Magnetic power component and power module to which magnetic power component is applied

Patent metadata

Field	Value
Publication number	US-12482590-B2
Application number	US-202217895507-A
Country	US
Kind code	B2
Filing date	Aug 25, 2022
Priority date	Aug 26, 2021
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

A magnetic power component includes a printed circuit board and a magnetic core assembled to the printed circuit board. The magnetic core includes a magnetic core body and a plurality of heat dissipation teeth. The magnetic core body is bonded to the printed circuit board. The plurality of heat dissipation teeth is protruded from an outer surface that is of the magnetic core body and that faces away from the printed circuit board. The plurality of heat dissipation teeth and the magnetic core body are bonded through direct contact.

First claim

What is claimed is:

1 . A magnetic power component, comprising:
a printed circuit board; and a magnetic core assembled to the printed circuit board and comprising:
a magnetic core body bonded to the printed circuit board and comprising an outer surface facing away from the printed circuit board; and
a plurality of heat dissipation teeth bonded to the magnetic core body through direct contact and protruding from the outer surface, wherein the magnetic core body further comprises:
a first magnetic core part comprising:
a main body part comprising:
 a first surface facing away from the printed circuit board and comprising a first portion of the plurality of heat dissipation teeth; and
 a second surface facing the printed circuit board; and
a support part connected to the second surface and penetrating through the printed circuit board; and

a second magnetic core part comprising:
a third surface facing away from the printed circuit board and comprising a second portion of the plurality of heat dissipation teeth; and
a fourth surface facing the printed circuit board and connected to the support part,

wherein the printed circuit board is located between the main body part and the second magnetic core part, and
wherein the first magnetic core part further comprises a first bump integrally formed with the main body part and located on the second surface, or wherein the second magnetic core part further comprises a second bump located on the fourth surface and bonded to the printed circuit board.

2 . The magnetic power component of claim 1 , wherein at least one of the first magnetic core part or the second magnetic core part is bonded to the printed circuit board.

3 . The magnetic power component of claim 1 , wherein the first magnetic core part and the first portion are integrally formed by using a magnetic material, and wherein the second magnetic core part and the second portion are integrally formed by using the magnetic material.

4 . The magnetic power component of claim 1 , wherein the magnetic core is a UI-type magnetic core, an EE-type magnetic core, an EI-type magnetic core, or a UU-type magnetic core.

5 . The magnetic power component of claim 1 , wherein each heat dissipation tooth extends to be strip-shaped, wherein first teeth within the first portion are parallel to each other and spaced apart, and wherein second teeth within the second portion are parallel to each other and spaced apart.

6 . The magnetic power component of claim 1 , further comprising a thermal conductive interface material disposed on a connection interface between the magnetic core body and the printed circuit board.

7 . The magnetic power component of claim 1 , wherein each heat dissipation tooth has a width that is perpendicular to an extension direction and is greater than or equal to 2 millimeters (mm).

8 . The magnetic power component of claim 1 , wherein a distance between two adjacent heat dissipation teeth is greater than or equal to 1 millimeter (mm).

9 . The magnetic power component of claim 1 , wherein each heat dissipation tooth has a height that is perpendicular to the outer surface and is less than or equal to 2 millimeters (mm).

10 . The magnetic power component of claim 1 , further comprising a winding integrated into the printed circuit board.

11 . A power module, comprising:
a substrate; and a magnetic power component disposed on the substrate and comprising:
a printed circuit board; and
a magnetic core assembled to the printed circuit board and comprising:
a magnetic core body bonded to the printed circuit board and comprising an outer surface facing away from the printed circuit board; and
a plurality of heat dissipation teeth bonded to the magnetic core body through direct contact and protruding from the outer surface, wherein the magnetic core body further comprises:
a first magnetic core part comprising:
 a main body part comprising:
 a first surface facing away from the printed circuit board and comprising a first portion of the plurality of heat dissipation teeth; and
 a second surface facing the printed circuit board; and
 a support part connected to the second surface and penetrating through the printed circuit board; and
a second magnetic core part comprising:
 a third surface facing away from the printed circuit board and comprising a second portion of the plurality of heat dissipation teeth; and
 a fourth surface facing the printed circuit board and connected to the support part,
wherein the printed circuit board is located between the main body part and the second magnetic core part, and
wherein the first magnetic core part further comprises a first bump integrally formed with the main body part and located on the second surface, or wherein the second magnetic core part further comprises a second bump located on the fourth surface and bonded to the printed circuit board.

12 . The power module of claim 11 , wherein the substrate is a circuit board, and wherein the printed circuit board is perpendicularly plugged into the substrate.

13 . The power module of claim 11 , wherein the power module further comprises a heat dissipation fan disposed on the substrate and located at an end of the magnetic power component.

14 . The power module of claim 13 , wherein the plurality of heat dissipation teeth extends to be strip-shaped, and wherein an extension direction of the plurality of heat dissipation teeth is consistent with an air duct direction of the heat dissipation fan.

15 . The magnetic power component of claim 1 , wherein the first magnetic core part is bonded to the printed circuit board.

16 . The magnetic power component of claim 1 , wherein the second magnetic core part is bonded to the printed circuit board.

17 . The magnetic power component of claim 1 , wherein the first magnetic core part further comprises a bump integrally formed with the main body part and located on the second surface.

18 . A magnetic power component, comprising:
a printed circuit board; and a magnetic core assembled to the printed circuit board and comprising:
a magnetic core body bonded to the printed circuit board and comprising an outer surface facing away from the printed circuit board; and
a plurality of heat dissipation teeth bonded to the magnetic core body through direct contact and protruding from the outer surface, wherein the magnetic core body further comprises:
a first magnetic core part comprising:
a main body part comprising:
 a first surface facing away from the printed circuit board and comprising a first portion of the plurality of heat dissipation teeth; and
 a second surface facing the printed circuit board; and
a support part connected to the second surface and penetrating through the printed circuit board; and

a second magnetic core part comprising:
a third surface facing away from the printed circuit board and comprising a second portion of the plurality of heat dissipation teeth;
a fourth surface facing the printed circuit board and connected to the support part; and
a bump located on the fourth surface and bonded to the printed circuit board, wherein the printed circuit board is located between the main body part and the second magnetic core part.

19 . The magnetic power component of claim 18 , wherein at least one of the first magnetic core part or the second magnetic core part is bonded to the printed circuit board.

20 . The magnetic power component of claim 19 , wherein the first magnetic core part and

Assignees

• Huawei Tech Co Ltd

Inventors

• Zhang Xijun
• Li Jia
• Yao Jun
• Gao Chao
• Gao Qiang
• Li Zhitao

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• H01F27/08

  Cooling (heat-transfer elements F28F); Ventilating (structural details of casings H01F27/02) · CPC title

• H01F27/22

  Cooling by heat conduction through solid or powdered fillings · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title