Structure body and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-12484146-B2
Application number	US-202318153596-A
Country	US
Kind code	B2
Filing date	Jan 12, 2023
Priority date	Aug 3, 2020
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

A structure body includes a ceramic substrate including a first surface, a first conductor pattern arranged on the first surface, and a first columnar conductor connected to the first conductor pattern and extending in a direction of thickness in an orientation away from the ceramic substrate. The first columnar conductor is provided with a recess in an end surface on a side close to the ceramic substrate and the first surface is provided with a raised portion in conformity with the recess in a region where the first columnar conductor is superimposed.

First claim

The invention claimed is:

1 . A structure body comprising:
a ceramic substrate including a first surface; a first conductor pattern arranged on the first surface; and a first columnar conductor connected to the first conductor pattern and extending in a direction of thickness in an orientation away from the ceramic substrate, wherein the first columnar conductor is provided with a recess in an end surface on a side closer to the ceramic substrate, and the first surface is provided with a raised portion in conformity with the recess in a region where the first columnar conductor is superimposed.

2 . The structure body according to claim 1 , further comprising a conductor via connected to the first conductor pattern and extending in the direction of thickness in an orientation from the first surface toward inside of the ceramic substrate, wherein
when viewed two-dimensionally, the conductor via is arranged to at least partially be superimposed on the first columnar conductor at a position displaced from a center of the first columnar conductor.

3 . The structure body according to claim 1 , further comprising a plurality of conductor vias connected to the first conductor pattern and extending in the direction of thickness in an orientation from the first surface toward inside of the ceramic substrate, wherein
when viewed two-dimensionally, each of the plurality of conductor vias is arranged to at least partially be superimposed on the first columnar conductor at a position displaced from a center of the first columnar conductor.

4 . The structure body according to claim 1 , wherein
the first columnar conductor is in a tapered shape as decreasing in diameter as a distance from the first surface increases.

5 . The structure body according to claim 1 , wherein
the first columnar conductor is in a tapered shape as increasing in diameter as a distance from the first surface increases.

6 . The structure body according to claim 1 , further comprising a second columnar conductor connected to an end of the first columnar conductor on a side distant from the ceramic substrate and extending in the direction of thickness toward the side distant from the ceramic substrate.

7 . The structure body according to claim 1 , wherein
a shrinkage ratio during firing of a material for the first columnar conductor is higher than a shrinkage ratio during firing of a material for the ceramic substrate.

8 . The structure body according to claim 2 , wherein
the first columnar conductor is in a tapered shape as decreasing in diameter as a distance from the first surface increases.

9 . The structure body according to claim 3 , wherein
the first columnar conductor is in a tapered shape as decreasing in diameter as a distance from the first surface increases.

10 . The structure body according to claim 2 , wherein
the first columnar conductor is in a tapered shape as increasing in diameter as a distance from the first surface increases.

11 . The structure body according to claim 3 , wherein
the first columnar conductor is in a tapered shape as increasing in diameter as a distance from the first surface increases.

12 . The structure body according to claim 2 , further comprising a second columnar conductor connected to an end of the first columnar conductor on a side distant from the ceramic substrate and extending in the direction of thickness toward the side distant from the ceramic substrate.

13 . The structure body according to claim 3 , further comprising a second columnar conductor connected to an end of the first columnar conductor on a side distant from the ceramic substrate and extending in the direction of thickness toward the side distant from the ceramic substrate.

14 . The structure body according to claim 4 , further comprising a second columnar conductor connected to an end of the first columnar conductor on a side distant from the ceramic substrate and extending in the direction of thickness toward the side distant from the ceramic substrate.

15 . A structure body comprising:
a ceramic substrate including a first surface; and a first columnar conductor connected to the first surface and extending in a direction of thickness in an orientation away from the ceramic substrate, wherein the ceramic substrate includes a conductor via extending in a direction of thickness as being exposed at the first surface, the first columnar conductor is connected to the conductor via, the first columnar conductor is provided with a recess in an end surface on a side closer to the ceramic substrate, and the first surface is provided with a raised portion in conformity with the recess in a region where the first columnar conductor is superimposed.

16 . The structure body according to claim 15 wherein
the first columnar conductor is in a tapered shape as decreasing in diameter as a distance from the first surface increases.

17 . The structure body according to claim 15 , wherein
the first columnar conductor is in a tapered shape as increasing in diameter as a distance from the first surface increases.

18 . The structure body according to claim 15 , further comprising a second columnar conductor connected to an end of the first columnar conductor on a side distant from the ceramic substrate and extending in the direction of thickness toward the side distant from the ceramic substrate.

19 . A method of manufacturing a structure body, the method comprising:
providing a through hole in a sacrificial sheet not sintered in a temperature range where a ceramic component of a ceramic green sheet is sintered; filling the through hole with a conductive paste; preparing a first multilayer body being a multilayer body of ceramic green sheets, the first multilayer body including a first surface; obtaining a second multilayer body by layering the sacrificial sheet on the first surface of the first multilayer body; firing the second multilayer body; and removing the sacrificial sheet from the second multilayer body to leave a first columnar conductor generated by firing of the conductive paste, wherein after the firing of the second multilayer body, the first columnar conductor is provided with a recess in an end surface on a side closer to a ceramic substrate formed by firing of the first multilayer body, and the first surface is provided with a raised portion in conformity with the recess in a region where the first columnar conductor is superimposed.

20 . The method of manufacturing a structure body according to claim 19 , wherein
a shrinkage ratio during firing of the conductive paste is higher than a shrinkage ratio during firing of the ceramic green sheet.

Assignees

• Murata Manufacturing Co

Inventors

• Hatase Minoru
• Otsubo Yoshihito

Classifications

• H05K3/46

  Manufacturing multilayer circuits · CPC title

• H05K1/0306 Primary

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K2203/1327

  Moulding over PCB locally or completely · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• H05K2203/308

  Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs · CPC title