Stencil mask and stencil printing method

Patent metadata

Field	Value
Publication number	US-12538433-B2
Application number	US-202318299072-A
Country	US
Kind code	B2
Filing date	Apr 12, 2023
Priority date	Apr 14, 2022
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

A stencil mask and a stencil printing method are provided. The stencil mask includes: a non-reinforcement portion having a mask surface configured to contact a substrate surface of a substrate; and a reinforcement portion having a thickness greater than that of the non-reinforcement portion, wherein the reinforcement portion includes: an embossed surface for insertion into a cavity of the substrate and configured to contact a cavity bottom surface when the stencil mask is placed onto the substrate for stencil printing; and at least one first stencil window that allows the fluid material to flow through the reinforcement portion, wherein the at least one first stencil window is aligned with at least one printing region within the cavity when the stencil mask is placed onto the substrate for stencil printing.

First claim

The invention claimed is:

1 . A stencil mask for printing a fluid material onto a substrate, wherein the substrate comprises a substrate surface, a cavity having a cavity bottom surface below the substrate surface, and at least one printing region within the cavity; and wherein the stencil mask comprises:
a non-reinforcement portion having a mask surface configured to contact the substrate surface; and a reinforcement portion having a thickness greater than that of the non-reinforcement portion, wherein the reinforcement portion comprises:
an embossed surface for insertion into the cavity of the substrate and configured to contact the cavity bottom surface when the stencil mask is placed onto the substrate for stencil printing; and
at least one first stencil window that allows the fluid material to flow through the reinforcement portion, wherein the at least one first stencil window is aligned with the at least one printing region within the cavity when the stencil mask is placed onto the substrate for stencil printing.

2 . The stencil mask of claim 1 , wherein the at least one first stencil window has at its bottom a cross-sectional shape the same as a shape of one of the at least one printing region.

3 . The stencil mask of claim 2 , wherein the at least one first stencil window has a vertically straight sidewall.

4 . The stencil mask of claim 2 , wherein the at least one first stencil window has an inward inclined sidewall.

5 . The stencil mask of claim 2 , wherein a coating layer with anti-stick properties is formed on a sidewall of the at least one first stencil window.

6 . The stencil mask of claim 1 , wherein the non-reinforcement portion comprises at least one second stencil window that allows the fluid material to flow through the non-reinforcement portion.

7 . The stencil mask of claim 1 , wherein the thickness of the reinforcement portion is greater than that of the non-reinforcement portion by a depth of the cavity of the substrate.

8 . The stencil mask of claim 1 , wherein the reinforcement portion comprises a reinforcement base frame, and the non-reinforcement portion is formed by etching a portion of a thickness of the reinforcement base frame at the non-reinforcement portion.

9 . The stencil mask of claim 1 , wherein the non-reinforcement portion comprises a non-reinforcement base frame, and the reinforcement portion is formed by attaching a reinforcement layer onto a portion of the non-reinforcement base frame.

10 . A stencil printing method, comprising:
providing a substrate, wherein the substrate comprises a substrate surface and a cavity having a cavity bottom surface below the substrate surface; providing a stencil mask, wherein the stencil mask comprises a non-reinforcement portion and a reinforcement portion having a thickness greater than that of the non-reinforcement portion, and wherein the non-reinforcement portion has a mask surface, and the reinforcement portion has an embossed surface and at least one first stencil window; placing the stencil mask onto the substrate, such that the embossed surface is inserted into the cavity of the substrate and is in contact with the cavity bottom surface; depositing a fluid material on the stencil mask so that the fluid material flows through the at least one first stencil window onto at least one printing region in the cavity bottom surface; and planarizing the fluid material using a squeegee.

11 . The method of claim 10 , wherein the non-reinforcement portion comprises at least one second stencil window, and when depositing the fluid material on the stencil mask, the fluid material flows through the at least one second stencil window onto at least one printing region in the substrate surface.

12 . The method of claim 10 , further comprising:
removing the stencil mask from the substrate after the fluid material is planarized.

13 . The method of claim 10 , wherein the substrate comprises a printed circuit board, and the at least one printing region comprises a contact pad formed on the printed circuit board.

14 . The method of claim 10 , wherein the fluid material comprises solder paste.

15 . The method of claim 14 , further comprising:
reflowing the solder paste to mount at least one electronic component within the cavity.

Assignees

• Stats Chippac Pte Ltd

Inventors

• Koo Kyowang
• Lee Kicheol
• Lim Bolee

Classifications

• H01L2224/83815

  Electricity · mapped topic

• H01L2224/83192

  Electricity · mapped topic

• B23K2101/42

  Printed circuits · CPC title

• H01L24/83

  Electricity · mapped topic

• B23K37/06

  for positioning the molten material, e.g. confining it to a desired area · CPC title