Multi-layered polyimide film, metal-clad laminate, and method for producing multi-layered polyimide film

Patent metadata

Field	Value
Publication number	US-12552969-B2
Application number	US-202318133393-A
Country	US
Kind code	B2
Filing date	Apr 11, 2023
Priority date	Oct 14, 2020
Publication date	Feb 17, 2026
Grant date	Feb 17, 2026

Abstract

A multi-layered polyimide film includes a non-thermoplastic polyimide layer, and an adhesive layer that is disposed on at least one surface of the non-thermoplastic polyimide layer and contains polyimide. A dielectric loss tangent of the non-thermoplastic polyimide layer at a frequency of 10 GHz, a temperature of 23° C. and a relative humidity of 50% is 0.0030 or less. The adhesive layer has no melting peak or has a melting heat of 1.0 J/g or less at a melting peak in a temperature range of 100° C. or higher and 420° C. or lower. The polyimide contained in the adhesive layer has one or more tetracarboxylic dianhydride residues selected from a pyromellitic dianhydride residue and a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, and one or more diamine residues selected from a 1,3-bis(4-aminophenoxy)benzene residue and a 4,4′-diamino-2,2′-dimethylbiphenyl residue.

First claim

What is claimed is:

1 . A multi-layered polyimide film comprising:
a non-thermoplastic polyimide layer, and an adhesive layer that is disposed on at least one surface of the non-thermoplastic polyimide layer and contains polyimide, wherein: a dielectric loss tangent of the non-thermoplastic polyimide layer at a frequency of 10 GHz, a temperature of 23° C., and a relative humidity of 50% is 0.0030 or less, the adhesive layer has no melting peak or has a melting heat of 1.0 J/g or less at a melting peak in a temperature range of 100° C. or higher and 420° C. or lower, and the polyimide contained in the adhesive layer has one or more tetracarboxylic dianhydride residues selected from the group consisting of a pyromellitic dianhydride residue and a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, and one or more diamine residues selected from the group consisting of a 1,3-bis(4-aminophenoxy) benzene residue and a 4,4′-diamino-2,2′-dimethylbiphenyl residue, a non-thermoplastic polyimide in the non-thermoplastic polyimide layer comprises diamine residues comprising a p-phenylenediamine residue and a 1,3-bis(4-aminophenoxy) benzene residue, a content ratio of the p-phenylenediamine residue to the total amount of the diamine residues constituting the non-thermoplastic polyimide is 60 mol % or more and 95 mol % or less, a content ratio of the 1,3-bis(4-aminophenoxy) benzene residue to the total amount of the diamine residues constituting the non-thermoplastic polyimide is 5 mol % or more and 40 mol % or less wherein the non-thermoplastic polyimide in the non-thermoplastic polyimide layer comprises dianhydride residues comprising a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, a 4,4′-oxydiphthalic anhydride residue, and a pyromellitic dianhydride residue, wherein: a content ratio of the 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue to the total amount of the dianhydride residues constituting the non-thermoplastic polyimide is 50 mol % or more and 70 mol % or less, a content ratio of the 4,4′-oxydiphthalic anhydride residue to the total amount of the dianhydride residues constituting the non-thermoplastic polyimide is 20 mol % or more and 40 mol % or less, and a content ratio of the pyromellitic dianhydride residue to the total amount of the dianhydride residues constituting the non-thermoplastic polyimide is 2 mol % or more and 8 mol % or less.

2 . The multi-layered polyimide film according to claim 1 , wherein the adhesive layer is disposed on each of both surfaces of the non-thermoplastic polyimide layer.

3 . The multi-layered polyimide film according to claim 1 , wherein the adhesive layer contains tertiary amine at a content ratio of 1 ppm by mass or more.

4 . The multi-layered polyimide film according to claim 1 , wherein the non-thermoplastic polyimide layer contains tertiary amine at a content ratio of 1 ppm by mass or more.

5 . The multi-layered polyimide film according to claim 1 , wherein the polyimide contained in the adhesive layer has no p-phenylenediamine residue.

6 . The multi-layered polyimide film according to claim 1 , wherein the adhesive layer has no melting peak in a temperature range of 100° C. or higher and 420° C. or lower.

7 . The multi-layered polyimide film according to claim 1 , wherein the polyimide contained in the adhesive layer comprises the dianhydride residues comprising the pyromellitic dianhydride residue and the 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, wherein:
a content ratio of the pyromellitic dianhydride residue to the total amount of the dianhydride residues constituting the polyimide contained in the adhesive layer is 30 mol % or more and 70 mol % or less, and
a content ratio of the 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue to the total amount of the dianhydride residues constituting the polyimide contained in the adhesive layer is 30 mol % or more and 70 mol % or less.

8 . The multi-layered polyimide film according to claim 7 , wherein the polyimide contained in the adhesive layer comprises the diamine residues comprising the 1,3-bis(4-aminophenoxy) benzene residue and the 4,4′-diamino-2,2′-dimethylbiphenyl residue, wherein:
a content ratio of the 1,3-bis(4-aminophenoxy) benzene residue to the total amount of the diamine residues constituting the polyimide contained in the adhesive layer is 60 mol % or more and 95 mol % or less, and
a content ratio of the 4,4′-diamino-2,2′-dimethylbiphenyl residue to the total amount of the diamine residues constituting the polyimide contained in the adhesive layer is 5 mol % or more and 40 mol % or less.

9 . A metal-clad laminate comprising:
the multi-layered polyimide film according to claim 1 , and a metal layer disposed on a main surface of at least one of the adhesive layers of the multi-layered polyimide film.

Assignees

• Kaneka Corp

Inventors

• Kono Fumiya
• Akiyama Takayoshi
• Akisada Mami
• Uno Mari

Classifications

• H05K2201/0154

  Polyimide · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K1/036

  Multilayers with layers of different types · CPC title

• C09J7/25 Primary

  based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds · CPC title

• H05K1/03

  Use of materials for the substrate · CPC title