Thermistor

Patent metadata

Field	Value
Publication number	US-12500013-B2
Application number	US-202218065125-A
Country	US
Kind code	B2
Filing date	Dec 13, 2022
Priority date	Jun 26, 2020
Publication date	Dec 16, 2025
Grant date	Dec 16, 2025

Abstract

A thermistor that includes: a base layer containing a resin component; a thermistor layer on the base layer, wherein the thermistor layer is a composite which includes a plurality of particles including a metal oxide containing at least one first metal element that is at least one of Mn and Ni, and an amorphous phase between the plurality of particles and which contains the same metal element as the first metal element; two electrodes, wherein the two electrodes include at least one second metal element selected from the group consisting of Cu, Al, Ag, and Ni; and a bonding layer between the two electrodes and the thermistor layer, the bonding layer comprising the composite, the second metal element, and the resin component.

First claim

The invention claimed is:

1 . A thermistor comprising:
a base layer containing a resin component; a thermistor layer on the base layer, wherein the thermistor layer is a composite which includes a plurality of particles including a metal oxide containing at least one first metal element that is at least one of Mn and Ni, and an amorphous phase between the plurality of particles and which contains the same metal element as the first metal element; two electrodes, wherein the two electrodes include at least one second metal element selected from the group consisting of Cu, Al, Ag, and Ni; and a bonding layer between the two electrodes and the thermistor layer, the bonding layer comprising the composite, the second metal element, and the resin component.

2 . The thermistor according to claim 1 , wherein a structure comprising the thermistor layer and the two electrodes defines two surfaces that face each other, and the two surfaces have irregularities smaller than a thickness of the two electrodes or the two surfaces are flat.

3 . The thermistor according to claim 1 , wherein the two electrodes are arranged on the base layer and spaced apart from each other, and the thermistor layer is disposed on the two electrodes and the base layer.

4 . The thermistor according to claim 1 , wherein the first metal element further includes at least one selected from the group consisting of Fe, Al, Co, and Cu.

5 . The thermistor according to claim 1 , wherein the resin component contains at least one selected from the group consisting of polyethylene terephthalate, polyetherimide, polyamideimide, polyimide, polytetrafluoroethylene, an epoxy resin, and a liquid crystal polymer.

6 . The thermistor according to claim 1 , wherein an average particle size of the metal oxide particles is 0.01 μm to 100 μm.

7 . The thermistor according to claim 1 , wherein a content of silicon oxide in the composite is 0.1% by mass or less.

8 . A thermistor comprising:
a base layer containing a resin component; a thermistor layer on the base layer, wherein the thermistor layer comprises a composite which includes a plurality of particles including a metal oxide containing at least one first metal element that is at least one of Mn and Ni, and an amorphous phase between the plurality of particles and contains the same metal element as the first metal element; two electrodes, wherein the two electrodes include a base material including at least one second metal element selected from the group consisting of Cu, Al, Ag, and Ni; and a coating layer on a surface of the base material, the coating layer including at least one third metal element selected from the group consisting of Ni, Au, Ag, Pt, Pd, Zn, Cr, W, Mo, Cu, and Ti.

9 . The thermistor according to claim 8 , further comprising a bonding layer between the two electrodes and the thermistor layer, the bonding layer comprising the composite, the third metal element, and the resin component.

10 . The thermistor according to claim 8 , further comprising a bonding layer between the two electrodes and the thermistor layer, the bonding layer comprising the composite, the second metal element, the third metal element, and the resin component.

11 . The thermistor according to claim 8 , wherein a structure comprising the thermistor layer and the two electrodes defines two surfaces that face each other, and the two surfaces have irregularities smaller than a thickness of the two electrodes or the two surfaces are flat.

12 . The thermistor according to claim 8 , wherein the two electrodes are arranged on the base layer and spaced apart from each other, and the thermistor layer is disposed on the two electrodes and the base layer.

13 . The thermistor according to claim 8 , wherein the first metal element further includes at least one selected from the group consisting of Fe, Al, Co, and Cu.

14 . The thermistor according to claim 8 , wherein the resin component contains at least one selected from the group consisting of polyethylene terephthalate, polyetherimide, polyamideimide, polyimide, polytetrafluoroethylene, an epoxy resin, and a liquid crystal polymer.

15 . The thermistor according to claim 8 , wherein an average particle size of the metal oxide particles is 0.01 μm to 100 μm.

16 . The thermistor according to claim 8 , wherein a content of silicon oxide in the composite is 0.1% by mass or less.

17 . The thermistor according to claim 8 , wherein a thickness of the coating layer is 0.1 to 1.0 μm.

Assignees

• Murata Manufacturing Co

Inventors

• Fukutani Tatsuya
• Ide Hiroaki
• Funahashi Shuichi

Classifications

• H01C1/1413

  Terminals or electrodes formed on resistive elements having negative temperature coefficient · CPC title

• H01C1/01

  Mounting; Supporting · CPC title

• H01C7/049

  mainly consisting of organic or organo-metal substances · CPC title

• H01C7/043

  Oxides or oxidic compounds · CPC title

• H01C7/04

  having negative temperature coefficient · CPC title