Method of cooling stacked, pluggable optical transceivers

Patent metadata

Field	Value
Publication number	US-9846287-B2
Application number	US-201414329492-A
Country	US
Kind code	B2
Filing date	Jul 11, 2014
Priority date	Jul 11, 2013
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

An optical transceiver cooling assembly includes stacked cages mounted to a PCB. A heat radiator also is mounted on the PCB. Cooling devices (e.g., heat pipes) are coupled to the heat radiator and at least one of the cages. In some embodiments, the cages may include a divider that extends beyond the cage and is coupled to at least one of the cooling devices outside the cage. In some embodiments, the cooling devices extend into the cage and may be coupled together.

First claim

What is claimed is:

1. An assembly for cooling an optical transceiver, comprising:
an optical transceiver cage having a first side wall, a second side wall, a back wall, and a vertical divider, the vertical divider extending from the first side wall to the second side wall;
a first thermally conductive device having a first end and a second end, wherein the first end of the first thermally conductive device is coupled to the first side wall of the optical transceiver cage;
a second thermally conductive device having a first end and a second end, wherein the first end of the second thermally conductive device is coupled to the second side wall of the optical transceiver cage; and
a heat radiator spaced from the optical transceiver cage, wherein the second end of the first thermally conductive device is coupled to the heat radiator, and wherein the second end of the second thermally conductive device is coupled to the heat radiator.

2. The assembly of claim 1 , wherein the thermally conductive device is a heat pipe.

3. The assembly of claim 2 , wherein the heat pipe is a solid composition.

4. The assembly of claim 2 , wherein the heat pipe is partially solid and partially liquid.

5. The assembly of claim 1 , wherein the heat radiator is a fin radiator.

6. The assembly of claim 1 , wherein the heat radiator further comprises a first surface and a second surface opposite the first surface.

7. The assembly of claim 6 , wherein the second end of the first thermally conductive device is coupled to the first surface of the heat radiator and the second end of the second thermally conductive device is coupled to the second surface of the heat radiator.

8. The assembly of claim 1 , wherein the vertical divider extends outside the optical transceiver cage beyond the first side wall.

9. The assembly of claim 8 , wherein the first end of the first thermally conductive device is coupled to the vertical divider.

10. The assembly of claim 9 , wherein the vertical divider extends outside the optical transceiver cage beyond the second side wall.

11. The assembly of claim 10 , wherein the first end of the second thermally conductive device is coupled to the vertical divider.

12. An assembly for cooling an optical transceiver, comprising:
an optical transceiver cage having a first side wall, a second side wall, a back wall, and a vertical divider, the vertical divider extending from the first side wall to the second side wall;
a first thermally conductive device having a first end and a second end, wherein the first end of the first thermally conductive device is coupled to the back wall of the optical transceiver cage;
a second thermally conductive device having a first end and a second end, wherein the first end of the second thermally conductive device is coupled to the back wall of the optical transceiver cage; and
a heat radiator spaced from the optical transceiver cage, wherein the second end of the first thermally conductive device is coupled to the heat radiator, and wherein the second end of the second thermally conductive device is coupled to the heat radiator.

13. The assembly of claim 12 , wherein the first thermally conductive device extends through the back wall and is coupled to the vertical divider, and the second thermally conductive device extends through the back wall and is coupled to the vertical divider.

14. The assembly of claim 12 , wherein the thermally conductive device is a heat pipe.

15. The assembly of claim 14 , wherein the heat pipe is a solid composition.

16. The assembly of claim 15 , wherein the heat pipe is partially solid and partially liquid.

17. An assembly for cooling an optical transceiver, comprising:
a cage means for supporting and separating a plurality of optical transceivers;
a first thermally conductive means for conducting heat, the first thermally conductive means is coupled to the cage means;
a second thermally conductive means for conducting heat, the second thermally conductive means is coupled to the cage means;
a heat dissipation means for storing and dissipating heat, the heat dissipation means being spaced from the cage means, and wherein the first thermally conductive means is coupled to the heat dissipation means and wherein the second thermally conductive means is coupled to the heat dissipation means; and
a divider means within the cage means for separating the plurality of optical transceivers, wherein the first thermally conductive means extends into the cage means and is coupled to the divider means and the second thermally conductive means extends into the cage means and is coupled to the divider means.

18. The assembly of claim 17 , wherein the first thermally conductive means is coupled to the second thermally conductive means within the cage means.

Assignees

• Ciena Corp

Inventors

• Mack Bonnie Lynne

Classifications

• G02B6/4269 Primary

  with heat sinks or radiation fins · CPC title

• H01L2924/00

  Electricity · mapped topic

• F28F1/32

  the means having portions engaging further tubular elements · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H01L2924/0002

  Electricity · mapped topic