Methods of processing semiconductor wafers using double side grinding operations

Patent metadata

Field	Value
Publication number	US-12496676-B2
Application number	US-202318160071-A
Country	US
Kind code	B2
Filing date	Jan 26, 2023
Priority date	Jan 26, 2023
Publication date	Dec 16, 2025
Grant date	Dec 16, 2025

Abstract

A method of processing a semiconductor wafer includes placing the wafer in a carrier such that a first grinding wheel engages the front surface of the wafer and a second grinding wheel engages the back surface of the wafer. The method also includes performing a first grinding operation in which the first and second grinding wheels rotate in counter-rotation manner and the wafer is rotated in a first direction that matches a rotational direction of the first grinding wheel, whereby a portion of the front and/or back surfaces of the wafer is removed. The method also includes performing a second grinding operation in which the first and second grinding wheels rotate in counter-rotation manner and the wafer is rotated in a second direction that matches a rotational direction of the second grinding wheel, whereby another portion of the front and/or back surfaces of the wafer is removed.

First claim

What is claimed is:

1 . A method of processing a semiconductor wafer using a double side grinding apparatus that includes a first grinding wheel, a second grinding wheel, and a carrier for supporting the wafer between the first and second grinding wheels, the wafer having a front surface and a back surface, the method comprising:
placing the wafer in the carrier such that the first grinding wheel engages the front surface of the wafer and the second grinding wheel engages the back surface of the wafer; performing a first grinding operation of the double side grinding apparatus on the wafer in which the first and second grinding wheels rotate in counter-rotation manner relative to each other and the wafer is rotated in a first direction that matches a rotational direction of the first grinding wheel, whereby a first portion of at least one of the front and back surfaces of the wafer is removed; performing a second grinding operation of the double side grinding apparatus on the wafer in which the first and second grinding wheels rotate in counter-rotation manner relative to each other and the wafer is rotated in a second direction that matches a rotational direction of the second grinding wheel, whereby a second portion of at least one of the front and back surfaces of the wafer is removed; and performing a third grinding operation of the double side grinding apparatus on the wafer in which the first and second grinding wheels rotate in counter-rotation manner relative to each other and the wafer is rotated in the first direction or the second direction, whereby a third portion of at least one of the front and back surfaces of the wafer is removed.

2 . The method of claim 1 , wherein performing the second grinding operation comprises rotating at least one of the first grinding wheel, the second grinding wheel, and the wafer at a second rotational speed that is different than a first rotational speed of the at least one of the first grinding wheel, the second grinding wheel, and the wafer during the first grinding operation.

3 . The method of claim 2 , wherein performing the second grinding operating comprises rotating the wafer at a second rotational speed that is different than a first rotational speed of the wafer during the first grinding operation.

4 . The method of claim 3 , wherein the second rotational speed of the wafer is greater than the first rotational speed of the wafer.

5 . The method of claim 1 , wherein performing the second grinding operation comprises positioning at least one of the first grinding wheel and the second grinding wheel at a second orientation relative the wafer that is different than a first orientation of the at least one of the first grinding wheel and the second grinding wheel during the first grinding operation.

6 . The method of claim 5 , wherein, in one of the first orientation and the second orientation, the at least one of the first grinding wheel and the second grinding wheel is oriented at an oblique angle relative to the wafer and, in the other one of the first orientation and the second orientation, the at least one of the first grinding wheel and the second grinding wheel is oriented substantially parallel to the wafer.

7 . The method of claim 1 , wherein performing the second grinding operation comprises supplying grinding fluid to the double side grinding apparatus at a second flow rate that is different than a first flow rate of the grinding fluid supplied during the first grinding operation.

8 . The method of claim 1 , wherein performing the second grinding operation further comprises adjusting, relative to the first grinding operation, at least one process parameter selected from the group consisting of a rotational speed of the wafer, a rotational speed of the first grinding wheel, a rotational speed of the second grinding wheel, an orientation of the first grinding wheel relative to the wafer, an orientation of the second grinding wheel relative to the wafer, and a flow rate of grinding fluid supplied to the double side grinding apparatus.

9 . The method of claim 1 , wherein performing the second grinding operation whereby the second portion of at least one of the front and back surfaces of the wafer is removed enhances at least one of in plane displacement, warp, and nanotopology of the wafer.

10 . A method of processing a semiconductor wafer using a double side grinding apparatus that includes a first grinding wheel, a second grinding wheel, and a carrier for supporting the wafer between the first and second grinding wheels, the wafer having a front surface and a back surface, the method comprising:
placing the wafer in the carrier such that the first grinding wheel engages the front surface of the wafer and the second grinding wheel engages the back surface of the wafer; performing a first grinding operation of the double side grinding apparatus on the wafer in which the first and second grinding wheels rotate in counter-rotation manner relative to each other and the wafer is rotated in a wafer rotation direction that matches a rotational direction of one of the first grinding wheel and the second grinding wheel, whereby a first portion of at least one of the front and back surfaces of the wafer is removed; performing a second grinding operation of the double side grinding apparatus on the wafer in which at least one process parameter is adjusted relative to the first grinding operation, whereby a second portion of at least one of the front and back surfaces of the wafer is removed to enhance at least one of in plane displacement, warp, and nanotopology of the wafer; and performing a third grinding operation of the double side grinding apparatus on the wafer, whereby a third portion of at least one of the front and back surfaces of the wafer is removed.

11 . The method of claim 10 , wherein the at least one process parameter is selected from the group consisting of the wafer rotation direction, a rotational speed of the wafer, a rotational speed of the first grinding wheel, a rotational speed of the second grinding wheel, an orientation of the first grinding wheel relative to the wafer, an orientation of the second grinding wheel relative to the wafer, and a flow rate of grinding fluid supplied to the double side grinding apparatus.

12 . The method of claim 10 , wherein performing the third grinding operation of the double side grinding apparatus comprises adjusting at least one process parameter relative to the first grinding operation or the second grinding operation, whereby the third portion of at least one of the front and back surfaces of the wafer is removed to enhance at least one of in plane displacement, warp, and nanotopology of the wafer.

13 . The method of claim 10 , wherein performing the second grinding operation comprises rotating the wafer in an opposite wafer direction that matches a rotational direction of the other one of the first grinding wheel and the second grinding wheel.

14 . The method of claim 10 , wherein the at least one process parameter is a rotational speed of the wafer, wherein performing the second grinding operating comprises rotating the wafer at a second rotational speed that is greater than a first rotational speed of the wafer during the first grinding operation.

15 . The method of claim 10 , wherein the at least one process parameter comprises at least one of an orientation of the first grinding wheel relative to the wafer and an orientation of the second grinding wheel relative to the wafer, wherein performing the second grinding operation comprises positioning at least one of the first grinding wheel and t

Assignees

• Globalwafers Co Ltd

Inventors

• Muronoi Tsunehiro

Classifications

• H10P90/123

  by grinding or lapping · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B27/0023

  grinding machines with a plurality of working posts · CPC title

• B24B27/0076

  grinding machines comprising two or more grinding tools · CPC title

• B24B7/228 Primary

  for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065) · CPC title