Backplane and glass-based circuit board

Patent metadata

Field	Value
Publication number	US-11469359-B2
Application number	US-201916961439-A
Country	US
Kind code	B2
Filing date	Sep 30, 2019
Priority date	Sep 30, 2019
Publication date	Oct 11, 2022
Grant date	Oct 11, 2022

Abstract

A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units (110) includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line (200) and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The light-emitting diode chips (300) in the at least one light-emitting sub-unit are connected in series.

First claim

The invention claimed is:

1. A backplane, comprising:
a base substrate;
a plurality of light-emitting units, arranged in an array on the base substrate,
wherein each of the plurality of the light-emitting units comprises at least one light-emitting sub-unit; the at least one light-emitting sub-unit comprises a connection line and a plurality of light-emitting diode chips connected with the connection line; the plurality of the light-emitting diode chips are located on a side of the connection line away from the base substrate; and the plurality of the light-emitting diode chips in the at least one light-emitting sub-unit are connected in series,
wherein in each of the light-emitting sub-units, the connection line comprises a first connection portion and a second connection portion; the first connection portion comprises a first input end; the second connection portion comprises a second input end; and the first connection portion and the second connection portion respectively comprise an electrical contact point;
the connection line further comprises a third connection portion; both ends of the third connection portion respectively comprise an electrical contact point; the electrical contact point at one end of the third connection portion and the electrical contact point of the first connection portion constitute an electrical contact point pair; the electrical contact point at the other end of the third connection portion and the electrical contact point of the second connection portion constitute an electrical contact point pair; and each of the electrical contact point pairs is respectively connected with an anode and a cathode of one of the plurality of the light-emitting diode chips in one-to-one correspondence,
wherein in each of the light-emitting sub-units, the third connection portion comprises a plurality of connection sub-portions; both ends of each of the connection sub-portions respectively comprise an electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair; each of the electrical contact point pairs is respectively connected with an anode and a cathode of one of the plurality of the light-emitting diode chips in one-to-one correspondence; and the plurality of the connection sub-portions are connected in series by the light-emitting diode chips,
wherein the plurality of the connection sub-portions comprise a first connection sub-portion and a second connection sub-portion, the first connection sub-portion extends along a first direction parallel to the base substrate;
the first connection sub-portion has a shape in which notches are formed at two corners of a substantially rectangular shape that are opposite to each other in a diagonal direction; the first connection sub-portion comprises connection regions corresponding to the notches; and the electrical contact point of the first connection sub-portion is located on a side of the connection region facing the notch,
the second connection sub-portion extends along the second direction parallel to the base substrate and intersecting with the first direction; the electrical contact points of the second connection sub-portion are located at both end portions of the second connection sub-portion in the second direction.

2. The backplane according to claim 1 , wherein the light-emitting sub-unit comprises a plurality of first connection sub-portion rows extending along the first direction and arranged in the second direction; each of the first connection sub-portion rows comprises at least one first connection sub-portion; two end portions of the second connection sub-portion are respectively located in notches opposite to each other at end portions of adjacent first connection sub-portion rows, so that the adjacent first connection sub-portion rows are connected with each other by the second connection sub-portion and the light-emitting diode chips,
the second connection sub-portions connected with a same first connection sub-portion row by the light-emitting diode chips are respectively located on both sides of the same first connection sub-portion row in the second direction and are respectively located at both ends of the same first connection sub-portion row in the first direction.

3. The backplane according to claim 2 , wherein each of the first connection sub-portion rows comprises a plurality of the first connection sub-portions; and a connection region of one first connection sub-portion of adjacent first connection sub-portions is located in the notch of the other first connection sub-portion of the adjacent first connection sub-portions, so that the adjacent connection regions are electrically connected by the light-emitting diode chip.

4. The backplane according to claim 2 , wherein each of the first connection sub-portion rows comprises a first end portion and a second end portion; the first end portions of the plurality of the connection sub-portion rows are aligned in the second direction; the second end portions of the plurality of the first connection sub-portion rows are aligned in the second direction; and the plurality of the first connection sub-portion rows and the second connection sub-portions are integrally connected in a square wave shape.

5. The backplane according to claim 2 , wherein the first connection portion comprises a first protrusion portion; the first protrusion portion is located within the notch at the connection region of the first connection sub-portion row connected with the first protrusion portion by the light-emitting diode chip; the second connection portion comprises a second protrusion portion; and the second protrusion portion is located within the notch at the connection region of the first connection sub-portion row connected with the second protrusion portion by the light-emitting diode chip.

6. The backplane according to claim 1 , wherein the at least one light-emitting sub-unit comprises a plurality of light-emitting sub-units; and the plurality of the light-emitting sub-units of each of the light-emitting units share the first connection portion and the second connection portion, so that the plurality of the light-emitting sub-units are connected in parallel.

7. The backplane according to claim 1 , further comprising:
a reflective layer, located between the connection line and the light-emitting diode chip.

8. The backplane according to claim 7 , further comprising:
a plurality of wirings parallel to each other, located on a side of the connection line facing the base substrate, and including a plurality of first wirings and a plurality of second wirings;
a first insulation layer between the plurality of the wirings parallel to each other and the connection line;
a second insulation layer between the reflective layer and the connection line, to isolate the reflective layer and the connection line from each other,
wherein the first input end of the connection line is connected with the first wiring, and the second input end of the connection line is connected with the second wiring.

9. The backplane according to claim 8 , wherein a thickness of the wiring is greater than a thickness of the connection line, and widths of both of the first connection portion and the second connection portion are greater than a width of the wiring.

10. A glass-based circuit board, comprising:
a glass substrate; and
a plurality of connection line units, arranged in an array on the glass substrate;
wherein, each of the connection line units comprises at least one connection line sub-unit; the connection line sub-unit comprises a plurality of electrical contact point pairs; each of the electrical contact point pairs is configur

Assignees

• Beijing Boe Display Tech Co
• Boe Technology Group Co Ltd

Inventors

• Su Wengang
• Hao Wei
• Sun Haiwei
• Shi Lingyun
• Wang Feifei
• Shi Rui

Classifications

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W72/50 Primary

  Bond wires · CPC title

• F21S43/195

  Details of lamp holders, terminals or connectors · CPC title