Multi-surface airtight packaging ceramic shell, multi-surface packaging device and preparation method

Patent metadata

Field	Value
Publication number	US-12494377-B2
Application number	US-202519191918-A
Country	US
Kind code	B2
Filing date	Apr 28, 2025
Priority date	Apr 7, 2024
Publication date	Dec 9, 2025
Grant date	Dec 9, 2025

Abstract

The present application provides a multi-surface airtight packaging ceramic shell, a multi-surface packaging device, and preparation method, belonging to the field of ceramic packaging technology. The multi-surface airtight packaging ceramic shell includes: a ceramic body, a shape of which is a polyhedron; where at least one surface of the ceramic body is provided with a shared solder pad, remaining surfaces other than the at least one surface having the shared solder pad are provided with sealing rings, and a packaging cavity for packaging a chip is formed inside each sealing ring. The ceramic body provided in the present application is a polyhedron, with one surface of shared solder pad as the bottom surface, and the other surfaces having chip mounting areas, bonding areas, and sealing rings.

First claim

The invention claimed is:

1 . A method of preparing a multi-surface airtight packaging ceramic shell, wherein the method comprises:
making a multi-surface raw porcelain body with a polyhedron shape, forming metallized through-holes on the multi-surface raw porcelain body, and printing a preset metallized pattern on each surface of the multi-surface raw porcelain body to form a solder pad on at least one surface of the multi-surface raw porcelain body; making raw porcelain strips, forming metallized through-holes on the raw porcelain strips, and printing a preset bonding finger pattern on each raw porcelain strip; and performing the following:
co-firing the raw porcelain strips and remaining surfaces of the multi-surface raw porcelain body other than the at least one surface having the solder pad, into one body, and plating nickel on the one body to form a nickel-plated part; and
welding sealing rings on the remaining surfaces of the co-fired one body other than the at least one surface having the solder pad, to obtain the multi-surface airtight packaging ceramic shell and form a packaging cavity configured for packaging a chip inside each sealing ring.

2 . The method according to claim 1 , wherein welding the sealing rings on the remaining surfaces of the nickel-plated part comprises:
plating gold on the nickel-plated part and the sealing rings, and assembling the nickel-plated part and the sealing rings by gold-tin welding.

3 . The method according to claim 1 , wherein welding the sealing rings on the remaining surfaces of the nickel-plated part comprises:
assembling the nickel-plated part and the sealing rings by brazing, and plating gold on the nickel-plated part and the sealing rings.

4 . A method of preparing a multi-surface airtight packaging ceramic shell, wherein the method comprises:
making a multi-surface raw porcelain body with a polyhedron shape, forming metallized through-holes on the multi-surface raw porcelain body, and printing a preset metallized pattern on each surface of the multi-surface raw porcelain body to form a solder pad on at least one surface of the multi-surface raw porcelain body; making raw porcelain strips, forming metallized through-holes on the raw porcelain strips, and printing a preset bonding finger pattern on each raw porcelain strip; and performing the following:
co-firing the raw porcelain strips and remaining surfaces of the multi-surface raw porcelain body other than the at least one surface having the solder pad, into one body, and plating nickel on the one body to form a nickel-plated part; and
welding sealing rings on the remaining surfaces of the co-fired one body other than the at least one surface having the solder pad, to obtain the multi-surface airtight packaging ceramic shell and form a packaging cavity configured for packaging a chip inside each sealing ring, with one or more of the co-fired porcelain strips configured for bonding the chip being inside each sealing ring and being arranged on each of the remaining surfaces of the co-fired one body, and each preset bonding finger pattern configured for bonding the chip being connected to the solder pad through one or more of the metallized through-holes on the co-fired multi-surface porcelain body.

5 . The method according to claim 4 , wherein welding the sealing rings on the remaining surfaces of the nickel-plated part comprises:
plating gold on the nickel-plated part and the sealing rings, and assembling the nickel-plated part and the sealing rings by gold-tin welding.

6 . The method according to claim 4 , wherein welding the sealing rings on the remaining surfaces of the nickel-plated part comprises:
assembling the nickel-plated part and the sealing rings by brazing, and plating gold on the nickel-plated part and the sealing rings.

7 . A method of preparing a multi-surface airtight packaging ceramic shell, wherein the method comprises:
making a multi-surface raw porcelain body with a polyhedron shape, forming metallized through-holes on the multi-surface raw porcelain body, and printing a preset metallized pattern on each surface of the multi-surface raw porcelain body to form a solder pad on at least one surface of the multi-surface raw porcelain body; making raw porcelain strips, forming metallized through-holes on the raw porcelain strips, and printing a preset bonding finger pattern on each raw porcelain strip; and performing the following:
co-firing the raw porcelain strips and remaining surfaces of the multi-surface raw porcelain body other than the at least one surface having the solder pad, into one body, and plating nickel on the one body to form a nickel-plated part; and
welding sealing rings on the remaining surfaces of the co-fired one body other than the at least one surface having the solder pad, to obtain the multi-surface airtight packaging ceramic shell and form a packaging cavity configured for packaging a chip inside each sealing ring, with one or more of the co-fired porcelain strips configured for bonding the chip being inside each sealing ring and being arranged on each of the remaining surfaces of the co-fired one body, and each preset bonding finger pattern configured for bonding the chip being connected to the solder pad through one or more of the metallized through-holes on the co-fired multi-surface porcelain body; wherein the raw porcelain strips are arranged around an inner periphery of each sealing ring to form a ceramic ring.

8 . The method according to claim 7 , wherein welding the sealing rings on the remaining surfaces of the nickel-plated part comprises:
plating gold on the nickel-plated part and the sealing rings, and assembling the nickel-plated part and the sealing rings by gold-tin welding.

9 . The method according to claim 7 , wherein welding the sealing rings on the remaining surfaces of the nickel-plated part comprises:
assembling the nickel-plated part and the sealing rings by brazing, and plating gold on the nickel-plated part and the sealing rings.

Assignees

• The 13Th Research Institute Of China Electronics Tech Group Corporation

Inventors

• Yu Fei
• Yang Zhentao
• Yu Ximeng
• Chen Jiangtao
• Liu Linjie

Classifications

• C04B2237/32

  Ceramic · CPC title

• C04B2237/125

  based on noble metals, e.g. silver · CPC title

• C04B2237/124

  based on copper · CPC title

• C04B37/006

  consisting of metals or metal salts · CPC title

• H10W76/60

  Seals · CPC title