Resin composition and article manufactured using the same

Patent metadata

Field	Value
Publication number	US-12486397-B2
Application number	US-202318137026-A
Country	US
Kind code	B2
Filing date	Apr 20, 2023
Priority date	Mar 2, 2023
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

A resin composition is provided, which comprises: 1 part by weight to 20 parts by weight of a first resin represented by the following formula (1); and 70 parts by weight of a vinyl group-containing polyphenylene ether resin,

wherein m is an integer ranging from 10 to 250. The present invention also provides an article manufactured using the aforesaid resin composition.

First claim

The invention claimed is:

1 . A resin composition, comprising:
1 part by weight to 20 parts by weight of a first resin represented by the following formula (1); and 100 parts by weight of a second resin, wherein the second resin comprises vinyl group-containing polyphenylene ether resin, maleimide resin, styrene-butadiene-divinylbenzene terpolymer resin, hydrogenated styrene-butadiene-styrene block copolymer resin or a combination thereof,

wherein m is a positive integer of 10 to 250.

2 . The resin composition of claim 1 , wherein the second resin comprises the vinyl group-containing polyphenylene ether resin, and a content of the vinyl group-containing polyphenylene ether resin is 70 parts by weight.

3 . The resin composition of claim 1 , wherein the second resin comprises the maleimide resin, and a content of the maleimide resin ranges from 1 part by weight to 40 parts by weight.

4 . The resin composition of claim 1 , wherein the second resin comprises the styrene-butadiene-divinylbenzene terpolymer resin, and a content of the styrene-butadiene-divinylbenzene terpolymer resin ranges from 1 part by weight to 40 parts by weight.

5 . The resin composition of claim 1 , wherein the second resin comprises the hydrogenated styrene-butadiene-styrene block copolymer resin, and a content of the hydrogenated styrene-butadiene-styrene block copolymer resin ranges from 1 part by weight to 35 parts by weight.

6 . The resin composition of claim 1 , wherein the second resin comprises the vinyl group-containing polyphenylene ether resin, the maleimide resin, the styrene-butadiene-divinylbenzene terpolymer resin and the hydrogenated styrene-butadiene-styrene block copolymer resin; wherein a content of the vinyl group-containing polyphenylene ether resin is 70 parts by weight, a content of the maleimide resin ranges from 1 part by weight to 15 parts by weight, a content of the styrene-butadiene-divinylbenzene terpolymer resin ranges from 5 parts by weight to 35 parts by weight, and a content of the hydrogenated styrene-butadiene-styrene block copolymer resin ranges from 1 parts by weight to 15 parts by weight.

7 . The resin composition of claim 1 , further comprising: 30 parts by weight to 130 parts by weight of an inorganic filler.

8 . The resin composition of claim 7 , wherein the inorganic filler is silicon dioxide.

9 . The resin composition of claim 1 , further comprising: 0.01 parts by weight to 0.5 parts by weight of a hardening initiator.

10 . The resin composition of claim 9 , wherein the hardening initiator is peroxide.

11 . A resin composition, comprising:
1 part by weight to 20 parts by weight of a first resin represented by the following formula (1); and 70 parts by weight of a vinyl group-containing polyphenylene ether resin,

wherein m is a positive integer of 10 to 250.

12 . The resin composition of claim 11 , further comprising 20 parts by weight to 40 parts by weight of at least one selected from the group consisting of maleimide resin, styrene-butadiene-divinylbenzene terpolymer resin and hydrogenated styrene-butadiene-styrene block copolymer resin.

13 . The resin composition of claim 11 , further comprising: 1 part by weight to 40 parts by weight of maleimide resin.

14 . The resin composition of claim 11 , further comprising: 1 part by weight to 40 parts by weight of styrene-butadiene-divinylbenzene terpolymer resin.

15 . The resin composition of claim 11 , further comprising: 1 part by weight to 35 parts by weight of hydrogenated styrene-butadiene-styrene block copolymer resin.

16 . The resin composition of claim 11 , further comprising: 1 part by weight to 15 parts by weight of maleimide resin, 5 parts by weight to 35 parts by weight of styrene-butadiene-divinylbenzene terpolymer resin and 1 part by weight to 15 parts by weight of hydrogenated styrene-butadiene-styrene block copolymer resin.

17 . The resin composition of claim 11 , further comprising: 30 parts by weight to 130 parts by weight of an inorganic filler.

18 . The resin composition of claim 17 , wherein the inorganic filler is silicon dioxide.

19 . The resin composition of claim 11 , further comprising: 0.01 parts by weight to 0.5 parts by weight of a hardening initiator.

20 . The resin composition of claim 19 , wherein the hardening initiator is peroxide.

21 . An article manufactured using the resin composition of claim 1 , wherein the article include a prepreg, a resin film, a laminate or a printed circuit board.

Assignees

• Elite Material Co Ltd

Inventors

• Hsu Tsung-Ju
• Chang Shu-Hao

Classifications

• C08L71/126

  modified by chemical after-treatment · CPC title

• C08J2469/00

  Characterised by the use of polycarbonates; Derivatives of polycarbonates · CPC title

• C08L71/12 Primary

  Polyphenylene oxides · CPC title

• C08J2479/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08J2453/02

  of vinyl aromatic monomers and conjugated dienes · CPC title