the control functions enable at least one of battery charging or battery-life extension. 16 . The ECU of claim 12 , wherein: the one or more systems within the vehicle is a flight navigation system, and the control functions enable auto-pilot functions. 17 . The ECU of claim 12 , wherein: the one or more systems within the vehicle is at least one of a radar or lidar system, and the control functions enable processing of a radar or lidar signal. 18 . The ECU of claim 9 , wherein; the memory module does not include a vehicle electrical connection, and the electrical connection of the cooling module is configured to receive communicative coupling with a vehicle. 19 . The ECU of claim 9 , wherein: the memory module includes one or more vehicle electrical connections, and the one or more vehicle electrical connections are configured to receive communicative coupling with a vehicle. 20 . The ECU of claim 19 , wherein the one or more vehicle electrical connections are further configured to enable at least one of receipt of power from the vehicle, receipt of sensor data from the vehicle, or provision of control functions from the memory module to the vehicle.

Assignees

Inventors

Classifications

  • provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units · CPC title

  • wherein modules are associated together, e.g. electromechanical assemblies, modular structures · CPC title

  • using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

  • Liquid coolant without phase change · CPC title

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What does patent US12557239B2 cover?
An electronic control unit (ECU) with separable cooling and memory modules is described. The cooling module has an integrated liquid-cooling circuit with a direct connection to the cooling circuit. The memory module includes an independent memory that can store data and be tested independent of the cooling module. The cooling module and the memory module contact at thermal-contact surfaces to e…
Who is the assignee on this patent?
Aptiv Tech Ltd, Aptiv Technologies AG
What technology area does this patent fall under?
Primary CPC classification H05K7/20218. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 17 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).