Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same
US-2021355259-A1 · Nov 18, 2021 · US
US12534572B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12534572-B2 |
| Application number | US-202217881299-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 4, 2022 |
| Priority date | Jul 7, 2022 |
| Publication date | Jan 27, 2026 |
| Grant date | Jan 27, 2026 |
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A resin composition includes 120 parts by weight of a vinyl group-containing polyphenylene ether resin, 5 parts by weight to 10 parts by weight of a compound of Formula (1), 15 parts by weight to 25 parts by weight of a compound of Formula (2), and 70 parts by weight to 110 parts by weight of an inorganic filler. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including difference rate of dissipation factor, gel time stability and stickiness.
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What is claimed is: 1 . A resin composition, comprising 120 parts by weight of a vinyl group-containing polyphenylene ether resin, 5 parts by weight to 10 parts by weight of a compound of Formula (1), 15 parts by weight to 25 parts by weight of a compound of Formula (2), and 70 parts by weight to 110 parts by weight of an inorganic filler, wherein X is —(CH 2 ) n CH 3 or —C(CH 3 )═CH 2 , and n is 13; wherein k is an integer of 1 to 10. 2 . The resin composition of claim 1 , wherein the vinyl group-containing polyphenylene ether resin comprises a vinylbenzyl group-containing biphenyl polyphenylene ether resin, a methacrylate group-containing polyphenylene ether resin or a combination thereof. 3 . The resin composition of claim 1 , wherein the inorganic filler comprises chemically synthesized silica, fused silica, boron nitride or a combination thereof. 4 . The resin composition of claim 1 , further comprising bis(vinylphenyl)ethane, maleimide resin, or a combination thereof. 5 . The resin composition of claim 1 , further comprising curing accelerator, flame retardant, polymerization inhibitor, solvent, coloring agent, toughening agent or a combination thereof. 6 . An article made from the resin composition of claim 1 , comprising a prepreg, a resin film, a laminate or a printed circuit board. 7 . The article of claim 6 , having a difference rate of dissipation factor of less than or equal to 4.10% calculated according to a dissipation factor as measured by reference to IPC-TM-650 2.5.5.13 at 10 GHz. 8 . The article of claim 6 , having a gel time stability calculated according to a gel time as measured by reference to IPC-TM-650 2.3.18 of less than or equal to 18 seconds. 9 . The article of claim 6 , characterized by passing a level 1 stickiness test.
Binary compounds of nitrogen with boron · CPC title
End-capping · CPC title
containing nitrogen · CPC title
having more than two oxygen atoms in the ring · CPC title
Metal alcoholates {(metal enolates C08K5/0091)} · CPC title
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