Plasma uniformity control using a pulsed magnetic field

Patent metadata

Field	Value
Publication number	US-12525458-B2
Application number	US-202118010453-A
Country	US
Kind code	B2
Filing date	Nov 2, 2021
Priority date	Nov 20, 2020
Publication date	Jan 13, 2026
Grant date	Jan 13, 2026

Abstract

In some implementations, a method for performing a plasma process in a chamber is provided, including: supplying a process gas to the chamber; applying pulsed RF power to the process gas in the chamber, the pulsed RF power being provided at a predefined frequency, wherein the applying of the pulsed RF power to the process gas generates a plasma in the chamber; during the applying of the RF power, applying a pulsed DC current to a magnetic coil that is disposed over the chamber, wherein the pulsed DC current is provided at the predefined frequency.

First claim

The invention claimed is:

1 . A method for performing a plasma process in a chamber, comprising:
supplying a process gas to the chamber; applying RF power to the process gas to generate a plasma in the chamber; and during the applying of the RF power, sequentially pulsing DC current through a plurality of concentric magnetic coils disposed over the chamber, to generate a radial magnetic field wave in the chamber, wherein sequentially pulsing the DC current includes synchronizing a frequency of the pulsing of the DC current provided to the plurality of concentric magnetic coils so as to pulse at a frequency of the RF power.

2 . The method of claim 1 , wherein the radial magnetic field wave sweeps radially outward from a center region of the chamber to a peripheral region of the chamber.

3 . The method of claim 1 , wherein sequentially pulsing DC current is defined by providing a DC current pulse to each of the magnetic coils consecutively in order, from an innermost magnetic coil to an outermost magnetic coil, with a time delay between initiating the DC current pulse to adjacent ones of the magnetic coils.

4 . The method of claim 1 , wherein the plurality of concentric magnetic coils are substantially oriented along a same plane.

5 . The method of claim 1 , wherein the sequentially pulsing DC current is cycled to repeatedly generate radial magnetic field waves in the chamber.

6 . The method of claim 1 , wherein the sequentially pulsing DC current through the plurality of concentric magnetic coils includes providing pulsed DC current to each of the magnetic coils by respective power supplies.

7 . The method of claim 1 , wherein the radial magnetic field wave reduces localized accumulation of charged species in the plasma.

8 . The method of claim 7 , wherein the reducing localized accumulation of charged species in the plasma further reduces non-uniformity of an etch process that is performed by the plasma.

9 . The method of claim 1 , wherein each cycle of the RF power is defined by a first state at a first power level and a second state at a second power level, wherein the second power level is less than the first power level.

10 . The method of claim 9 , wherein pulsing the DC current further includes synchronizing the DC current to the first state of the RF power,
wherein synchronizing includes substantially simultaneously initiating the DC current to the magnetic coil with initiation of the first state of the RF power, and substantially simultaneously terminating the DC current to the magnetic coil with termination of the first state of the RF power.

11 . The method of claim 9 , wherein pulsing the DC current further includes synchronizing the DC current to the second state of the RF power,
wherein synchronizing includes substantially simultaneously initiating the DC current to the magnetic coil with initiation of the second state of the RF power, and substantially simultaneously terminating the DC current to the magnetic coil with termination of the second state of the RF power.

Assignees

• Lam Res Corp

Inventors

• Marakhtanov Alexei
• Ji Bing
• Lucchesi Ken
• Holland John

Classifications

• H10P50/242 Primary

  of Group IV materials · CPC title

• H01J2237/3343

  Problems associated with etching · CPC title

• H01J37/3266

  Magnetic control means · CPC title

• H01J37/32146

  Amplitude modulation, includes pulsing · CPC title

• H01J2237/334

  Etching · CPC title