Substrate cleaning device and substrate processing device

Patent metadata

Field	Value
Publication number	US-12532694-B2
Application number	US-202217828001-A
Country	US
Kind code	B2
Filing date	May 30, 2022
Priority date	Jun 17, 2021
Publication date	Jan 20, 2026
Grant date	Jan 20, 2026

Abstract

The disclosure provides a substrate cleaning device and a substrate processing device capable of suppressing erroneous rotation detection of an optical sensor due to adhesion of droplets or mist. A substrate cleaning device includes a substrate cleaning part for cleaning a substrate, a drive roller for rotating the substrate, a driven roller rotated by the substrate, and a rotation detection part for detecting rotation of the driven roller. The rotation detection part includes a detected part provided on the driven roller, an optical sensor for detecting rotation of the detected part by irradiation with detection light, and a liquid filling part for filling an optical path forming space in which an optical path of the detection light is formed with a liquid having transmittance.

First claim

What is claimed is:

1 . A substrate cleaning device comprising:
a substrate cleaning part for cleaning a substrate; a drive roller for rotating the substrate; a driven roller rotated by the substrate; a bearing for supporting the driven roller; and a rotation detection part for detecting rotation of the driven roller, wherein the rotation detection part comprises:
a detected part provided on the driven roller;
an optical sensor for detecting rotation of the detected part by irradiation with detection light; and
a liquid filling part for filling an optical path forming space in which an optical path of the detection light is formed with a liquid having transmittance, wherein the liquid is supplied to the liquid filling part after passing through the bearing.

2 . The substrate cleaning device according to claim 1 , wherein the rotation detection part is disposed in a substrate cleaning tank in which the substrate is cleaned.

3 . The substrate cleaning device according to claim 1 , wherein the liquid filling part comprises a partition wall part for isolating the optical path forming space from an outside.

4 . The substrate cleaning device according to claim 1 , further comprising:
a liquid supply line for supplying the liquid to the liquid filling part; and a flow rate adjusting valve for adjusting a flow rate of the liquid supplied from the liquid supply line.

5 . The substrate cleaning device according to claim 1 , wherein the liquid filling part comprises a liquid supply port to which the liquid is supplied and a liquid discharge port for discharging the liquid above the optical path forming space.

6 . The substrate cleaning device according to claim 1 , wherein the liquid filling part comprises a liquid supply port to which the liquid is supplied above the optical path forming space and comprises a liquid discharge port for discharging the liquid below the optical path forming space.

7 . The substrate cleaning device according to claim 1 , wherein the liquid is pure water.

8 . The substrate cleaning device according to claim 1 , wherein the optical sensor is a transmissive optical fiber sensor or a reflective optical fiber sensor.

9 . The substrate cleaning device according to claim 1 , further comprising an urging part for urging the driven roller toward the substrate.

10 . A substrate processing device comprising:
a substrate polishing device for polishing a substrate; and the substrate cleaning device according to claim 1 for cleaning the substrate polished by the substrate polishing device.

Assignees

• Ebara Corp

Inventors

• Eto Yohei
• Miyazaki Mitsuru
• Nakano Hisajiro

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H10P72/0472

  comprising at least one polishing chamber · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title