Processing system and method of forming a contact
US-2020203481-A1 · Jun 25, 2020 · US
Integrated wet clean for epitaxial growth
US12538737B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12538737-B2 |
| Application number | US-202217859752-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 7, 2022 |
| Priority date | Jul 7, 2021 |
| Publication date | Jan 27, 2026 |
| Grant date | Jan 27, 2026 |
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- Title
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Abstract
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Exemplary integrated cluster tools may include a factory interface including a first transfer robot. The tools may include a wet clean system coupled with the factory interface at a first side of the wet clean system. The tools may include a load lock chamber coupled with the wet clean system at a second side of the wet clean system opposite the first side of the wet clean system. The tools may include a first transfer chamber coupled with the load lock chamber. The first transfer chamber may include a second transfer robot. The tools may include a dry etch chamber coupled with the first transfer chamber. The tools may include a second transfer chamber coupled with the first transfer chamber. The second transfer chamber may include a third transfer robot. The tools may include a process chamber coupled with the second transfer chamber.
First claim
Opening claim text (preview).
The invention claimed is: 1 . An integrated cluster tool comprising: a factory interface including a first transfer robot; a wet clean system coupled with the factory interface at a first side of the wet clean system, the wet clean system comprising a plurality of single-wafer wet clean chambers stacked on one another, wherein each single-wafer wet clean chamber is fluidly coupled with multiple wet chemistry delivery systems; a load lock chamber coupled with the wet clean system at a second side of the wet clean system opposite the first side of the wet clean system; a first transfer chamber coupled with the load lock chamber, wherein the first transfer chamber includes a second transfer robot; a dry etch chamber coupled with the first transfer chamber; a second transfer chamber coupled with the first transfer chamber, wherein the second transfer chamber includes a third transfer robot; and an epitaxial growth chamber coupled with the second transfer chamber. 2 . The integrated cluster tool of claim 1 , wherein the wet clean system comprises: a single-wafer wet clean chamber operably maintained at atmospheric pressure, wherein the first transfer chamber is maintained at vacuum conditions. 3 . The integrated cluster tool of claim 2 , wherein the single-wafer wet clean chamber is fluidly coupled with multiple chemistry delivery systems. 4 . The integrated cluster tool of claim 2 , wherein the single-wafer wet clean chamber is accessible to the first transfer robot of the factory interface. 5 . The integrated cluster tool of claim 2 , wherein the wet clean system further comprises: a fourth transfer robot disposed in the wet clean system, wherein the fourth transfer robot is operable to transfer substrates between the single-wafer wet clean chamber and the load lock chamber. 6 . The integrated cluster tool of claim 1 , wherein a track on which the first transfer robot operates extends into the wet clean system.
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Transport systems · CPC title
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- What does patent US12538737B2 cover?
- Exemplary integrated cluster tools may include a factory interface including a first transfer robot. The tools may include a wet clean system coupled with the factory interface at a first side of the wet clean system. The tools may include a load lock chamber coupled with the wet clean system at a second side of the wet clean system opposite the first side of the wet clean system. The tools may…
- Who is the assignee on this patent?
- Applied Materials Inc
- What technology area does this patent fall under?
- Primary CPC classification H01L21/67184. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).