Semiconductor device and method of forming clip bond having multiple bond line thicknesses

Patent metadata

Field	Value
Publication number	US-12525567-B2
Application number	US-202117644143-A
Country	US
Kind code	B2
Filing date	Dec 14, 2021
Priority date	Dec 31, 2020
Publication date	Jan 13, 2026
Grant date	Jan 13, 2026

Abstract

A semiconductor device has a leadframe and a first electrical component disposed over the leadframe. A clip bond is disposed over the first electrical component. The clip bond has a plurality of recesses each having a different depth. A first recess is proximate to a first distal end of the first electrical component, and a second recess is proximate to a second distal end of the first electrical component opposite the first distal end of the first electrical component. A depth of the first recess is different from a depth of the second recess. A third recess is over a surface of the first electrical component. A depth of the third recess is different from the depth of the first recess and the depth of the second recess. A second electrical component is disposed over the leadframe. The clip bond extends over the second electrical component.

First claim

What is claimed:

1 . A semiconductor device, comprising:
a leadframe; a first electrical component disposed over the leadframe; and a clip bond disposed over the first electrical component, wherein the clip bond includes a first recess proximate to a first distal end of the first electrical component and a second recess proximate to a second distal end of the first electrical component opposite the first distal end of the first electrical component, wherein a depth of the first recess in a range of 0.215-0.235 mm measured vertically from a top surface of the first electrical component to a first bottom surface of the clip bond directly above the first distal end of the first electrical component is greater than a depth of the second recess in a range of 0.170-0.190 mm measured vertically from the top surface of the first electrical component to a second bottom surface of the clip bond directly above the second distal end of the first electrical component.

2 . The semiconductor device of claim 1 , further including a second electrical component disposed over the leadframe, wherein the clip bond extends over the second electrical component.

3 . The semiconductor device of claim 1 , further including a conductive paste deposited between the clip bond and a surface of the first electrical component, wherein the conductive paste is at least partially disposed within the first recess or second recess.

4 . A semiconductor device, comprising:
a leadframe; a first electrical component disposed over the leadframe; and a clip bond disposed over the first electrical component, wherein a first thickness of the clip bond in a range of 0.002-0.022 mm proximate to directly above a first distal end of the first electrical component is less than a second thickness of the clip bond in a range of 0.047-0.067 mm proximate to directly above a second distal end of the first electrical component opposite the first distal end of the first electrical component.

5 . The semiconductor device of claim 4 , wherein the clip bond includes a third thickness over a surface of the first electrical component, wherein the third thickness is different from the first thickness and second thickness.

6 . The semiconductor device of claim 5 , further including a second electrical component disposed over the leadframe, wherein the clip bond extends over the second electrical component.

7 . The semiconductor device of claim 6 , wherein the clip bond includes a fourth thickness over a surface of the second electrical component, wherein the fourth thickness is different from the first thickness and second thickness.

8 . The semiconductor device of claim 4 , further including a conductive paste deposited between the clip bond and a surface of the first electrical component.

9 . The semiconductor device of claim 4 , further including an encapsulant deposited over the clip bond and first electrical component.

10 . A method of making a semiconductor device, comprising:
providing a leadframe; disposing a first electrical component over the leadframe; and disposing a clip bond over the first electrical component by forming a first recess proximate to a first distal end of the first electrical component, and forming a second recess proximate to a second distal end of the first electrical component opposite the first distal end of the first electrical component, wherein a depth of the first recess in a range of 0.215-0.235 mm measured vertically from a top surface of the first electrical component to a first bottom surface of the clip bond directly above the first distal end of the first electrical component is greater than a depth of the second recess in a range of 0.170-0.190 mm measured vertically from the top surface of the first electrical component to a second bottom surface of the clip bond directly above the second distal end of the first electrical component.

11 . The method of claim 10 , further including disposing a second electrical component disposed over the leadframe, wherein the clip bond extends over the second electrical component.

12 . The method of claim 10 , further including depositing a conductive paste between the clip bond and a surface of the first electrical component, wherein the conductive paste is at least partially disposed within the first recess or second recess.

13 . The method of claim 10 , further including depositing an encapsulant over the clip bond and first electrical component.

14 . The method of claim 11 , wherein a first thickness of the clip bond directly above the first distal end of the first electrical component is less than a second thickness of the clip bond directly above the second distal end of the first electrical component opposite the first distal end of the first electrical component.

15 . The method of claim 14 , wherein a third thickness of the clip bond directly above the first electrical component is different from the first thickness and second thickness and a fourth thickness of the clip bond directly above the second electrical component is different from the first thickness and second thickness.

16 . The semiconductor device of claim 2 , wherein a first thickness of the clip bond directly above the first distal end of the first electrical component is less than a second thickness of the clip bond directly above the second distal end of the first electrical component opposite the first distal end of the first electrical component.

17 . The semiconductor device of claim 16 , wherein a third thickness of the clip bond directly above the first electrical component is different from the first thickness and second thickness and a fourth thickness of the clip bond directly above the second electrical component is different from the first thickness and second thickness.

Assignees

• Utac Headquarters Pte Ltd

Inventors

• Choi Hyung Mook
• Hortaleza Edgardo R

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W72/60

  Strap connectors, e.g. thick copper clips for grounding of power devices · CPC title

• H10W72/851

  Dispositions of multiple connectors or interconnections · CPC title

• H10W90/767

  between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink · CPC title

• H10W90/763

  between laterally-adjacent chips · CPC title