Method for monitoring and controlling a laser cutting process

Patent metadata

Field	Value
Publication number	US-10058953-B2
Application number	US-201715419190-A
Country	US
Kind code	B2
Filing date	Jan 30, 2017
Priority date	Feb 7, 2011
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

The present disclosure relates to a device for monitoring and for controlling a laser cutting process on a workpiece, and a method of using the same. The device includes an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, in which the region of the workpiece to be monitored includes a region of interaction of a laser beam with the workpiece, and an evaluation apparatus for detecting material boundaries of the workpiece using the captured image. The evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two of the detected material boundaries, the region of interaction, or combinations thereof.

First claim

What is claimed is:

1. A method for monitoring and for controlling a laser cutting process on a workpiece, the method comprising:
capturing, by an image capturing apparatus, an image of a region of the workpiece to be monitored,
detecting, by an evaluation apparatus, material boundaries of the workpiece using the captured image, the material boundaries including edges of a first gap and edges of a second gap cut in the workpiece during the laser cutting process, wherein the second gap does not run parallel to the first gap,
determining, by the evaluation apparatus, at least one characteristic value of the laser cutting process based on a geometric relationship between at least two detected material boundaries, the at least one characteristic value including a first gap center of the first gap and a second gap center of the second gap, and
determining, by the evaluation apparatus, a position of a tool center point of the laser cutting process both in a x direction and in a y direction in a plane parallel to the workpiece, wherein determining the positon of the tool center point in the x direction is based on the first gap center and wherein determining the positon of the tool center point in the y direction is based on the second gap center.

2. The method according to claim 1 , further comprising:
determining, by the evaluation apparatus, a geometric relationship between the tool center point and at least one detected material boundary, and
switching, by a control apparatus, a laser beam on or off as a function of the determined geometric relationship.

3. The method of claim 2 , further comprising:
determining, by the evaluation apparatus, a geometric relationship between the tool center point and a gap center of a further gap cut in the workpiece in a previous laser cutting process, and
switching, by the control apparatus, the laser beam on or off when the gap center of the further gap cut is reached by the tool center point.

4. The method of claim 1 , further comprising:
determining, by the evaluation apparatus, a geometric relationship between the tool center point and at least one detected edge of the workpiece, and
switching, by a control apparatus, a laser beam on or off when the at least one detected edge is reached by the tool center point.

5. The method of claim 1 , wherein the region of the workpiece to be monitored comprises a region of interaction of a laser beam with the workpiece.

Assignees

• Trumpf Werkzeugmaschinen Gmbh Co Kg

Inventors

• Hesse Tim
• Schindhelm David

Classifications

• B23K26/032 Primary

  using optical means · CPC title

• B23K31/125

  Weld quality monitoring · CPC title

• B23K26/38

  by boring or cutting · CPC title