Optoelectronic devices and methods of making the same
US-11462688-B2 · Oct 4, 2022 · US
US12520652B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12520652-B2 |
| Application number | US-202218277157-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 11, 2022 |
| Priority date | Feb 12, 2021 |
| Publication date | Jan 6, 2026 |
| Grant date | Jan 6, 2026 |
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Photovoltaic devices having contact layers are described herein. Devices, intermediate structures, and methods for making multilayer contacts for perovskite photovoltaic devices are provided. Embodiments include back contacts for N-I-P structures.
Opening claim text (preview).
What is claimed is: 1 . A photovoltaic device comprising: a perovskite absorber layer, a hole transport layer over the perovskite absorber layer, and a back contact in contact with the hole transport material, wherein the back contact comprises: a conductor sublayer, comprising at least one metal; a barrier sublayer between the hole transport layer and the conductor sublayer, wherein the barrier sublayer comprises at least one of a transition metal nitride or a metal oxynitride; and a buffer sublayer, wherein the buffer sublayer is adjacent to the hole transport layer, the buffer sublayer comprises at least one of a metal oxide or a metal oxynitride; the buffer sublayer is disposed between the hole transport layer and the barrier sublayer; the buffer sublayer has a thickness less than 25 nm, and wherein the buffer sublayer and the barrier sublayer are made from different materials. 2 . The photovoltaic device of claim 1 , wherein the buffer sublayer has a work function in a range from 5 eV to 10 eV. 3 . The photovoltaic device of claim 1 , wherein: the buffer sublayer is deposited by evaporation; and the buffer sublayer comprises a metal oxynitride. 4 . The photovoltaic device of claim 1 , wherein the buffer sublayer comprises at least one of: molybdenum oxide (MoO x ), bismuth telluride (BiTe 3 ), vanadium oxide (VO x ), tungsten oxide (WO x ), titanium oxide (TiO x ), copper oxide (CuO x ), or zinc oxide (ZnO x ). 5 . The photovoltaic device of claim 1 , wherein the buffer sublayer has a thickness of 0.5 nm to 25 nm in a contiguous film over the hole transport layer. 6 . The photovoltaic device of claim 1 , wherein: the conductor sublayer is a metal layer, comprising aluminum, copper, or combinations thereof; and the conductor sublayer has a thickness of 100-2000 nm. 7 . The photovoltaic device of claim 1 , wherein: the barrier sublayer is adjacent to the buffer sublayer, and the barrier sublayer has a thickness in a range of 1-50 nm. 8 . The photovoltaic device of claim 1 , wherein: the barrier sublayer is adjacent to the buffer sublayer; the barrier sublayer has a thickness in a range of 1-50 nm; and the barrier sublayer comprises at least one of: molybdenum nitride (MoN x ), aluminum oxide (Al 2 O 3 ), silicon oxide (SiO 2 ), silicon oxynitride (SiNO x ), titanium nitride (TiN x ), chromium nitride (CrN x ), tin oxide (SnO x ), tin-gallium oxide (GaOSn), aluminum nitride (AIN), nickel nitride (Ni 3 N), titanium nitride (TiN), tungsten nitride (WN x ), selenium nitride (SeN x ), tantalum nitride (TaN), vanadium nitride (VN), molybdenum oxynitride (MoN x O y ), or zirconium oxynitride (ZrO x N y ). 9 . The photovoltaic device of claim 1 , further comprising a protective sublayer disposed over and adjacent to the conductor sublayer, wherein: the protective sublayer has a thickness of 100-500 nm; and the protective sublayer comprises chromium. 10 . The photovoltaic device of claim 1 , wherein the hole transport layer comprises at least one of PTAA, P3HT, P3HT-COOH, PEDOT: PSS, TTF-1, SGT-407, Spiro-OMeTAD, NiOx, CuSCN, or Cul. 11 . A back contact for a perovskite photovoltaic device, having a perovskite absorber layer and a hole transport layer, the back contact comprising: a buffer sublayer disposed adjacent to the hole transport layer, wherein the buffer sublayer has a thickness in a range of 1-30 nm, and the buffer sublayer comprises a metal oxide or a metal oxynitride; a barrier sublayer disposed adjacent to the buffer sublayer, wherein the barrier sublayer has a thickness in a range of 5-50 nm, and the barrier sublayer comprises a transition metal nitride or a metal oxynitride; and a conductor sublayer disposed over the buffer sublayer, wherein the conductor sublayer has a thickness in a range of 100-3500 nm, and the conductor sublayer comprises at least one material selected from: aluminum, copper or silver, wherein the buffer sublayer and the barrier sublayer are made from different materials. 12 . The back contact layer of claim 11 , wherein the buffer sublayer has a thickness in a range of 5 nm to 25 nm, and the barrier sublayer has a thickness in a range of 5 nm to 25 nm. 13 . The back contact layer of claim 11 , further comprising a protective sublayer, wherein: the protective sublayer comprises at least one of chromium or nickel; the protective sublayer is disposed over and adjacent to the conductor sublayer; and the protective sublayer has a thickness in a range of 100-2000 nm. 14 . The back contact layer of claim 11 , wherein: the buffer sublayer comprises at least one of: molybdenum oxide, bismuth telluride, or vanadium oxide; and the barrier sublayer comprises at least one of: molybdenum nitride, tin oxide, silicon oxide, silicon oxynitride, titanium nitride, or chromium nitride. 15 . The photovoltaic device of claim 1 , wherein the hole transport layer comprises a carbazole-based self-assembled monolayer. 16 . The photovoltaic device of claim 15 , wherein the carbazole-based self-assembled monolayer comprises at least one of: 2PACz, MeO-2PACz, or Me-4PACz.
Organic perovskites; Hybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3 · CPC title
Layers having high hole mobility, e.g. hole-transporting layers or electron-blocking layers · CPC title
comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers · CPC title
Terminals, e.g. bond pads · CPC title
Photovoltaic [PV] devices · CPC title
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