Determining and regulating a focal position of a processing beam

US12508673B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12508673-B2
Application numberUS-201916381059-A
CountryUS
Kind codeB2
Filing dateApr 11, 2019
Priority dateOct 13, 2016
Publication dateDec 30, 2025
Grant dateDec 30, 2025

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The invention relates to a method for determining a focal position of a machining beam, in particular a laser beam, relative to a workpiece when machining the workpiece using the machining beam, having the following steps: receiving at least one spatially resolved image of a workpiece region to be monitored, said region comprising the cut edges of a cut gap formed during the machining process on the upper face of the workpiece, ascertaining a gap width of the cut gap on the upper face of the workpiece using the cut edges in the at least one spatially resolved image, and determining the focal position of the machining beam relative to the workpiece using the ascertained gap width. The invention also relates to a corresponding device.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method of regulating a focal position of a processing beam relative to a workpiece during cutting of the workpiece with the processing beam, wherein the cutting forms a cutting gap, the method comprising: illuminating an area of the workpiece with a first illuminating beam from a first illumination source and with a second illuminating beam from a second illumination source, wherein the first illuminating beam is aligned coaxially with the processing beam, and the second illuminating beam is directed across a direction of the cutting gap; recording at least one spatially resolved image of an area of the workpiece that is to be monitored, wherein the at least one image shows cut edges of said cutting gap formed on a top side of the workpiece during the cutting; determining, based on the cut edges in the at least one spatially resolved image, a top gap width of said cutting gap on the top side of the workpiece; measuring a minimal gap width of said cutting gap in the thickness direction of the workpiece, wherein the minimal gap width defines a minimal value of a gap width of said cutting gap in the thickness direction of the workpiece; determining the focal position of the processing beam relative to the workpiece, based on (i) the top gap width of said cutting gap on the top side of the workpiece, (ii) the minimal gap width of said same cutting gap as in (i), and (iii) a beam caustic of the processing beam; and changing the focal position of the processing beam relative to the workpiece until the focal position matches a target focal position; wherein the gap width of said cutting gap varies in the thickness direction of the workpiece; and wherein determining the top gap width on the top side of the workpiece and measuring the minimal gap width comprises: determining the respective gap widths from at least two images, wherein determining the respective gap widths comprises directing the first and second illuminating beams at the top side of the workpiece in recording the second image and directing no illuminating beam at the top side of the workpiece in recording the first image; and subtracting the first image from the second image pixel by pixel. 2 . The method of claim 1 , wherein the first illuminating beam provides areal illumination and the second illuminating beam provides structured illumination. 3 . The method of claim 1 , wherein measuring the minimal gap width comprises determining, based on process emissions from the cutting, the minimal gap width of said cutting gap. 4 . The method of claim 1 , wherein recording the at least one image of the area to be monitored comprises recording at wavelengths in the infrared wavelength range. 5 . The method of claim 1 , wherein recording the at least one image of the area to be monitored comprises recording the at least one image of the area coaxially with a beam axis of the processing beam. 6 . The method of claim 1 , wherein determining the top gap width on the top side of the workpiece and measuring the minimal gap width is performed on the at least one image. 7 . The method of claim 1 , wherein determining the top gap width on the top side of the workpiece and measuring the minimal gap width comprises determining the respective gap widths from at least three images, and wherein determining the respective gap widths comprises directing no illuminating beam at the top side of the workpiece when recording a third image. 8 . The method of claim 1 , wherein the first illumination source provides the first illuminating beam having a wavelength of 660 nm, 808 nm, 915 nm, or 980 nm.

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12508673B2 cover?
The invention relates to a method for determining a focal position of a machining beam, in particular a laser beam, relative to a workpiece when machining the workpiece using the machining beam, having the following steps: receiving at least one spatially resolved image of a workpiece region to be monitored, said region comprising the cut edges of a cut gap formed during the machining process o…
Who is the assignee on this patent?
Trumpf Werkzeugmaschinen Gmbh Co Kg, Trumpf Werkzeugmaschinen Se Co Kg
What technology area does this patent fall under?
Primary CPC classification B23K26/38. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 30 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).