Assisted thermo-optic phase shifters

Patent metadata

Field	Value
Publication number	US-12504653-B2
Application number	US-202318201583-A
Country	US
Kind code	B2
Filing date	May 24, 2023
Priority date	May 24, 2023
Publication date	Dec 23, 2025
Grant date	Dec 23, 2025

Abstract

Structures for a thermo-optic phase shifter and methods of forming a thermo-optic phase shifter. The structure comprises a semiconductor substrate, and a heater including a first resistive heating element, a second resistive heating element, and a slab layer connecting the first resistive heating element to the second resistive heating element. The first resistive heating element and the second resistive heating element have a first thickness, and the slab layer has a second thickness that is less than the first thickness. The structure further comprises a waveguide core including a portion that is laterally positioned between the first resistive heating element and the second resistive heating element. The slab layer of the heater is disposed between the portion of the waveguide core and the semiconductor substrate.

First claim

What is claimed is:

1 . A structure for a thermo-optic phase shifter, the structure comprising:
a semiconductor substrate; a heater including a first resistive heating element, a second resistive heating element, and a slab layer connecting the first resistive heating element to the second resistive heating element, the first resistive heating element and the second resistive heating element having a first thickness, and the slab layer having a second thickness that is less than the first thickness; and a first waveguide core including a first portion that is laterally positioned between the first resistive heating element and the second resistive heating element, wherein the slab layer of the heater is disposed between the first portion of the first waveguide core and the semiconductor substrate.

2 . The structure of claim 1 wherein the heater further comprises a ridge disposed on the slab layer between the first resistive heating element and the second resistive heating element.

3 . The structure of claim 2 wherein the ridge is positioned beneath the first portion of the first waveguide core.

4 . The structure of claim 2 wherein the ridge, the slab layer, the first resistive heating element, and the second resistive heating element comprise silicon, and the first waveguide core comprises silicon nitride.

5 . The structure of claim 2 further comprising:
a dielectric layer over the heater,
wherein the first waveguide core is disposed on the dielectric layer, and the dielectric layer includes a portion between the first portion of the first waveguide core and the ridge of the heater.

6 . The structure of claim 5 wherein the dielectric layer comprises a first material, and the slab layer, the ridge, the first resistive heating element, and the second resistive heating element comprise a second material having a higher coefficient of thermal conductivity than the first material.

7 . The structure of claim 6 wherein the first material is silicon dioxide.

8 . The structure of claim 2 wherein the ridge includes a first tapered section and a second tapered section, and the first tapered section and the second tapered section terminate opposite ends of the ridge.

9 . The structure of claim 2 wherein the ridge is centered beneath the first portion of the first waveguide core.

10 . The structure of claim 2 wherein the ridge has the first thickness.

11 . The structure of claim 1 further comprising:
a dielectric layer over the heater,
wherein the first waveguide core is disposed on the dielectric layer, and the dielectric layer including a first portion between the first portion of the first waveguide core and the slab layer of the heater.

12 . The structure of claim 11 wherein the dielectric layer comprises a first material, and the slab layer, the first resistive heating element, and the second resistive heating element comprise a second material having a higher coefficient of thermal conductivity than the first material.

13 . The structure of claim 11 wherein the dielectric layer includes a second portion between the first portion of the first waveguide core and the first resistive heating element, and the dielectric layer includes a second portion between the first portion of the first waveguide core and the second resistive heating element.

14 . The structure of claim 1 wherein the first resistive heating element and the second resistive heating element comprise a metal silicide.

15 . The structure of claim 1 further comprising:
a second waveguide core connected in parallel to the first waveguide core.

16 . The structure of claim 1 wherein the first portion of the first waveguide core defines a first delay region, the first waveguide core includes a second portion, and further comprising:
a second waveguide core including a first portion that defines a second delay region and a second portion that is positioned adjacent to the second portion of the first waveguide core to define a coupling region.

17 . The structure of claim 1 wherein the first waveguide core is positioned equidistant from the first resistive heating element and the second resistive heating element.

18 . The structure of claim 1 further comprising:
an undercut in the semiconductor substrate beneath the slab layer of the heater; and
a dielectric layer disposed between the undercut and the heater.

19 . A structure for a thermo-optic phase shifter, the structure comprising:
a semiconductor substrate; a heater including a first resistive heating element, a second resistive heating element, and a slab layer connecting the first resistive heating element to the second resistive heating element, the first resistive heating element and the second resistive heating element having a first thickness, and the slab layer having a second thickness that is less than the first thickness; and a waveguide core including a portion that is laterally positioned between the first resistive heating element and the second resistive heating element, wherein the slab layer of the heater is disposed between the portion of the waveguide core and the semiconductor substrate, the slab layer, the first resistive heating element, and the second resistive heating element comprise silicon, and the waveguide core comprises silicon nitride.

20 . A method of forming a structure for a thermo-optic phase shifter, the method comprising:
forming a heater including a first resistive heating element, a second resistive heating element, and a slab layer connecting the first resistive heating element to the second resistive heating element, wherein the first resistive heating element and the second resistive heating element have a first thickness, and the slab layer has a second thickness that is less than the first thickness; and forming a waveguide core including a portion that is laterally positioned between the first resistive heating element and the second resistive heating element, wherein the slab layer of the heater is disposed between the portion of the waveguide core and a semiconductor substrate.

Assignees

• Globalfoundries Us Inc

Inventors

• Chandran Sujith
• Bian Yusheng
• Lee Won Suk

Classifications

• G02F2203/50

  Phase-only modulation · CPC title

• G02F1/0113

  Glass-based, e.g. silica-based, optical waveguides · CPC title

• G02F1/025

  in an optical waveguide structure (G02F1/017, {G02F1/2257} take precedence) · CPC title

• G02F1/0102

  Constructional details, not otherwise provided for in this subclass · CPC title

• G02F1/0147 Primary

  based on thermo-optic effects (G02F1/132 takes precedence) · CPC title