Power half-bridge module, power inverter, and method for producing a power half-bridge module

Patent metadata

Field	Value
Publication number	US-12500211-B2
Application number	US-202218575910-A
Country	US
Kind code	B2
Filing date	Jun 27, 2022
Priority date	Jul 1, 2021
Publication date	Dec 16, 2025
Grant date	Dec 16, 2025

Abstract

A power half-bridge module may include: a busbar carrier with insulation embedding a first busbar with two longitudinal sections; a semiconductor carrier with a second busbar and a third busbar in a row in the longitudinal direction of the busbar carrier; a first semiconductor switch with a lower-side load-current contact area on the second busbar; and a second semiconductor switch with a lower-side load-current contact area on the third busbar. The first busbar has a contact area on the first section and a second contact area on the second section. The busbar carrier has a recess at the height of the second section and extending from one surface to another. The semiconductor carrier is arranged on the second surface of the busbar carrier so both switches protrude into the recess. The second switch has an upper-side load-current contact area electrically connected to the second contact area of the first busbar.

First claim

What is claimed is:

1 . A power half-bridge module comprising:
a busbar carrier including an electrically insulating insulation material embedding a first busbar with a first longitudinal section and a second longitudinal section adjoining the first longitudinal section in the longitudinal direction of the busbar carrier; wherein the first busbar has a first exposed contact area on the first longitudinal section and a second exposed contact area on the second longitudinal section and to the side of a first surface of the busbar carrier; wherein the busbar carrier has a first recess located at the height of the second longitudinal section) and extending from the first surface to a second surface of the busbar carrier facing away from the first surface; a semiconductor carrier with a second busbar and a third busbar in a row in the longitudinal direction of the busbar carrier; a first semiconductor switch with a lower-side load-current contact area arranged on a contact area of the second busbar; and a second semiconductor switch with a lower-side load-current contact area arranged on a contact area of the third busbar; wherein the semiconductor carrier is arranged on the second surface of the busbar carrier so the first and second semiconductor switches protrude into the first recess; wherein the second semiconductor switch has an upper-side load-current contact area electrically connected to the second contact area of the first busbar.

2 . The power half-bridge module as claimed in claim 1 , wherein the second longitudinal section partially or fully surrounds the first recess.

3 . The power half-bridge module as claimed in claim 1 , wherein the second longitudinal section has two limb regions spread apart on either side of the first recess and extending in the longitudinal direction.

4 . The power half-bridge module as claimed in claim 3 , wherein the two limb regions of the second longitudinal section are on either side of the first recess symmetrically to one another about the longitudinal axis of the first busbar.

5 . The power half-bridge module as claimed in claim 3 , wherein the second contact area of the first busbar is arranged spread apart on the two limb regions.

6 . The power half-bridge module as claimed in claim 5 , wherein the second contact area of the first busbar on the two limb regions are symmetric in relation to one another about the first recess.

7 . The power half-bridge module as claimed in claim 1 , wherein the second longitudinal section has a greater layer thickness than the first longitudinal section.

8 . The power half-bridge module as claimed in claim 1 , wherein:
the busbar carrier has a first mounting region on the first surface, and a first control circuit for actuating the first semiconductor switch or part of the first control circuit mounted on the first mounting region; wherein the first semiconductor switch has a upper-side control-signal contact area electrically connected to the first control circuit or to the part of the first control circuit, respectively.

9 . The power half-bridge module as claimed in claim 8 , wherein the first mounting region is electrically insulated from the first busbar by the insulation material of the busbar carrier.

10 . The power half-bridge module as claimed in claim 9 , wherein, the first mounting region comprises a printed circuit board.

11 . The power half-bridge module as claimed in claim 9 , wherein the first mounting region is cast, overmolded, or encapsulated by the insulation material.

12 . The power half-bridge module as claimed in claim 1 , wherein:
the busbar carrier has a second mounting region on the first surface, and a second control circuit or part of the second control circuit for actuating the second semiconductor switch mounted on the second mounting region; wherein the second semiconductor switch has an upper-side control-signal contact area electrically connected to the second control circuit or to the part of the second control circuit, respectively.

13 . The power half-bridge module as claimed in claim 1 , wherein the busbar carrier comprises a printed circuit board.

14 . The power half-bridge module as claimed in claim 1 , wherein:
the busbar carrier has a second recess located at the height of the second longitudinal section and extending from the first surface to the second surface of the busbar carrier; and the semiconductor carrier has an RC snubber arranged on the contact area of the second busbar, the RC snubber physically and electrically connected to the second busbar and protruding into the second recess.

15 . The power half-bridge module as claimed in claim 14 , wherein the second recess is located between the first longitudinal section and the first recess.

16 . The power half-bridge module as claimed in claim 14 , wherein: the first busbar has a third exposed contact area on the second longitudinal section and to the side of the first surface of the busbar carrier; wherein the resistor-capacitor (RC) snubber is electrically connected to the third contact area.

17 . The power half-bridge module as claimed in claim 1 , further comprising
a fourth busbar embedded in the insulation material of the busbar carrier with an exposed contact area to the side of the second surface of the busbar carrier; wherein the fourth busbar and the first longitudinal section overlap one another and are electrically insulated from one another by the insulation material of the busbar carrier; wherein the second busbar by way of the exposed contact area is arranged on the contact area of the fourth busbar and is physically and electrically connected to the fourth busbar.

18 . The power half-bridge module as claimed in claim 17 , wherein the fourth busbar lies at least in part directly on the second busbar and is physically connected to and electrically and thermally contacted with the second busbar.

19 . The power half-bridge module as claimed in claim 18 , wherein the fourth busbar is soldered or sintered or adhesively bonded or welded directly on the second busbar.

20 . The power half-bridge module as claimed in claim 1 , further comprising
a fifth busbar embedded in the insulation material of the busbar carrier and having an exposed contact area to the side of the second surface of the busbar carrier; wherein the third busbar by way of the exposed contact area is arranged on the contact area of the fifth busbar and is physically and electrically connected to the fifth busbar.

21 . The power half-bridge module as claimed in claim 20 , wherein the fifth busbar lies at least in part directly on the third busbar and is physically connected to and electrically and thermally contacted with the third busbar.

22 . The power half-bridge module as claimed in claim 21 , wherein the fifth busbar is soldered or sintered or adhesively bonded or welded directly on the third busbar.

23 . The power half-bridge module as claimed in claim 1 , wherein:
the semiconductor carrier has an insulation layer; the second busbar by way of the side facing away from the first semiconductor switch is arranged on the insulation layer and is physically and thermally connected to the insulation layer; and the third busbar by way of the side facing away from the second semiconductor switch is arranged on the insulation layer and is physically and thermally connected to the insulation layer.

24 . The power half-bridge mo

Assignees

• Vitesco Technologies Germany Gmbh

Inventors

• Hövermann Markus
• Haber Michael
• Krasselt Peter
• Metzler Martin
• Ehrmann Martin

Classifications

• H10W90/764

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W72/871

  Bond wires and strap connectors · CPC title

• H10W72/691

  Bond pads specially adapted therefor · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title