Mold for forming solder distal tip for guidewire

US12533496B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12533496-B2
Application numberUS-202217685767-A
CountryUS
Kind codeB2
Filing dateMar 3, 2022
Priority dateOct 31, 2019
Publication dateJan 27, 2026
Grant dateJan 27, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.

First claim

Opening claim text (preview).

I claim: 1 . A method of making a mold for use in forming a solder joint on a guidewire, comprising: providing a mold; machining a cavity into a first mold section and a second mold section; machining the cavity into a micro-J shape for a distal end of the guidewire so that the cavity in the first mold section is a mirror image of the cavity in the second mold section; and wherein the cavity terminates at one end in an opening on an exterior portion of the mold, the opening being configured to receive the distal end of the guidewire and coils on the distal end of the guidewire. 2 . The method of claim 1 , wherein the first mold section has a first face and the second mold section has a second face, the first face and the second face being configured to be removably attached. 3 . The method of claim 2 , wherein the micro-J shape has a distal section, and further comprising machining angular grooves in the distal section of the micro-J shape. 4 . The method of claim 1 , wherein the opening has a diameter the same as the cavity and is configured to receive a guidewire with a diameter in the range of about 0.008 inches to about 0.035 inches. 5 . The method of claim 1 , wherein the mold is formed of a material able to withstand the temperature required to received molten solder. 6 . The method of claim 5 , wherein the material is a ceramic material. 7 . A method of making a mold for use in casting a pre-shaped solder distal tip on the distal end of a guidewire, comprising: providing a mold blank formed of a material able to withstand the temperature required to receive molten solder; machining a cavity of micro-J shape for a guidewire into the mold blank, the cavity terminating at one end in an opening on an exterior portion of the mold blank, the opening being configured to receive the distal end of the guidewire. 8 . The method of claim 7 , wherein the mold blank is a split mold having a first shell and a second shell with opposed faces that are machined to jointly produce the cavity of micro-J shape so that the cavity in the face of the first shell is a mirror image of the cavity in the face of the second shell. 9 . The method of claim 7 , wherein the opening has a diameter the same as the cavity and is configured to receive a guidewire with a diameter in the range of about 0.008 inches to about 0.035 inches. 10 . The method of claim 7 , wherein the material is a ceramic material. 11 . The method of claim 7 , further comprising machining a surface texture into a cavity wall of the micro-J shape cavity. 12 . The method of claim 11 , wherein the surface texture is machined into only a portion of the cavity wall. 13 . The method of claim 12 , wherein the portion of the cavity wall is adjacent to the opening.

Assignees

Inventors

Classifications

  • Coating by casting molten material on the substrate · CPC title

  • Wires · CPC title

  • Cooling, heat sink or heat shielding means · CPC title

  • for joining parts · CPC title

  • Pressure casting making use of mechanical pressure devices, e.g. cast-forging (B22D18/04 takes precedence) · CPC title

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Frequently asked questions

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What does patent US12533496B2 cover?
A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.
Who is the assignee on this patent?
Abbott Cardiovascular Systems Inc
What technology area does this patent fall under?
Primary CPC classification B21F15/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 27 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).