Resin composition and article made therefrom

US12534572B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12534572-B2
Application numberUS-202217881299-A
CountryUS
Kind codeB2
Filing dateAug 4, 2022
Priority dateJul 7, 2022
Publication dateJan 27, 2026
Grant dateJan 27, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resin composition includes 120 parts by weight of a vinyl group-containing polyphenylene ether resin, 5 parts by weight to 10 parts by weight of a compound of Formula (1), 15 parts by weight to 25 parts by weight of a compound of Formula (2), and 70 parts by weight to 110 parts by weight of an inorganic filler. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including difference rate of dissipation factor, gel time stability and stickiness.

First claim

Opening claim text (preview).

What is claimed is: 1 . A resin composition, comprising 120 parts by weight of a vinyl group-containing polyphenylene ether resin, 5 parts by weight to 10 parts by weight of a compound of Formula (1), 15 parts by weight to 25 parts by weight of a compound of Formula (2), and 70 parts by weight to 110 parts by weight of an inorganic filler, wherein X is —(CH 2 ) n CH 3 or —C(CH 3 )═CH 2 , and n is 13; wherein k is an integer of 1 to 10. 2 . The resin composition of claim 1 , wherein the vinyl group-containing polyphenylene ether resin comprises a vinylbenzyl group-containing biphenyl polyphenylene ether resin, a methacrylate group-containing polyphenylene ether resin or a combination thereof. 3 . The resin composition of claim 1 , wherein the inorganic filler comprises chemically synthesized silica, fused silica, boron nitride or a combination thereof. 4 . The resin composition of claim 1 , further comprising bis(vinylphenyl)ethane, maleimide resin, or a combination thereof. 5 . The resin composition of claim 1 , further comprising curing accelerator, flame retardant, polymerization inhibitor, solvent, coloring agent, toughening agent or a combination thereof. 6 . An article made from the resin composition of claim 1 , comprising a prepreg, a resin film, a laminate or a printed circuit board. 7 . The article of claim 6 , having a difference rate of dissipation factor of less than or equal to 4.10% calculated according to a dissipation factor as measured by reference to IPC-TM-650 2.5.5.13 at 10 GHz. 8 . The article of claim 6 , having a gel time stability calculated according to a gel time as measured by reference to IPC-TM-650 2.3.18 of less than or equal to 18 seconds. 9 . The article of claim 6 , characterized by passing a level 1 stickiness test.

Assignees

Inventors

Classifications

  • Binary compounds of nitrogen with boron · CPC title

  • End-capping · CPC title

  • containing nitrogen · CPC title

  • having more than two oxygen atoms in the ring · CPC title

  • Metal alcoholates {(metal enolates C08K5/0091)} · CPC title

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What does patent US12534572B2 cover?
A resin composition includes 120 parts by weight of a vinyl group-containing polyphenylene ether resin, 5 parts by weight to 10 parts by weight of a compound of Formula (1), 15 parts by weight to 25 parts by weight of a compound of Formula (2), and 70 parts by weight to 110 parts by weight of an inorganic filler. The resin composition may be used to make various articles, such as a prepreg, a r…
Who is the assignee on this patent?
Elite Material Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08K3/36. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 27 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).