Silver sintering preparation and the use thereof for the connecting of electronic components
US-11938543-B2 · Mar 26, 2024 · US
US12539566B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12539566-B2 |
| Application number | US-202118257037-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 22, 2021 |
| Priority date | Dec 16, 2020 |
| Publication date | Feb 3, 2026 |
| Grant date | Feb 3, 2026 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The invention relates to a sintering paste consisting of: (A) 30 to 40 wt. % of silver flakes with an average particle size ranging from 1 to 20 μm, (B) 8 to 20 wt. % of silver particles with an average particle size ranging from 20 to 100 nm, (C) 30 to 45 wt. % of silver(I) oxide particles, (D) 12 to 20 wt. % of at least one organic solvent, (E) 0 to 1 wt. % of at least one polymer binder, and (F) 0 to 0.5 wt. % of at least one additive differing from constituents (A) to (E).
Opening claim text (preview).
The invention claimed is: 1 . A sintering paste consisting of: (A) 32 to 37 wt. % of silver flakes with an average particle size ranging from 1 to 20 μm; (B) 10 to 16 wt. % of silver particles with an average particle size ranging from 20 to 100 nm; (C) 32 to 40 wt. % of silver(I) oxide particles; (D) 12 to 20 wt. % of at least one organic solvent; (E) 0 to 1 wt. % of at least one polymer binder; and (F) 0 to 0.5 wt. % of at least one additive differing from constituents (A) to (E). 2 . The sintering paste according claim 1 , wherein the silver particles have an aspect ratio ranging from 1:1 to 5:1. 3 . The sintering paste according to claim 1 , wherein the silver(I) oxide particles have an average particle size ranging from 0.4 to 4 μm. 4 . The sintering paste according to claim 1 , wherein the at least one organic solvent is a combination of at least one terpineol with at least one dibasic ester. 5 . The sintering paste according to claim 1 , wherein the at least one polymer binder is selected from cellulose derivatives. 6 . The sintering paste according to claim 1 , wherein at least a portion of the silver particles is adhered to at least a portion of the silver flakes. 7 . A method for producing the sintering paste according to claim 1 , the method comprising mixing constituents (A) to (D) with one another, wherein constituents (A) and (B) are first premixed with one another. 8 . A method for connecting components, the method comprising: (1) providing a sandwich arrangement, the sandwich arrangement comprising at least two components and a sintering paste according to claim 1 located between the components; (2) optionally drying the sintering paste; and (3) sintering the sandwich arrangement. 9 . The method according to claim 8 , wherein at least one of the at least two components consists of aluminum or an aluminum alloy. 10 . The method according to claim 8 , wherein the sintering paste is applied by means of dispensing technology. 11 . The method according to claim 8 , wherein sintering is carried out under pressure or in an unpressurized manner. 12 . The method according to claim 8 , wherein the components are component parts for electronics. 13 . A method for connecting components, the method comprising: (1) providing a sandwich arrangement, the sandwich arrangement comprising at least two components and the sintering paste, the sintering paste produced by a method according to claim 7 and located between the components; (2) optionally drying the sintering paste; and (3) sintering the sandwich arrangement. 14 . The method of claim 13 , the method comprising drying the sintering paste. 15 . The method of claim 8 , the method comprising drying the sintering paste. 16 . The method according to claim 8 , wherein at least one of the at least two components comprises an aluminum contact surface or an aluminum-based contact surface by which the sandwich arrangement is made. 17 . The method according to claim 7 , wherein constituents (A) to (E) are mixed with one another. 18 . The method according to claim 7 , wherein constituents (A) to (F) are mixed with one another. 19 . The sintering paste of claim 1 , wherein at least one of the silver particles and the silver(I) oxide particles comprise an organic coating.
Aluminium or alloys thereof · CPC title
Polymers, e.g. resins · CPC title
Ag as the principal constituent · CPC title
Pastes, creams or slurries · CPC title
Connecting techniques · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.