Multilayer electronic component including side margin portion

Patent metadata

Field	Value
Publication number	US-12500036-B2
Application number	US-202318387659-A
Country	US
Kind code	B2
Filing date	Nov 7, 2023
Priority date	Dec 21, 2022
Publication date	Dec 16, 2025
Grant date	Dec 16, 2025

Abstract

A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes, and first to sixth surfaces; external electrodes disposed on the third and fourth surfaces of the body, respectively; and side margin portions disposed on the fifth and sixth surfaces of the body, respectively, wherein a Ba/Ti molar ratio of the side margin portion satisfies greater than 1.025 and less than 1.035, and is higher than a Ba/Ti molar ratio of the capacitance forming portion, wherein the number of moles of Mg based on 100 moles of Ti included in the side margin portion is greater than 1.0 mole and less than 2.0 moles, and wherein the number of moles of Sn based on 100 moles of Ti included in the side margin portion is 0.01 moles or more and less than 5.0 moles.

First claim

What is claimed is:

1 . A multilayer electronic component, comprising:
a body including a capacitance forming portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and first and second surfaces of the body opposing each other in the first direction, third and fourth surfaces of the body connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces of the body connected to the first to fourth surfaces and opposing each other in a third direction; external electrodes disposed on the third and fourth surfaces of the body, respectively; and side margin portions disposed on the fifth and sixth surfaces of the body, respectively, wherein a Ba/Ti molar ratio of the side margin portion satisfies greater than 1.025 and less than 1.035, and is higher than a Ba/Ti molar ratio of the capacitance forming portion, wherein a number of moles of Mg based on 100 moles of Ti included in the side margin portion is greater than 1.0 mole and less than 2.0 moles, wherein a number of moles of Sn based on 100 moles of Ti included in the side margin portion is 0.01 moles or more and less than 5.0 moles, and wherein a size standard deviation of the average size of dielectric grains included in the boundary surface portion is 100 nm or less.

2 . The multilayer electronic component of claim 1 , wherein the Ba/Ti molar ratio of the side margin portion is 1.028 or more and 1.032 or less.

3 . The multilayer electronic component of claim 1 , wherein the number of moles of Mg based on 100 moles of Ti included in the side margin portion is 1.3 moles or more and 1.7 moles or less.

4 . The multilayer electronic component of claim 1 , wherein the number of moles of Sn based on 100 moles of Ti included in the side margin portion is greater than 1.0 mole.

5 . The multilayer electronic component of claim 4 , wherein the number of moles of Sn based on 100 moles of Ti included in the side margin portion is 2.5 moles or more and 3.5 moles or less.

6 . The multilayer electronic component of claim 1 , wherein, in the side margin portion, an average size of dielectric grains included in a boundary surface portion adjacent to the capacitance forming portion is 160 nm or more and 180 nm or less.

7 . The multilayer electronic component of claim 6 , wherein the average size of dielectric grains included in the boundary surface portion is smaller than an average size of dielectric grains included in the capacitance forming portion.

8 . The multilayer electronic component of claim 1 , wherein, in the side margin portion, porosity of a boundary surface portion, which is a region adjacent to the capacitance forming portion, is greater than 0.01% and less than 1.30%.

9 . The multilayer electronic component of claim 1 , wherein the number of moles of Mg based on 100 moles of Ti included in the side margin portion is higher than a number of moles of Mg based on 100 moles of Ti included in the capacitance forming portion.

10 . The multilayer electronic component of claim 1 , wherein the number of moles of Sn to 100 moles of Ti included in the side margin portion is higher than a number of moles of Sn based on 100 moles of Ti included in the capacitance forming portion.

11 . The multilayer electronic component of claim 1 , wherein the body includes a plurality of the dielectric layers, and an average size of at least one of the plurality of dielectric layers in the first direction is 0.4 μm or less.

12 . The multilayer electronic component of claim 1 , wherein an average size of at least one of the plurality of internal electrodes in the first direction is 0.4 μm or less.

13 . The multilayer electronic component of claim 1 , wherein an average size of the side margin portion in the third direction is 20 μm or less.

14 . The multilayer electronic component of claim 1 , wherein a size of the multilayer electronic component is 1005 (length×width: 1.0 mm×0.5 mm) or less.

Assignees

• Samsung Electro Mech

Inventors

• Kang Sung Yong

Classifications

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• C04B35/4682

  based on BaTiO3 perovskite phase · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• B32B18/00

  Layered products essentially comprising ceramics, e.g. refractory products · CPC title