System and method for electroforming a component

Patent metadata

Field	Value
Publication number	US-12522943-B2
Application number	US-202217991349-A
Country	US
Kind code	B2
Filing date	Nov 21, 2022
Priority date	Nov 21, 2022
Publication date	Jan 13, 2026
Grant date	Jan 13, 2026

Abstract

A system and method of inspecting a thickness of metal on an electroformed component. The system capable of scanning the electroformed component with a sensor. The system including a computer for generating a scan data set indicative of the thickness of the metal on the electroformed component. A controller for instructing an anode to deposit additional metal on the electroformed component where the thickness is less than a target thickness.

First claim

What is claimed is:

1 . A system for electroforming a desired component, comprising:
an electroforming reservoir containing an electrolytic solution, an anode, and a cathode; a mandrel located within the electroforming reservoir and electrically connected to the cathode, and the mandrel having a coating surface on which metal is deposited to define a component; a first robotic arm moveable within the electroforming reservoir and having a sensor for scanning the component; and a computer in communication with the sensor, the anode, and the cathode, the computer comprising: a module comprising instructions defining a plurality of predetermined locations of the desired component, the module configured to:
A) electroform a first metal layer of the desired component,
B) without removing the desired component from the electroforming reservoir, position the first robotic arm with respect to a first of the plurality of predetermined locations, defining a first predetermined location,
C) scan the first metal layer of the desired component with the sensor at the first predetermined location,
D) determine a thickness of the first metal layer at the first predetermined location based on the scan,
E) compare the determined thickness to a first target thickness,
F) identify the first predetermined location as a target location if the thickness is less than the first target thickness; and
G) deposit a second metal layer at the target location with the anode.

2 . The system of claim 1 , wherein the sensor is immersed in the electrolytic solution.

3 . The system of claim 1 , the module further configured to:
H) repeat steps B)-G) for each of the plurality of predetermined locations.

4 . The system of claim 1 , wherein the first target thickness at the first predetermined location is different from a second target thickness at a second of the plurality of predetermined locations.

5 . The system of claim 1 , the module further configured to:
H) repeat steps B)-G) until the comparison at step E) determines that the determined thickness at the first predetermined location reaches the target thickness.

6 . The system of claim 5 , the module further configured to:
I) repeat steps B)-H) for each of the plurality of predetermined locations.

7 . The system of claim 1 , wherein the anode is coupled to a second robotic arm.

8 . The system of claim 7 , wherein the second robotic arm is configured to position the anode proximate to the first predetermined location to deposit the second metal layer only at the target location in step G).

9 . The system of claim 1 , wherein the sensor includes an ultrasound transducer.

10 . The system of claim 9 , wherein the sensor transmits and receives an ultrasonic wave when scanning.

11 . The system of claim 1 , wherein the sensor is movable for perpendicular alignment with the first metal layer.

12 . The system of claim 11 , wherein the sensor is one of a single element sensor or a phased array sensor.

Assignees

• Unison Ind Llc

Inventors

• KUO Pei-Hsin
• Nieters Edward James

Classifications

• C25D1/00 Primary

  Electroforming · CPC title

• C25D1/003

  3D structures, e.g. superposed patterned layers · CPC title

• C25D17/10

  Electrodes {, e.g. composition, counter electrode} · CPC title

• C25D17/002

  Cell separation, e.g. membranes, diaphragms · CPC title

• C25D21/12 Primary

  Process control or regulation (controlling or regulating in general G05) · CPC title