Surface acoustic wave device and fabrication method thereof

Patent metadata

Field	Value
Publication number	US-12476602-B2
Application number	US-202418585248-A
Country	US
Kind code	B2
Filing date	Feb 23, 2024
Priority date	Apr 19, 2023
Publication date	Nov 18, 2025
Grant date	Nov 18, 2025

Abstract

A surface acoustic wave (SAW) device includes a substrate; an interdigital transducer (IDT) having lead-out portions and arrays of interdigital electrodes formed on the substrate, wherein the interdigital electrodes includes central portions, end portions, and intermediate portions between the end portions and the lead-out portions, and a thickness of the interdigital electrodes at the end portions is greater than a thickness of the interdigital electrodes at the central portions and the intermediate portions, thereby forming protruding structures at the end portions of the interdigital electrodes; a protective layer formed on the protruding structures at the end portions of the interdigital electrodes; a first temperature compensation layer formed on the protective layer; a second temperature compensation layer formed on the first temperature compensation layer and on the central portions and the intermediate portions of the interdigital electrodes; and a passivation layer formed on the second temperature compensation layer.

First claim

The invention claimed is:

1 . A surface acoustic wave (SAW) device, comprising:
a substrate; an interdigital transducer (IDT) having lead-out portions and arrays of interdigital electrodes formed on the substrate, wherein the interdigital electrodes include central portions, end portions, and intermediate portions between the end portions and the lead-out portions, and a thickness of the interdigital electrodes at the end portions is greater than a thickness of the interdigital electrodes at the central portions and the intermediate portions, thereby forming protruding structures at the end portions of the interdigital electrodes; a first temperature compensation layer formed exclusively on the end portions of the interdigital electrodes; and a second temperature compensation layer formed on the end portions, the central portions, and the intermediate portions of the interdigital electrodes.

2 . The SAW device of claim 1 , wherein the arrays of interdigital electrodes include an array of first interdigital electrodes and an array of second interdigital electrodes, and
the lead-out portions of the IDT comprise:
a first lead-out portion connected to the array of first interdigital electrodes; and
a second lead-out portion connected to the array of second interdigital electrodes.

3 . The SAW device of claim 2 , wherein the first temperature compensation layer and the second temperature compensation layer cover portions of the first lead-out portion and the second lead-out portion.

4 . The SAW device of claim 3 , further comprising:
a first IDT via and a second IDT via formed in the second temperature compensation layer and the first temperature compensation layer, the first IDT via exposing a portion of the first lead-out portion, and the second IDT via exposing a portion of the second lead-out portion.

5 . The SAW device of claim 4 , further comprising:
a first pad metal layer formed in the first IDT via and electrically connected to the first lead-out portion; and a second pad metal layer formed in the second IDT via and electrically connected to the second lead-out portion.

6 . The SAW device of claim 5 , wherein a passivation layer covers the first pad metal layer and the second pad metal layer.

7 . The SAW device of claim 6 , further comprising:
a first pad contact window and a second pad contact window formed in the passivation layer, the first pad contact window exposing a portion of the first pad metal layer, and the second pad contact window exposing a portion of the second pad metal layer.

8 . The SAW device of claim 1 , further comprising a protective layer formed on the protruding structures at the end portions of the interdigital electrodes,
wherein the protective layer is formed of at least one of silicon nitride (SiN), aluminum nitride (AlN), gallium nitride (GaN), or amorphous silicon (α-Si).

9 . The SAW device of claim 8 , wherein the protective layer covers top surfaces and side surfaces of the protruding structures.

10 . The SAW device of claim 8 , wherein the first temperature compensation layer covers a portion of the protective layer that covers the top surfaces and the side surfaces of the protruding structures.

11 . The SAW device of claim 1 , wherein
the first temperature compensation layer and the second temperature compensation layer are formed between a passivation layer and the end portions of the interdigital electrodes, and only the second temperature compensation layer is formed between the passivation layer and the central portions and the intermediate portions of the interdigital electrodes.

12 . The SAW device of claim 1 , wherein the interdigital electrodes and the protruding structures are integrally formed from a same material, and
the protruding structures are aligned with the interdigital electrodes.

13 . The SAW device of claim 1 , wherein the first temperature compensation layer is formed of silicon oxide (SiO 2 ).

14 . The SAW device of claim 1 , wherein the second temperature compensation layer is formed of one of:
a single silicon oxide (SiO 2 ) layer; or a stacked combination of a silicon oxide (SiO 2 ) layer and a layer formed of at least one of silicon nitride (SiN), aluminum nitride (AlN), gallium nitride (GaN), or amorphous silicon (α-Si).

15 . The SAW device of claim 1 , wherein a passivation layer is formed of at least one of silicon nitride (SiN), aluminum nitride (AlN), gallium nitride (GaN), or amorphous silicon (α-Si).

16 . The SAW device of claim 1 , wherein the substrate is formed of a piezoelectric material.

Assignees

• Shenzhen Newsonic Tech Co Ltd

Inventors

• Wang Jian

Classifications

• H03H9/059

  consisting of mounting pads or bumps · CPC title

• H03H9/02661

  being located inside the interdigital transducers · CPC title

• H03H9/14538

  Formation · CPC title

• H03H9/02834 Primary

  of temperature influence (cut angles H03H9/02543) · CPC title

• H03H9/02881

  of diffraction of wave beam · CPC title