Piezoelectric component, piezoelectric apparatus and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-12484451-B2
Application number	US-202117486717-A
Country	US
Kind code	B2
Filing date	Sep 27, 2021
Priority date	Sep 28, 2020
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

This application provides a piezoelectric component, a piezoelectric apparatus and a method for manufacturing the same, and relates to the field of piezoelectric technologies. In order to solve a problem of a relatively large misalignment between a piezoelectric component and a target transfer position on a glass substrate occurred after the piezoelectric component is transferred in the related transfer methods, and to improve the transfer accuracy of the piezoelectric component. The piezoelectric component includes: a component body and at least one electrode structure arranged on a side of the component body. The at least one electrode structure includes a plurality of strip-shaped electrode pins, and the plurality of electrode pins is arranged at intervals.

First claim

What is claimed is:

1 . A piezoelectric apparatus, comprising a plurality of piezoelectric components, wherein each of the plurality of the piezoelectric components comprises: a component body and at least one electrode structure arranged on a side of the component body,
wherein the at least one electrode structure comprises a plurality of electrode pins, and the plurality of electrode pins is arranged at intervals; wherein the piezoelectric apparatus further comprises a first substrate, and a plurality of bonding pads arranged on the first substrate, wherein the electrode structures in the plurality of piezoelectric components are correspondingly embedded in the plurality of bonding pads; wherein the first substrate is a display panel; wherein the display panel is a liquid crystal display panel; the liquid crystal display panel includes an array substrate and a color filter substrate that are arranged oppositely, and a liquid crystal layer arranged between the array substrate and the color filter substrate; and the plurality of bonding pads are formed on a side of the color filter substrate facing away from the liquid crystal layer.

2 . The piezoelectric apparatus according to claim 1 , wherein each of the bonding pads comprises a transition pattern and a conductive pattern that are stacked, and the transition pattern is located between the conductive pattern and the first substrate,
wherein in a direction perpendicular to the first substrate, heights of the electrode pins comprised in the electrode structures are smaller than a thickness of the conductive pattern.

3 . The piezoelectric apparatus according to claim 2 , wherein the transition pattern is made of nickel (Ni), the conductive pattern is made of tin (Sn), and each of the electrode structures of the plurality of piezoelectric components is embedded in the conductive pattern of a corresponding one of the bonding pads.

4 . The piezoelectric apparatus according to claim 1 , wherein the first substrate comprises a rigid substrate or a flexible substrate.

5 . The piezoelectric apparatus according to claim 1 , wherein the display panel is an organic light emitting diode display panel; and the piezoelectric apparatus is formed on a cover plate of the organic light emitting diode display panel.

6 . The piezoelectric apparatus according to claim 1 , wherein the plurality of piezoelectric components form a thin film vibrator on the display panel.

7 . The piezoelectric apparatus according to claim 1 , wherein the component body comprises a lead zirconate titanate piezoelectric film.

8 . The piezoelectric apparatus according to claim 1 , wherein a height of each of the plurality of the electrode pins in a direction perpendicular to the component body is greater than 1 μm.

9 . The piezoelectric apparatus according to claim 1 , wherein the plurality of electrode pins is distributed in an array, an extension direction of each of the electrode pins is perpendicular to the component body, and a minimum value of a width of each of the electrode pins in a first direction is equal to a minimum value of a distance between the electrode pin and an adjacent electrode pin in the first direction, wherein the first direction is perpendicular to the extending direction.

10 . The piezoelectric apparatus according to claim 1 , wherein the plurality of electrode pins has same dimensions and is arranged at equal intervals, an extending direction of each of the electrode pins is perpendicular to the component body, and a width of each of the electrode pins in a first direction is equal to a distance of any two adjacent ones of the electrode pins in the first direction, wherein the first direction is perpendicular to the extension direction.

11 . The piezoelectric apparatus according to claim 1 , wherein each of the electrode pins is a cylinder, and a diameter of each of the electrode pins is between 3 μm and 4 μm, where endpoint values are inclusive.

12 . The piezoelectric apparatus according to claim 1 , wherein each of the electrode pins comprises a first metal pattern and a second metal pattern that are stacked, and the first metal pattern and the second metal pattern are made of different metal materials.

13 . The piezoelectric apparatus according to claim 12 , wherein the first metal pattern is located between the component body and the second metal pattern, the first metal pattern is made of titanium (Ti), and the second metal pattern is made of gold (Au) or copper (Cu).

14 . A method for manufacturing the piezoelectric apparatus according to claim 1 , comprising:
forming the plurality of bonding pads on the first substrate; forming the plurality of piezoelectric components on a second substrate; pressing each of the electrode structures in the plurality of piezoelectric components into a corresponding one of the bonding pads; and peeling the second substrate from the plurality of piezoelectric components.

15 . The method according to claim 14 , wherein the forming the plurality of bonding pads on the first substrate specifically comprises:
sequentially forming a transition film layer and a conductive film layer that are stacked on the first substrate; and patterning the transition film layer and the conductive film layer simultaneously through one patterning process to form a transition pattern and a conductive pattern that are stacked.

16 . The method according to claim 14 , wherein the forming the plurality of piezoelectric components on the second substrate specifically comprises:
forming a piezoelectric film on the second substrate; patterning the piezoelectric film to form a plurality of component bodies; forming a metal thin film on a side of the plurality of device bodies facing away from the second substrate; and patterning the metal thin film to form the at least one electrode structure on each of the component bodies; or, wherein the pressing each of the electrode structures in the plurality of piezoelectric components into a corresponding one of the bonding pads specifically comprises: heating the bonding pads to a preset temperature; and pressing, in an environment with an inert atmosphere, each of the electrode structures in the plurality of piezoelectric components into a corresponding one of the bonding pads.

17 . The method according to claim 14 , further comprising:
performing an annealing process on the electrode structures and the bonding pads, after peeling the second substrate from the piezoelectric components; or, after peeling the second substrate from the piezoelectric components, depositing a metal layer on a side of the piezoelectric components facing away from the bonding pads; and patterning the metal layer to form a signal transmission line connected with the piezoelectric components.

Assignees

• Boe Technology Group Co Ltd
• Beijing Boe Technology Dev Co Ltd

Inventors

• Chen Yuju

Classifications

• H10N30/706

  characterised by the underlying bases, e.g. substrates · CPC title

• H10N30/8554

  Lead-zirconium titanate [PZT] based · CPC title

• H10N30/88

  Mounts; Supports; Enclosures; Casings · CPC title

• H10N30/072

  by laminating or bonding of piezoelectric or electrostrictive bodies · CPC title

• H10N30/08

  Shaping or machining of piezoelectric or electrostrictive bodies · CPC title