Universal sub slot architecture for networking modules

Patent metadata

Field	Value
Publication number	US-12537606-B2
Application number	US-202318340262-A
Country	US
Kind code	B2
Filing date	Jun 23, 2023
Priority date	Apr 23, 2019
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

A host module configured for insertion into a chassis of a network element includes a Printed Circuit Board (PCB); a plurality of rails disposed on the PCB, for housing one or more universal sub slot modules on the host module, wherein the plurality of rails are for guiding a universal sub slot module during insertion and for stabilization thereof; and a faceplate disposed to the PCB and including one or more openings each for the one or more universal sub slot modules, wherein the PCB communicates to each of the one or more universal sub slot modules via a plurality of high-speed links that are at least 28 Gbps each. At least one of the one or more universal sub slot modules can be a coherent modem or a router.

First claim

What is claimed is:

1 . A host module configured for insertion into a chassis of a network element comprising:
a Printed Circuit Board (PCB); a plurality of rails disposed on the PCB, for housing one or more universal sub slot modules on the host module, wherein the plurality of rails are for guiding a universal sub slot module during insertion and for stabilization thereof; a faceplate disposed to the PCB and including one or more openings each for the one or more universal sub slot modules; and a connector system for each of the one or more universal sub slot modules, wherein the connector system includes a second PCB connected to the PCB, wherein the second PCB includes a mounted connector configured to receive a universal sub slot module; and a cable harness connected to the mounted connector and chip connectors on the PCB, wherein the PCB communicates to each of the one or more universal sub slot modules via a plurality of high-speed links that are at least 28 Gbps each.

2 . The host module of claim 1 , wherein at least one of the one or more universal sub slot modules is a coherent modem.

3 . The host module of claim 1 , wherein at least one of the one or more universal sub slot modules communicates up to 1.6 Tbps with the host module via the plurality of high-speed links.

4 . The host module of claim 1 , wherein at least one of the one or more universal sub slot modules communicates up to 3.2 Tbps with the host module via the plurality of high-speed links.

5 . The host module of claim 1 , wherein at least one of the one or more universal sub slot modules includes a data plane for communication with the host module, and wherein the data plane is configured to implement one of Optical Transport Network (OTN), Beyond 100 G, Flexible Optical (FlexO), Ethernet, and Flexible Ethernet (FlexE).

6 . The host module of claim 1 , wherein at least one of the one or more universal sub slot modules includes circuitry for specialized functions including any of Ternary Content-Addressable Memory (TCAM), a statistics (STATS) gathering engine, and a Network Processing Unit (NPU).

7 . The host module of claim 6 , wherein the at least one of the one or more universal sub slot modules excludes optics.

8 . The host module of claim 1 , further comprising circuitry configured to communicate to the one or more universal sub slot modules.

9 . The host module of claim 8 , wherein the circuitry is further configured to communicate to the one or more universal sub slot modules without powering the universal sub slot module.

10 . The host module of claim 1 , wherein a faceplate of the one or more universal sub slot modules with the faceplate of the host module are configured to provide an electromagnetic interference barrier for the host module.

11 . The host module of claim 1 , wherein at least one of the one or more universal sub slot modules is a router.

12 . A network element comprising:
a chassis configured to operate one or more host modules each including:
a Printed Circuit Board (PCB),
a plurality of rails disposed on the PCB, for housing one or more universal sub slot modules on the host module, wherein the plurality of rails are for guiding a universal sub slot module during insertion and for stabilization thereof,
a faceplate disposed to the PCB and including one or more openings each for the one or more universal sub slot modules, and,
a connector system for each of the one or more universal sub slot modules, wherein the connector system includes a second PCB connected to the PCB, wherein the second PCB includes a mounted connector configured to receive a universal sub slot module; and a cable harness connected to the mounted connector and chip connectors on the PCB,
wherein the PCB communicates to each of the one or more universal sub slot modules via a plurality of high-speed links that are at least 28 Gbps each.

13 . The network element of claim 12 , wherein at least one of the one or more universal sub slot modules is a coherent modem.

14 . The network element of claim 12 , wherein at least one of the one or more universal sub slot modules communicates up to 3.2 Tbps with the host module via the plurality of high-speed links.

15 . The network element of claim 12 , wherein at least one of the one or more universal sub slot modules includes a data plane for communication with the host module, and wherein the data plane is configured to implement one of Optical Transport Network (OTN), Beyond 100 G, Flexible Optical (FlexO), Ethernet, and Flexible Ethernet (FlexE).

16 . The network element of claim 12 , wherein at least one of the one or more universal sub slot modules includes circuitry for specialized functions including any of Ternary Content-Addressable Memory (TCAM), a statistics (STATS) gathering engine, and a Network Processing Unit (NPU).

17 . A host module configured for insertion into a chassis of a network element comprising:
a Printed Circuit Board (PCB); a plurality of rails disposed on the PCB, for housing one or more universal sub slot modules on the host module, wherein the plurality of rails are for guiding a universal sub slot module during insertion and for stabilization thereof; a faceplate disposed to the PCB and including one or more openings each for the one or more universal sub slot modules; and circuitry configured to detect a presence of the one or more universal sub slot modules, wherein the circuitry configured to detect the presence is configured to differentiate between a universal sub slot module and a filler card, wherein the PCB communicates to each of the one or more universal sub slot modules via a plurality of high-speed links that are at least 28 Gbps each.

18 . The host module of claim 17 , wherein at least one of the one or more universal sub slot modules is a coherent modem.

19 . The host module of claim 17 , wherein at least one of the one or more universal sub slot modules communicates up to 1.6 Tbps with the host module via the plurality of high-speed links.

20 . The host module of claim 17 , wherein at least one of the one or more universal sub slot modules includes a data plane for communication with the host module, and wherein the data plane is configured to implement one of Optical Transport Network (OTN), Beyond 100 G, Flexible Optical (FlexO), Ethernet, and Flexible Ethernet (FlexE).

Assignees

• Ciena Corp

Inventors

• Leclair Marc
• O'Leary Mitchell
• Benvenuti Nicola
• Mcgale James
• Rivaud Daniel
• Button Sheldon

Classifications

• G06F1/185

  Mounting of expansion boards · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• H04B10/801 Primary

  using optical interconnects, e.g. light coupled isolators, circuit board interconnections · CPC title

• G02B6/4261

  Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails · CPC title

• H05K1/141 Primary

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title