Compliant stops for mems inertial device drive PLL stability

Patent metadata

Field	Value
Publication number	US-12529562-B2
Application number	US-202318221923-A
Country	US
Kind code	B2
Filing date	Jul 14, 2023
Priority date	Jul 14, 2023
Publication date	Jan 20, 2026
Grant date	Jan 20, 2026

Abstract

A MEMS inertial sensor device, method of operation, and fabrication process are described with a MEMS inertial sensor, drive actuation unit, drive measurement unit, and PLL circuit coupled together in operational engagement, where the MEMS inertial sensor includes a substrate, a proof mass positioned in spaced apart relationship above the substrate, a proof mass suspension member connected on a first end to the proof mass and connected on a second end to an anchor fixed to the substrate to enable the proof mass to laterally oscillate over the surface of the substrate, and a compliant stop structure positioned in relation to the proof mass suspension member to physically engage with lateral oscillating movement of the proof mass suspension member past a desired stroke travel distance without physically preventing lateral oscillating movement of the proof mass, thereby stiffening a spring stiffness measure of the proof mass suspension member.

First claim

What is claimed is:

1 . A MEMS inertial sensor device, comprising:
a MEMS inertial sensor; a drive actuation unit coupled to the MEMS inertial sensor; a drive measurement unit coupled to MEMS inertial sensor; and a phase-look loop (PLL) circuit coupled to the MEMS inertial sensor; wherein the MEMS inertial sensor comprises: a substrate, a proof mass positioned in spaced apart relationship above a surface of the substrate, a proof mass suspension member connected on a first end to the proof mass and connected on a second end to an anchor fixed to the substrate to enable the proof mass to move in a lateral oscillating movement over the surface of the substrate, an over-travel hard stop structure fixed to the substrate and positioned in relation to the proof mass at a first lateral spacing distance to physically prevent lateral oscillating movement of the proof mass past a specified over-travel distance, and a compliant stop structure positioned in relation to the proof mass suspension member to physically engage with lateral oscillating movement of the proof mass suspension member past a desired stroke travel distance without physically preventing lateral oscillating movement of the proof mass, thereby stiffening a spring stiffness measure of the proof mass suspension member, where the proof mass suspension member comprises an interior folded beam spring structure formed within an opening of the proof mass and having an internal truss connecting the proof mass over a plurality of cantilevered beam extension elements to the anchor fixed to the substrate, and where the compliant stop structure comprises one or more soft stop structures integrated with the proof mass suspension member to define a clearance distance between the interior folded beam spring structure and the proof mass so that the soft stop structure physically engages with lateral oscillating movement of the proof mass suspension member without physically preventing lateral oscillating movement of the proof mass, where the one or more soft stop structures comprise a pair of soft stop structures integrated with the internal truss and extending laterally from opposed ends of the truss to define the clearance distance between the interior folded beam spring structure and the proof mass.

2 . The MEMS inertial sensor device of claim 1 , where the pair of soft stop structures each comprise a rounded or curved region extending laterally from the internal truss.

3 . The MEMS inertial sensor device of claim 1 , where the compliant stop structure is positioned in relation to the proof mass suspension member to smooth abrupt frequency changes in the lateral oscillating movement of the proof mass caused by external forces applied to the MEMS inertial sensor device.

4 . The MEMS inertial sensor device of claim 1 , where the MEMS inertial sensor comprises a MEMS gyroscope sensor.

5 . The MEMS inertial sensor device of claim 1 , where the MEMS inertial sensor comprises a MEMS resonant accelerator sensor.

6 . A MEMS inertial transducer device coupled to a phase-look loop (PLL) circuit, wherein the MEMS inertial transducer device comprises:
a MEMS inertial transducer; a drive actuation unit coupled to the MEMS inertial transducer; a drive measurement unit coupled to MEMS inertial transducer; and the phase-look loop (PLL) circuit; wherein the MEMS inertial transducer comprises: a substrate; a proof mass positioned in spaced apart relationship above a surface of the substrate; one or more substrate-anchored compliant members coupled to said proof mass and configured to enable the proof mass to laterally oscillate over the surface of the substrate with an oscillation frequency; a substrate-anchored over-travel stop structure positioned in relation to the proof mass at a first spacing distance to physically prevent lateral movement of the proof mass past a specified over-travel distance; and one or more compliant stop structures positioned in relation to the one or more substrate-anchored compliant members to physically engage with lateral oscillating movement of the one or more substrate-anchored compliant members past a desired stroke travel distance without physically preventing lateral oscillating movement of the proof mass, thereby stiffening the one or more substrate-anchored compliant members to smooth changes in the oscillation frequency by the proof mass, where the one or more substrate-anchored compliant members comprise an interior folded beam spring structure formed within an opening of the proof mass and having an internal truss connecting the proof mass over a plurality of cantilevered beam extension elements to an anchor fixed to the substrate, and where the one or more compliant stop structures comprise one or more soft stop structures integrated with the one or more substrate-anchored compliant members to define a clearance distance between the interior folded beam spring structure and the proof mass so that the one or more compliant stop structures physically engage with lateral oscillating movement of the one or more substrate-anchored compliant members without physically preventing lateral oscillating movement of the proof mass, where the one or more soft stop structures comprise a pair of soft stop structures integrated with the internal truss and extending laterally from opposed ends of the truss to define the clearance distance between the interior folded beam spring structure and the proof mass.

7 . The MEMS inertial transducer device of claim 6 , where the pair of soft stop structures comprise first and second compliant stop structures positioned in relation to the one or more substrate-anchored compliant members to physically engage with lateral oscillating movement of the one or more substrate-anchored compliant members past a desired stroke travel distance without physically preventing lateral oscillating movement of the proof mass.

8 . The MEMS inertial transducer device of claim 7 , where the first and second compliant stop structures are positioned on opposite sides of the one or more substrate-anchored compliant members.

9 . The MEMS inertial transducer device of claim 6 , where the MEMS inertial transducer comprises a MEMS gyroscope sensor.

10 . The MEMS inertial transducer device of claim 6 , where the MEMS inertial transducer comprises a MEMS resonant accelerator sensor.

Assignees

• Nxp Usa Inc

Inventors

• Soliman Mostafa
• Geisberger Aaron A
• Kniffin Margaret Leslie
• Sridhar Raghavendra N

Classifications

• G01P15/10

  by vibratory strings · CPC title

• G01P2015/0871

  using stopper structures for limiting the travel of the seismic mass · CPC title

• G01P2015/0882

  for providing damping of vibrations · CPC title

• G01C19/5607

  using vibrating tuning forks (double-ended tuning forks using planar vibrating masses suspended at opposite ends G01C19/5719) · CPC title

• G01P15/08 Primary

  with conversion into electric or magnetic values · CPC title