Backplane and glass-based circuit board

Patent metadata

Field	Value
Publication number	US-12525568-B2
Application number	US-202418648939-A
Country	US
Kind code	B2
Filing date	Apr 29, 2024
Priority date	Sep 30, 2019
Publication date	Jan 13, 2026
Grant date	Jan 13, 2026

Abstract

A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line includes a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion includes a plurality of connection sub-portions, each of the connection sub-portions includes at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.

First claim

The invention claimed is:

1 . A backplane, comprising:
a base substrate; a plurality of light-emitting units, arranged in an array on the base substrate, wherein each of the plurality of the light-emitting units comprises at least one light-emitting sub-unit; the at least one light-emitting sub-unit comprises a connection line and a plurality of light-emitting diode chips electrically connected with the connection line; the plurality of the light-emitting diode chips are located on a side of the connection line away from the base substrate; in each of the light-emitting sub-units, the connection line comprises a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion comprises a plurality of connection sub-portions, each of the connection sub-portions comprise at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair, wherein the plurality of the connection sub-portions comprise a first connection sub-portion and a second connection sub-portion, the first connection sub-portion comprises a rectangular central portion as well as a first edge portion and a second edge portion respectively located on both sides of a first central line of the rectangular central portion, and along an extension direction of the first connection sub-portion, sizes of the first edge portion and the second edge portion are both smaller than a size of the central portion, the first connection sub-portion extends along a first direction parallel to the base substrate; the first connection sub-portion comprises a connection region, an orthographic projection of a part of the first sub-portion where the connection region on the base substrate is located forms a shape of notch, and the electrical contact point of the first connection sub-portion is located on a side of the connection region facing the notch.

2 . The backplane according to claim 1 , wherein
the electrical contact point of the second connection sub-portion and the electrical contact point of an adjacent first connection sub-portion located in the connection region constitute the electrical contact point pair.

3 . The backplane according to claim 2 , wherein, in each of the light-emitting sub-units, the first connection portion comprises a first input end; the second connection portion comprises a second input end; and the first connection portion and the second connection portion respectively comprise an electrical contact point,
both ends of the third connection portion respectively comprise an electrical contact point; the electrical contact point at one end of the third connection portion and the electrical contact point of the first connection portion constitute an electrical contact point pair; the electrical contact point at the other end of the third connection portion and the electrical contact point of the second connection portion constitute an electrical contact point pair.

4 . The backplane according to claim 3 , wherein the light-emitting sub-unit comprises a plurality of first connection sub-portion rows extending along a first direction and arranged in a second direction, the first direction intersect with the second direction; each of the first connection sub-portion rows comprises at least one first connection sub-portion; two end portions of the second connection sub-portion are respectively located in notches opposite to each other at end portions of adjacent first connection sub-portion rows, so that the adjacent first connection sub-portion rows are connected with each other by the second connection sub-portion and the light-emitting diode chips.

5 . The backplane according to claim 4 , wherein, except the connection regions located at both ends of the first connection sub-portion row, the first connection sub-portion row has a substantially equal size in the second direction at respective positions in the first direction.

6 . The backplane according to claim 4 , wherein the first connection portion comprises a first protrusion portion; the first protrusion portion is located within the notch at the connection region of the first connection sub-portion row connected with the first protrusion portion by the light-emitting diode chip; the second connection portion comprises a second protrusion portion; and the second protrusion portion is located within the notch at the connection region of the first connection sub-portion row connected with the second protrusion portion by the light-emitting diode chip.

7 . The backplane according to claim 4 , wherein each of the first connection sub-portion rows comprises a plurality of the first connection sub-portions; and a connection region of one first connection sub-portion of adjacent first connection sub-portions is located in the notch of the other first connection sub-portion of the adjacent first connection sub-portions, so that the adjacent connection regions are electrically connected by the light-emitting diode chip.

8 . The backplane according to claim 5 , wherein each of the first connection sub-portion rows comprises a first end portion and a second end portion; the first end portions of the plurality of the connection sub-portion rows are aligned in the first direction or the second direction; the second end portions of the plurality of the first connection sub-portion rows are aligned in the first direction or the second direction.

9 . The backplane according to claim 8 , wherein the plurality of the first connection sub-portion rows and the second connection sub-portions are integrally connected in a square wave shape.

10 . The backplane according to claim 4 , wherein the second connection sub-portions connected with a same first connection sub-portion row by the light-emitting diode chips are respectively located on both sides of the same first connection sub-portion row in the second direction and are respectively located at both ends of the same first connection sub-portion row in the first direction.

11 . The backplane according to claim 1 , wherein each of the electrical contact point pairs is respectively connected with an anode and a cathode of one of the plurality of the light-emitting diode chips in one-to-one correspondence, the two connection portions constituting the electrical contact point pair have a space therebetween, and an orthogonal projection of the light-emitting diode chip on the base substrate at least partially overlaps with an orthogonal projection of the space on the base substrate.

12 . The backplane according to claim 1 , wherein the at least one light-emitting sub-unit comprises a plurality of light-emitting sub-units; and the plurality of the light-emitting sub-units of each of the light-emitting units share the first connection portion and the second connection portion, so that the plurality of the light-emitting sub-units are connected in parallel.

13 . The backplane according to claim 1 , further comprising:
a reflective layer, located between the connection line and the light-emitting diode chip; a plurality of wirings parallel to each other, located on a side of the connection line facing the base substrate, and including a plurality of first wirings and a plurality of second wirings; a first insulation layer between the plurality of the wirings parallel to each other and the connection line, a second insulation layer between the reflective layer and the connection line, to isolate the reflective layer and the connection line from each other, a white glue layer on a side of the reflecti

Assignees

• Beijing Boe Display Tech Co
• Boe Technology Group Co Ltd

Inventors

• Su Wengang
• Hao Wei
• Sun Haiwei
• Shi Lingyun
• Wang Feifei
• Shi Rui

Classifications

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W72/50 Primary

  Bond wires · CPC title

• F21S43/195

  Details of lamp holders, terminals or connectors · CPC title