Methods for crystal growth by replacing a sublimated target source material with a candidate source material
US-11926922-B2 · Mar 12, 2024 · US
US12486595B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12486595-B2 |
| Application number | US-202418601996-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 11, 2024 |
| Priority date | Apr 14, 2020 |
| Publication date | Dec 2, 2025 |
| Grant date | Dec 2, 2025 |
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The embodiments of the present disclosure disclose a method and an apparatus for crystal growth. The method for crystal growth may include: placing a seed crystal and a target source material in a growth chamber of an apparatus for crystal growth; executing a growth of a crystal based on the seed crystal and the target source material according to physical vapor transport; determining whether a preset condition is satisfied during the crystal growth process; and in response to determining that the preset condition is satisfied, replacing a sublimated target source material with a candidate source material. In the present disclosure, by replacing the sublimated target source material with the candidate source material, a crystal with large-size and high-quality can be grown.
Opening claim text (preview).
What is claimed is: 1 . A method for crystal growth, comprising: placing a seed crystal and a target source material in a growth chamber of an apparatus for crystal growth; executing a growth of a crystal based on the seed crystal and the target source material according to physical vapor transport; determining whether a preset condition is satisfied during the growth of the crystal; and in response to determining that the preset condition is satisfied, replacing a sublimated target source material with a candidate source material, wherein the replacing the sublimated target source material with the candidate source material includes: controlling the candidate source material to enter the growth chamber to push the sublimated target source material such that the sublimated target source material leaves the growth chamber. 2 . The method of claim 1 , wherein the target source material or the candidate source material includes a block material. 3 . The method of claim 2 , wherein a shape of the block material includes a cube, a cuboid, or an irregular block. 4 . The method of claim 2 , wherein a thickness of the block material is less than a preset thickness threshold. 5 . The method of claim 2 , wherein a thickness of the block material is 30 millimeters˜40 millimeters. 6 . The method of claim 1 , wherein the target source material and/or the candidate source material are prepared through a processing process, the processing process including: preparing the target source material and/or the candidate source material by performing at least one of a pressing operation, a sintering operation, a polishing operation, or a purging operation on powder source materials. 7 . The method of claim 6 , wherein a processing condition of the sintering includes an inert atmosphere condition. 8 . The method of claim 1 , wherein the candidate source material is controlled to enter the growth chamber from a first region. 9 . The method of claim 8 , wherein a temperature of the first region is lower than a temperature of the growth chamber, and a temperature difference between the first region and the growth chamber is less than a first preset temperature threshold. 10 . The method of claim 9 , wherein the first preset temperature threshold is determined according to a distance between the first region and the growth chamber. 11 . The method of claim 8 , further including: performing a preheating treatment on the candidate source material in the first region, the preheating treatment including heating the candidate source material to a sublimation temperature of the crystal and keeping the sublimation temperature for a preset time period. 12 . The method of claim 11 , wherein the preset time period is determined according to a size of the candidate source material. 13 . The method of claim 1 , wherein a speed of controlling the candidate source material to push the sublimated target source material is less than a preset speed threshold. 14 . The method of claim 1 , wherein a speed of controlling the candidate source material to push the sublimated target source material is 100 millimeters/hour˜ 150 millimeters/hour. 15 . The method of claim 14 , wherein the speed of controlling the candidate source material to push the sublimated target source material is determined according to a weight of the sublimated target source material. 16 . The method of claim 1 , wherein the sublimated target source material is pushed to leave the growth chamber and enter a second region of the apparatus for crystal growth. 17 . The method of claim 16 , wherein a temperature of the second region is lower than a temperature of the growth chamber, and a temperature difference between the second region and the growth chamber is less than a second preset temperature threshold. 18 . The method of claim 17 , wherein the second preset temperature threshold is determined according to a distance between the second region and the growth chamber. 19 . The method of claim 1 , wherein the crystal includes silicon carbide, aluminum nitride, zinc oxide, or zinc telluride. 20 . The method of claim 1 , wherein the preset condition includes a crystal growth time length reaching a preset time length.
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