Heat dissipation module and electronic device

Patent metadata

Field	Value
Publication number	US-12538457-B2
Application number	US-202318395621-A
Country	US
Kind code	B2
Filing date	Dec 25, 2023
Priority date	Dec 23, 2022
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

The invention provides a heat dissipation module and an electronic device. The heat dissipation module includes a thermally conductive plastic member and a metal member. The thermally conductive plastic member includes a base and a plurality of heat dissipation fins. The base includes an upper surface and a lower surface opposite to each other, and the heat dissipation fins are arranged at intervals at the upper surface. The metal member is disposed at the lower surface of the base. The thermally conductive plastic member and the metal member are combined via insert molding. One of the thermally conductive plastic member and the metal member includes a plurality of heat dissipation bosses separated from each other, and the heat dissipation bosses are located at the lower surface of the base of the thermally conductive plastic member or at a surface of the metal member relatively far away from the base.

First claim

What is claimed is:

1 . A heat dissipation module, comprising: a thermally conductive plastic member comprising a base and a plurality of heat dissipation fins, the base comprises an upper surface and a lower surface opposite to each other, and the plurality of heat dissipation fins are arranged at intervals at the upper surface; and a metal member disposed at the lower surface of the base, wherein the thermally conductive plastic member and the metal member are combined via insert molding, one of the thermally conductive plastic member and the metal member comprises a plurality of heat dissipation bosses separated from each other, and the plurality of heat dissipation bosses are located at the lower surface of the base of the thermally conductive plastic member or at a surface of the metal member relatively far away from the base; wherein an orthographic projection area of the thermally conductive plastic member on the metal member is less than an area of the metal member.

2 . The heat dissipation module of claim 1 , wherein the thermally conductive plastic member comprises the plurality of heat dissipation bosses, and a portion of the metal member is located between the plurality of heat dissipation bosses and the base.

3 . The heat dissipation module of claim 1 , wherein the metal member comprises the plurality of heat dissipation bosses, and the plurality of heat dissipation bosses are protruded by a height relative to the surface of the metal member.

4 . The heat dissipation module of claim 1 , wherein the thermally conductive plastic member also comprises a plurality of fixing members separated from each other, and the plurality of fixing members are extended from the lower surface of the base through the metal member and embedded in the surface.

5 . An electronic device, comprising: a circuit board; a chip disposed on the circuit board and electrically connected to the circuit board; and a heat dissipation module detachably disposed on the circuit board and defining an accommodating space with the circuit board, the chip is located in the accommodating space, and the heat dissipation module comprises: a thermally conductive plastic member comprising a base and a plurality of heat dissipation fins, the base comprises an upper surface and a lower surface opposite to each other, and the plurality of heat dissipation fins are arranged at intervals at the upper surface; and a metal member disposed at the lower surface of the base, wherein the thermally conductive plastic member and the metal member are combined via insert molding, one of the thermally conductive plastic member and the metal member comprises a plurality of heat dissipation bosses separated from each other, and the plurality of heat dissipation bosses are located at the lower surface of the base of the thermally conductive plastic member or at a surface of the metal member relatively far away from the base and correspond to the chip; wherein an orthographic projection area of the thermally conductive plastic member on the metal member is less than an area of the metal member.

6 . The electronic device of claim 5 , wherein the thermally conductive plastic member comprises the plurality of heat dissipation bosses, and a portion of the metal member is located between the plurality of heat dissipation bosses and the base.

7 . The electronic device of claim 5 , further comprising: a bracket disposed on the circuit board and surrounding the chip, wherein the metal member comprises a plurality of first buckling members, and the bracket comprises a plurality of second buckling members, and the plurality of first buckling members respectively buckle the plurality of second buckling members, so that the heat dissipation module is fixed on the circuit board.

8 . The electronic device of claim 5 , wherein the metal member comprises the plurality of heat dissipation bosses, and the plurality of heat dissipation bosses are protruded by a height relative to the surface of the metal member.

9 . The electronic device of claim 5 , further comprising: a bracket disposed on the circuit board and surrounding the chip, wherein the thermally conductive plastic member comprises a plurality of first fixing members, and the bracket comprises a plurality of second fixing members; and a plurality of fasteners passing through the plurality of first fixing members and the plurality of second fixing members respectively and sequentially, so that the heat dissipation module is fixed on the circuit board.

10 . The electronic device of claim 5 , wherein the thermally conductive plastic member also comprises a conductive adhesive disposed at the lower surface of the base and surrounding a periphery of the base.

11 . The electronic device of claim 5 , wherein the thermally conductive plastic member also comprises a plurality of fixing members separated from each other, and the plurality of fixing members are extended from the lower surface of the base through the metal member and embedded in the surface.

Assignees

• Sercomm Corp

Inventors

• Wu Chengpu
• Chen Sheng-Yao
• Yu yi fei

Classifications

• H01L2023/4087

  Electricity · mapped topic

• H05K7/20436

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title

• H01L23/4006

  Electricity · mapped topic

• H01L23/3675

  Electricity · mapped topic

• H05K7/20409 Primary

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title