Substrate positioning for deposition machine

Patent metadata

Field	Value
Publication number	US-12485681-B2
Application number	US-202318462261-A
Country	US
Kind code	B2
Filing date	Sep 6, 2023
Priority date	Oct 27, 2020
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

A deposition device is described. The deposition device has a substrate support and an imaging system disposed to image a portion of a substrate positioned on the substrate support. The imaging system comprises an LED light source and an imaging unit, and is coupled to a deposition assembly disposed across the substrate support.

First claim

What is claimed is:

1 . A method of imaging a feature on a substrate, comprising:
scanning the substrate relative to an imaging system comprising an LED light source and an imaging unit; activating the imaging unit before an extremity of the feature reaches an illumination field of the LED light source; activating the LED light source when a portion of the feature reaches the illumination field; deactivating the LED light source after an active time; and deactivating the imaging unit after an imaging time, wherein the imaging time encompasses the active time.

2 . The method of claim 1 , wherein the active time is less than 5 μsec.

3 . The method of claim 2 , wherein the imaging unit is a camera having sensitivity matched to the emission wavelength of the LED light source.

4 . The method of claim 3 , further comprising relatively positioning the substrate and the imaging system based on an expected location of the feature.

5 . The method of claim 4 , further comprising automatically identifying a boundary of the feature in the image.

6 . The method of claim 5 , further comprising automatically identifying a position error of the feature.

7 . The method of claim 5 , further comprising automatically identifying a rotation error of the feature.

8 . The method of claim 1 , wherein the imaging system is a first imaging system, and further comprising:
capturing a first image of the feature using the first imaging system; and capturing a second image of the feature using a second imaging system, the second imaging system comprising an LED light source.

9 . The method of claim 8 , wherein the first imaging system and the second imaging system are coupled to a support extending across a substrate support on which the substrate is disposed for imaging.

10 . A method of imaging a feature on a substrate, comprising:
scanning the substrate relative to an imaging system comprising an LED light source and an imaging unit; and while scanning the substrate,
activating the imaging unit before an extremity of the feature reaches an illumination field of the LED light source;
activating the LED light source when the feature is within the illumination field;
deactivating the LED light source after an active time when a portion of the feature exits the illumination field; and
deactivating the imaging unit after an imaging time, wherein the imaging time encompasses the active time.

11 . The method of claim 10 , wherein activating the LED light source and deactivating the LED light source comprises pulsing the LED light source for a duration of about 1 μsec or less.

12 . The method of claim 11 , wherein pulsing the LED light source is based on an expected position of the feature.

13 . The method of claim 10 , wherein the active time is about 1 μsec or less.

14 . The method of claim 10 , further comprising automatically identifying a boundary of the feature in the image.

15 . The method of claim 14 , further comprising automatically identifying a position error of the feature, a rotation error of the feature, or both.

16 . The method of claim 14 , wherein automatically identifying the boundary of the feature of the image is performed based on brightness of pixels in the image.

17 . A method of imaging a feature on a substrate, comprising:
scanning the substrate relative to an imaging system comprising an LED light source and an imaging unit; and while scanning the substrate,
activating the imaging unit before an extremity of the feature reaches an illumination field of the LED light source;
pulsing the LED light source, for an active time of about 1 μsec or less, while the feature is entirely within the illumination field based on an expected position of the feature; and
deactivating the imaging unit after an imaging time, wherein the imaging time encompasses the active time.

18 . The method of claim 17 , further comprising automatically identifying a boundary of the feature in the image.

19 . The method of claim 18 , further comprising automatically identifying a position error of the feature, a rotation error of the feature, or both.

20 . The method of claim 19 , wherein automatically identifying the boundary of the feature of the image is performed based on brightness of pixels in the image.

Assignees

• Kateeva Inc

Inventors

• Chang Jerry
• Lu Jesse
• Audet Matt

Classifications

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• B41J2/01

  Ink jet · CPC title

• B41J3/407

  for marking on special material · CPC title

• B41J11/00218 Primary

  Constructional details of the irradiation means, e.g. radiation source attached to reciprocating print head assembly or shutter means provided on the radiation source · CPC title

• H10K71/135

  using ink-jet printing · CPC title