Thermal imaging camera module configured for integration into a host system

Patent metadata

Field	Value
Publication number	US-12529604-B2
Application number	US-202318316986-A
Country	US
Kind code	B2
Filing date	May 12, 2023
Priority date	May 16, 2022
Publication date	Jan 20, 2026
Grant date	Jan 20, 2026

Abstract

Thermal cameras exist at price points and volume manufacturing suitable for practical consideration of integration of thermal camera modules into host electronic devices, including automobiles, PED's—smartphones, tablets, etc. However, individual thermal cameras require extensive unit-specific data to provision and operate each individual camera with acceptable performance. This along with non-standard electrical interfaces, are adoption barriers to host device manufacturers, for example, where some devices, including some PED's, have become bus-based platforms allowing for functional modules to be packaged into common PED's and operated by way of apps. Some modern PED's, for example, include standard high-speed data busses and low-speed control busses. Devices and methods are disclosed for delivering compatibility with standard internal interfaces and storing the camera module's unit-specific data in a memory element on the camera module. The data can be read out on the same data bus used for thermal camera image data, either by selection between stored data and video output or by simultaneous streaming on different virtual channels. In a particular embodiment the logic element may be configured to write per pixel runtime data such as bias voltages on a runtime per pixel basis to the FPA as the FPA operates by accessing the memory element from a starting point address, wherein the starting point address may be at least one of predetermined or set by a host controller, thereby allowing the FPA to operate without local processing resources or per pixel communication with the host controller.

First claim

What is claimed is:

1 . A thermal camera module (TCM) configured for integration as a functional module into a host system, the host system including at least one controller and at least one internal data interface for accommodating functional modules of various types into the host system, the TCM comprising:
at least one focal plane array (FPA) comprising a detector array and a read-out integrated circuit (ROIC), the ROIC comprising command and control input/outputs (I/O) and image frame data outputs; at least one memory element for storing data including at least one of provisioning and operational data for the FPA; and at least one control logic element, interfaced to ROIC command and control registers, an image frame data output of the ROIC, the at least one memory element, and the at least one internal data interface; wherein the control logic element is configured to, including in response to commands from a host controller on the at least one internal data interface, enable read/write access to the at least one memory element, read/write access to ROIC control registers, and read access to ROIC image frame data output; wherein the data stored in the memory element includes at least one of:
integration time,
biases,
row and column configuration, and
FPA configuration and identification; and
wherein the control logic element is configured to write one of biases or other runtime data on a per-pixel basis to the ROIC as the FPA is imaging by accessing the memory element from a starting point address, wherein the starting point address is at least one of predetermined or set by the host controller, thereby allowing the FPA to operate without per-pixel communication with the host controller during imaging.

2 . The TCM of claim 1 , wherein the TCM is configured to be mechanically and electrically plug-in compatible with an internal module format of the host system.

3 . The TCM of claim 1 , wherein the data stored in the memory element includes at least one of:
thermography calibration data; detector gain tables; ambient temperature induced drift bias correction data; display look up tables; bad pixel maps; lens correction data; and other factory calibration data.

4 . The TCM of claim 1 , wherein the at least one internal data interface comprises at least:
a low-speed data bus; and a high-speed data bus.

5 . The TCM of claim 4 , wherein the low-speed data bus supports bidirectional communication between the host controller and the control logic element, including one or more of the control logic element enabling the host controller to:
optionally read provisioning data from the memory element; read and write to the ROIC registers, including setting provisioning data into the ROIC registers; enable reading operational data from the memory element on the high-speed data bus; enable running the ROIC; and select acquisition of FPA video data on the high-speed data bus.

6 . The TCM of claim 5 , wherein communication between the host controller and the TCM on the high-speed data bus is unidirectional.

7 . The TCM of claim 6 , wherein the low-speed data bus is I 2 C.

8 . The TCM of claim 7 , wherein the high-speed data bus is one of MIPI CSI-2 or MIPI CPI.

9 . The TCM of claim 8 , wherein bus supplied checksum and line/frame count data that is provided with the image frame data is available for integrity verification of the FPA.

10 . The TCM of claim 1 , wherein the memory element comprises non-volatile memory.

11 . The TCM of claim 10 , wherein the non-volatile memory comprises flash memory.

12 . The TCM of claim 1 , wherein the memory element comprises a QSPI memory element and the TEM control logic element comprises a QSPI controller master.

13 . The TCM of claim 12 , wherein the QSPI memory element comprises at least one of Flash or SPI RAM.

14 . The TCM of claim 1 , wherein the ROIC comprises an ROIC clock whose frequency is set by programmable fuses at the time of manufacture whereby the clock frequency cannot be changed after the fuses are burned.

15 . The TCM of claim 1 , wherein the starting point address is selected from a plurality of starting point addresses based at least in part on an ambient temperature at the FPA.

16 . A method of operating a thermal camera module (TCM), comprising a focal plane array (FPA) comprising a detector array and a read-out integrated circuit (ROIC), a control logic element, and a memory element, the TCM configured for integration as a functional module into a host system, the host system including at least one controller and at least one internal data interface for accommodating functional modules of various types into the host system, the method comprising, by the control logic element, including in response to commands from a host controller on the at least one internal data interface:
enabling read/write access to the memory element; enabling read/write access to ROIC control registers; enabling ROIC run time access to the memory element during image acquisition; and enabling read access to FPA image frame output, wherein the logic element is configured to enable writing one of biases or other runtime data on a per-pixel basis to the ROIC as the FPA is imaging by accessing the memory element from a starting point address, wherein the starting point address is at least one of predetermined or set by the host controller, thereby allowing the FPA to operate without per-pixel communication with the host controller during imaging.

17 . The method of claim 16 , wherein the TCM is configured to be mechanically and electrically plug-in compatible with an internal module format of the host system.

18 . The method of claim 16 , wherein the memory element stores at least one of:
integration time; bias voltages; row and column configuration; and FPA configuration and identification.

19 . The method of claim 16 , wherein the memory element stores at least one of:
thermography calibration data; detector gain tables; ambient temperature induced drift bias correction data; display look up tables; bad pixel maps; lens correction data; and other factory calibration data.

20 . The method of claim 16 , wherein the at least one internal data interface comprises at least a low-speed data bus and a high-speed data bus.

21 . The method of claim 20 wherein the low-speed data bus supports bidirectional communication between the host controller and the and the control logic element, including one or more of the control logic element enabling the host controller to:
optionally read provisioning data from the memory element;
read and write to the ROIC registers, including setting provisioning data into the registers;
enable reading operational data from the memory element on the high-speed data bus;
enable running the ROIC; and
select acquisition of FPA video data on the high-speed data bus.

22 . The method of claim 21 , wherein communication between the host controller and the TCM on the high-speed data bus is unidirectional.

23 . The method of claim 20 , wherein the control logic element is configured to enable writing at least one of calibration or run time data to the high-speed bus simultaneously with video data.

24 . The method of claim 16 , further comprising using bus supplied checksum and line/frame count data provided with the image frame data for integrity verification of the FPA.

Assignees

• Seek Thermal Inc

Inventors

• Araki Leonard
• Mininni Lars
• Parrish William J

Classifications

• G01J2005/0077

  Imaging · CPC title

• G01J5/80

  Calibration (using comparison with reference sources G01J5/52) · CPC title

• G01J5/026

  Control of working procedures of a pyrometer, other than calibration; Bandwidth calculation; Gain control · CPC title

• H04N17/002

  for television cameras · CPC title

• H04N23/23

  from thermal infrared radiation · CPC title