Apparatus and method for delivering a plurality of waveform signals during plasma processing

Patent metadata

Field	Value
Publication number	US-12482633-B2
Application number	US-202318199519-A
Country	US
Kind code	B2
Filing date	May 19, 2023
Priority date	Dec 8, 2021
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

Embodiments of the present disclosure generally relate to a system used in a semiconductor device manufacturing process. More specifically, embodiments provided herein generally include apparatus and methods for synchronizing and controlling the delivery of an RF bias voltage signal and a pulsed voltage waveform to one or more electrodes within a plasma processing chamber. Embodiments of the disclosure include a method and apparatus for synchronizing a pulsed radio frequency (RF) waveform to a pulsed voltage (PV) waveform, such that the pulsed RF waveform is on during a first stage of the PV waveform and off during a second stage. The first stage of the PV waveform includes a sheath collapse stage. The second stage of the PV waveform includes an ion current stage.

First claim

What is claimed is:

1 . A plasma processing system, comprising:
a pulsed voltage waveform generator coupled to a first electrode; a radio frequency (RF) waveform generator coupled to a second electrode, wherein the radio frequency waveform generator is configured to generate a plasma within a processing volume of the plasma processing system; an impedance matching circuit coupled between the radio frequency waveform generator and the second electrode; and a controller having a processor configured to execute computer-readable instructions stored within memory that cause the system to:
apply, by use of the pulsed voltage waveform generator, a pulsed voltage waveform to the first electrode, the pulsed voltage waveform comprising a series of voltage pulses that each comprise a first stage and a second stage;
apply, by use of the radio frequency waveform generator, a pulsed RF waveform to the second electrode to generate a plasma in a processing region of a processing chamber; and
synchronize the pulsed RF waveform with each pulse of the pulsed voltage waveform, such that an RF waveform of the pulsed RF waveform is provided only during at least a portion of the second stage of each pulse of the pulsed voltage waveform.

2 . The plasma processing system of claim 1 , wherein the first stage of the pulsed voltage waveform includes a sheath collapse stage and the second stage of the pulsed voltage waveform includes an ion current stage.

3 . The plasma processing system of claim 1 , wherein the series of voltage pulses are delivered at a frequency that is greater than or equal to 100 kHz.

4 . The plasma processing system of claim 3 , wherein the pulsed RF waveform comprises a series of RF pulses that are delivered at a frequency that is equal to the frequency of the series of voltage pulses.

5 . The plasma processing system of claim 1 , wherein the first electrode is disposed in a substrate support, which comprises a substrate supporting surface that is configured to support a substrate disposed within the processing region of the processing chamber.

6 . The plasma processing system of claim 5 , wherein
the second electrode is disposed within the substrate support; and the first electrode is disposed between the second electrode and the substrate supporting surface.

7 . The plasma processing system of claim 5 , further comprising a third electrode, wherein the third electrode surrounds the first electrode and is electrically coupled to the pulsed voltage waveform generator.

8 . The plasma processing system of claim 5 , wherein the first electrode is electrically coupled to a clamping network that comprises a DC voltage supply.

9 . The plasma processing system of claim 1 , wherein the RF waveform of the pulsed RF waveform is applied after a first time delay has elapsed, wherein the first time delay begins at an end of the first stage of each voltage pulse of the pulsed voltage waveform.

10 . The plasma processing system of claim 9 , wherein the first time delay has a length that is between 1% and 20% of a total length of the second stage of the pulsed voltage waveform.

11 . The plasma processing system of claim 1 , wherein the first stage of each voltage pulse of the pulsed voltage waveform begins after a second time delay has elapsed, wherein a start of the second time delay begins at an end of a period in which the RF waveform of the pulsed RF waveform is provided during the at least a portion of the second stage.

12 . The plasma processing system of claim 11 , wherein the second time delay has a length that is between 0.1% and 10% of a total length of the second stage of the pulsed voltage waveform.

13 . The plasma processing system of claim 1 , wherein the pulsed voltage waveform is positive during the first stage.

14 . The plasma processing system of claim 1 , wherein the pulsed voltage waveform is negative during the second stage.

15 . The plasma processing system of claim 1 , wherein the impedance matching circuit is disposed between the RF waveform generator and one of the first electrode and the second electrode, and wherein the impedance matching circuit matches an impedance of a load to an impedance of the RF waveform generator during the second stage of each voltage pulse of the pulsed voltage waveform when the pulsed voltage waveform is provided to one of the first electrode and the second electrode.

16 . The plasma processing system of claim 1 , wherein the series of voltage pulses are delivered at a frequency that is greater than or equal to 100 kHz and less than or equal to 500 kHz.

17 . The plasma processing system of claim 16 , wherein the pulsed RF waveform is provided at a frequency between 1 MHz and 200 MHz.

18 . The plasma processing system of claim 1 , wherein the processor is further configured to cause the controller to deliver one or more control signals to the RF waveform generator and the pulsed voltage waveform generator to cause the synchronization of the pulsed RF waveform with each pulse of the pulsed voltage waveform.

19 . The plasma processing system of claim 1 , wherein the synchronization of the pulsed RF waveform with each pulse of the pulsed voltage waveform comprises the RF waveform generator sending a control signal to the pulsed voltage waveform generator.

20 . The plasma processing system of claim 1 , wherein the synchronization of the pulsed RF waveform with each pulse of the pulsed voltage waveform comprises the pulsed voltage waveform generator sending a control signal to the RF waveform generator.

Assignees

• Applied Materials Inc

Inventors

• Rogers James
• Kawasaki Katsumasa

Classifications

• H01J37/32568

  Relative arrangement or disposition of electrodes; moving means · CPC title

• H01J2237/3341

  Reactive etching · CPC title

• H01J37/32183

  Matching circuits · CPC title

• H01J2237/3343

  Problems associated with etching · CPC title

• H01J37/32128 Primary

  using particular waveforms, e.g. polarised waves · CPC title