Anti-flutter adhesive composition

Patent metadata

Field	Value
Publication number	US-12540261-B2
Application number	US-202318300173-A
Country	US
Kind code	B2
Filing date	Apr 13, 2023
Priority date	Nov 5, 2020
Publication date	Feb 3, 2026
Grant date	Feb 3, 2026

Abstract

This invention relates to an anti-flutter adhesive composition, comprising a) at least one ethylenically unsaturated polymer; b) at least one PVC homopolymer having a K value from 67 to 75; c) at least one PVC copolymer having a K value from 60 to 75; d) at least one epoxy resin; e) at least one epoxy curing agent; f) at least one first organic peroxide having a decomposition temperature from 125 to 180° C.; and g) at least one second organic peroxide having a decomposition temperature less than 125° C. The anti-flutter adhesive composition can be cured across a wide temperature and have excellent shear strength and good appearance after cured.

First claim

What is claimed is:

1 . An anti-flutter adhesive composition comprising:
a) at least one ethylenically unsaturated rubber; b) at least one PVC homopolymer having a K value from 67 to 75; c) at least one PVC copolymer having a K value from 60 to 75; d) at least one epoxy resin; e) at least one epoxy curing agent; f) at least one first organic peroxide having a decomposition temperature from 125 to 180° C.; and g) at least one second organic peroxide having a decomposition temperature less than 125° C.; wherein the amount of the at least one first organic peroxide is from 0.4 to 0.8% by weight based on total weight of the composition; and the amount of the at least one second organic peroxide is from 0.2 to 1% by weight based on the total weight of the composition.

2 . The anti-flutter adhesive composition according to claim 1 , wherein the PVC homopolymer has a K value from 68 to 71.

3 . The anti-flutter adhesive composition according to claim 1 , wherein the amount of the PVC homopolymer is from 6 to 15% by weight based on the total weight of the composition.

4 . The anti-flutter adhesive composition according to claim 1 , wherein the PVC copolymer has a K value from 63 to 70.

5 . The anti-flutter adhesive composition according to claim 1 , wherein the amount of the PVC copolymer is from 2 to 5% by weight based on the total weight of the composition.

6 . The anti-flutter adhesive composition according to claim 1 , wherein the first organic peroxide has a decomposition temperature from 130 to 160° C.

7 . The anti-flutter adhesive composition according to claim 1 , wherein the first organic peroxide comprises dicumyl peroxide.

8 . The anti-flutter adhesive composition according to claim 1 , wherein the amount of the first organic peroxide is from 0.5 to 0.7% by weight based on the total weight of the composition.

9 . The anti-flutter adhesive composition according to claim 1 , wherein the second organic peroxide has a decomposition temperature in a range from 50 to 120° C.

10 . The anti-flutter adhesive composition according to claim 1 , wherein the second organic peroxide comprises 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane.

11 . The anti-flutter adhesive composition according to claim 1 , wherein the amount of the second organic peroxide is from 0.3 to 0.4% by weight based on the total weight of the composition.

12 . The anti-flutter adhesive composition according to claim 1 , further comprising at least one nano-sized inorganic filler, and least one fumed silica having a B.E.T surface area in a range from 150 to 250 m 2 /g.

13 . The anti-flutter adhesive composition according to claim 12 , wherein the at least one nano-sized inorganic filler is present in an amount of from 10 to 30% based on the total weight of the composition, and the amount of the fumed silica having a B.E.T surface area in the range from 150 to 250 m 2 /g is present in an amount of from 1.5 to 3% based on the total weight of the composition.

14 . The anti-flutter adhesive composition according to claim 12 , wherein the at least one nano-sized inorganic filler is present in an amount of from 15 to 20% based on the total weight of the composition, and the amount of the fumed silica having a B.E.T surface area in the range from 150 to 250 m 2 /g is present in an amount of from 2 to 3% based on the total weight of the composition.

15 . The anti-flutter adhesive composition according to claim 1 , comprising:
(a) from 2 to 10% by weight of the at least one ethylenically unsaturated rubber; (b) from 6 to 15% by weight of the at least one PVC homopolymer having a K value from 67 to 75; (c) from 2 to 5% by weight of the at least one PVC copolymer having a K value from 60 to 75; (d) from 1 to 6% by weight of the at least one epoxy resin; (e) from 0.01 to 2% by weight of the at least one epoxy curing agent; (f) from 0.5 to 0.7% by weight of the at least one first organic peroxide having a decomposition temperature from 125 to 180° C.; (g) from 0.2 to 1% by weight of the at least one second organic peroxide having a decomposition temperature less than 125° C., wherein the decomposition temperature is in a range of 50 to 120° C.; wherein the anti-flutter adhesive composition optionally further comprises from 0 to 30% by weight of at least one nano-sized inorganic filler; from 0 to 3% by weight of at least one fumed silica having a B.E.T surface area from 150 to 250 m 2 /g; from 0 to 40% by weight of at least one plasticizer; from 0 to 0.2% by weight of at least one heat stabilizer; from 0 to 1% by weight of at least one blowing agent; from 0 to 10% by weight of at least one cross-linking agent; from 0 to 10% by weight of at least one additional inorganic filler different from the nano-sized inorganic filler; and from 0 to 1% by weight of at least one thermo-expandable microsphere; wherein the weight percentages of all components add up to 100% by weight.

16 . A cured product of the anti-flutter adhesive composition according to claim 1 .

17 . An article of manufacture bonded or filled with the cured product of claim 16 .

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Zhong Jinfeng
• Chen Qi

Classifications

• C08K2201/011

  Nanostructured additives · CPC title

• C08K2201/006

  Additives being defined by their surface area · CPC title

• C08K3/36

  Silica · CPC title

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C09J11/06

  organic · CPC title