Semiconductor light-emitting element supply device and supply method

Patent metadata

Field	Value
Publication number	US-12500212-B2
Application number	US-202017783731-A
Country	US
Kind code	B2
Filing date	Jan 8, 2020
Priority date	Dec 13, 2019
Publication date	Dec 16, 2025
Grant date	Dec 16, 2025

Abstract

A semiconductor light-emitting element supply device according to an embodiment of the present invention supplies semiconductor light-emitting elements in a fluid chamber in which self-assembly occurs, the semdconductor light-emitting element supply device comprising: a tray disposed in the fluid chamber; a transfer unit which includes a magnet and a magnet accommodating part for accommodating the magnet and which transfers the semiconductor light-emitting elements by using magnetic force; a supply unit disposed above the tray to supply the transferred semiconductor light-emitting elements to the tray; and a control unit for controlling operations of the tray, the transfer unit and the supply unit, wherein the control unit controls the position of the magnet accommodated in the magnet accommodating part so that the semiconductor light-emitting elements are adhered on one surface of the magnet accommodating part or the adhered semiconductor light-emittng elements are separated from the one surface of the magnet accommodating part.

First claim

The invention claimed is:

1 . An apparatus for supplying a semiconductor light emitting diode among semiconductor light emitting diodes that are supplied in a fluid chamber to perform a self-assembly process for the semiconductor light emitting diodes, the apparatus comprising:
a tray disposed in the fluid chamber; a transferor including a magnet and a magnet receiver, which receives the magnet, to transfer the semiconductor light emitting diodes using magnetic force; a supplier disposed at an upper portion of the tray to supply the semiconductor light emitting diodes to the tray; and a controller configured to control driving of the tray, the transferor, and the supplier, wherein the controller is configured to:
adjust a position of the magnet received in the magnet receiver, so that the semiconductor light emitting diodes are adsorbed on one surface of the magnet receiver or the adsorbed semiconductor light emitting diodes are separated from the one surface of the magnet receiver,
wherein the magnet is driven independently from the magnet receiver in a state of being received in the magnet receiver, and
wherein the magnet is driven in an extending direction of the magnet receiver.

2 . The apparatus of claim 1 , wherein the magnet receiver is formed to extend in one direction, and
wherein the controller moves the magnet in an extension direction of the magnet receiver.

3 . The apparatus of claim 1 , wherein the controller is configured to bring the magnet into the one surface of the magnet receiver, so that the semiconductor light emitting diodes are adsorbed on the one surface of the magnet receiver.

4 . The apparatus of claim 1 , wherein the supplier includes:
a housing which includes a first opening allowing the transferor to enter or exit, and a second opening facing the first opening and disposed to be adjacent to the tray.

5 . The apparatus of claim 4 , wherein the housing extends in a direction in which the transferor enters or exits, and has a width narrowed toward the second opening from a position in an extension direction of the housing.

6 . The apparatus of claim 4 , wherein the controller is configured to:
supply the semiconductor light emitting diodes to the tray by separating the adsorbed semiconductor light emitting diodes from the one surface of the magnet receiver while moving the transferor and the supplier along a path, after positioning the transferor in the housing, in which the semiconductor light emitting diodes are adsorbed on the one surface of the transferor.

7 . The apparatus of claim 6 , wherein the controller is configured to:
further move the magnet in a direction away from the one surface of the magnet receiver, while moving the transferor and the supplier.

8 . The apparatus of claim 1 , wherein the supplier includes:
a plurality of housings, and wherein the plurality of housings are arranged in a row in any one direction of an extension direction of the tray.

9 . The apparatus of claim 1 , wherein the transferor includes a plurality of magnets and a plurality of magnet receivers.

Assignees

• Lg Electronics Inc

Inventors

• Shin Yongil
• Kim Dohee
• Yang Dohwan

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10H20/01

  Manufacture or treatment · CPC title

• H10H20/85

  Packages · CPC title