Leakage characterization for electronic circuit temperature monitoring

Patent metadata

Field	Value
Publication number	US-12535537-B2
Application number	US-202318188963-A
Country	US
Kind code	B2
Filing date	Mar 23, 2023
Priority date	Dec 3, 2019
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

First claim

What is claimed is:

1 . A method for designing an electronic system for temperature monitoring, the method comprising:
receiving design requirements for the electronic system; characterizing dielectric and adhesive materials that are candidates for use in the electronic system; choosing, from candidate dielectric and adhesive materials, dielectric and adhesive materials in accordance with the design requirements; designing a characterized dielectric to include chosen dielectric and adhesive materials; fabricating the characterized dielectric in accordance with a characterized dielectric design; and integrating the characterized dielectric into the electronic system by:
populating the electronic system with a plurality of heat-producing electronic devices; and
electrically interconnecting the characterized dielectric to a leakage measurement circuit.

2 . The method of claim 1 , wherein the characterized dielectric includes a dielectric layer of a PCB, a first face of the dielectric layer adjacent to a first conductive layer of the PCB, and an opposing face of the dielectric layer adjacent to a second conductive layer of the PCB.

3 . The method of claim 1 , wherein the characterized dielectric includes a dielectric layer of a flexible circuit, a first face of the dielectric layer adjacent to a first conductive layer of the flexible circuit, and an opposing face of the dielectric layer adjacent to a second conductive layer of the flexible circuit.

4 . The method of claim 3 , wherein integrating the characterized dielectric into the electronic system includes locating the flexible circuit adjacent to the plurality of heat-producing electronic devices.

5 . The method of claim 1 , wherein characterizing candidate dielectric layer and adhesive materials includes characterizing electrical leakage properties, including temperature-dependent electrical leakage variation, of the candidate dielectric and adhesive materials.

6 . The method of claim 1 , wherein the candidate dielectric and adhesive materials include materials selected from the group consisting of: a Fire Retardant (FR) laminate materials layer, a High Temperature (HT) laminate materials layer and an Adhesive-less/high-Performance (AP) laminate materials layer.

7 . The method of claim 1 , wherein the choosing of a dielectric material in accordance with the design requirements includes selecting a dielectric material having a temperature-dependent electrical leakage variation, over an operating temperature range, in accordance with the design requirements.

8 . The method of claim 1 , further comprising choosing, in accordance with the design requirements, a supplemental dielectric material, and wherein the designing of the characterized dielectric includes the dielectric material and the supplemental dielectric material.

9 . A method for designing an electronic system for temperature monitoring, the method comprising:
receiving design requirements for the electronic system, the design requirements including specified leakage characteristics for a characterized dielectric; characterizing dielectric and adhesive materials that are candidates for use in the electronic system; choosing, from candidate dielectric and adhesive materials, dielectric and adhesive materials in accordance with the specified leakage characteristics; and designing a characterized dielectric to include chosen dielectric and adhesive materials.

10 . The method of claim 9 , further comprising:
fabricating the characterized dielectric in accordance with a characterized dielectric design; and electrically interconnecting the characterized dielectric to a leakage measurement circuit.

11 . The method of claim 10 , wherein the leakage measurement circuit is configured to measure current leakage through the characterized dielectric and convert current measurement into a corresponding output voltage.

12 . The method of claim 11 , further comprising electrically connecting a response device to the leakage measurement circuit, the response device configured to initiate an action in response to the output voltage exceeding a voltage threshold.

13 . The method of claim 9 , wherein the characterized dielectric includes a dielectric layer of a PCB, a first face of the dielectric layer adjacent to a first conductive layer of the PCB, and an opposing face of the dielectric layer adjacent to a second conductive layer of the PCB.

Assignees

• IBM

Inventors

• Doyle Matthew
• Busby James
• Cohen Edward N
• Dangler John R
• Bartley Gerald
• Fisher Michael
• Higby Arthur
• Long David Clifford
• Jeanson Mark J
• Becker Darryl

Classifications

• H05K2201/012

  Flame-retardant; Preventing of inflammation · CPC title

• H05K7/20209

  Thermal management, e.g. fan control · CPC title

• H05K3/0005

  for designing circuits by computer · CPC title

• H05K1/0277

  Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence) · CPC title

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title