Acoustic wave resonator, filter, and multiplexer

Patent metadata

Field	Value
Publication number	US-10938371-B2
Application number	US-201815958756-A
Country	US
Kind code	B2
Filing date	Apr 20, 2018
Priority date	May 1, 2017
Publication date	Mar 2, 2021
Grant date	Mar 2, 2021

Abstract

An acoustic wave resonator includes: an IDT located on a piezoelectric substrate, including comb-shaped electrodes facing each other and including electrode fingers and a bus bar connecting the electrode fingers; a first silicon oxide film located on the electrode fingers in an overlap region where the electrode fingers overlap and having a film thickness in a part of edge regions, which correspond to both ends of the overlap region, equal to or less than that in a center region sandwiched between the edge regions; and a second silicon oxide film located on the electrode fingers, containing an element slowing an acoustic velocity in a silicon oxide film when being added to the silicon oxide film, having a concentration of the element greater than that in the first silicon oxide film, and having a film thickness in a part of the edge regions greater than that in the center region.

First claim

What is claimed is:

1. An acoustic wave resonator comprising:
a piezoelectric substrate;
an IDT that is located on the piezoelectric substrate, and includes a pair of comb-shaped electrodes facing each other, each of the pair of comb-shaped electrodes including electrode fingers, which excite an acoustic wave, and a bus bar connecting the electrode fingers;
a first silicon oxide film located on the electrode fingers in an overlap region where the electrode fingers of the pair of comb-shaped electrodes overlap, a film thickness of the first silicon oxide film in at least a part of at least one of edge regions being equal to or less than a film thickness of the first silicon oxide film in a center region, the edge regions corresponding to both ends of the overlap region in an extension direction of the electrode fingers, the center region being sandwiched between the edge regions within the overlap region; and
a second silicon oxide film that is located on the electrode fingers in the overlap region and contains an element or molecule that slows an acoustic velocity in a silicon oxide film when being added to the silicon oxide film, a concentration of the element or molecule in the second silicon oxide film being greater than that in the first silicon oxide film, and a film thickness of the second silicon oxide film in at least a part of at least one of the edge regions being greater than a film thickness of the second silicon oxide film in the center region.

2. The acoustic wave resonator according to claim 1 , wherein
the element or molecule is at least one of F, H, CH 3 , CH 2 , Cl, C, N, P, B, and S.

3. The acoustic wave resonator according to claim 1 , wherein
the element or molecule is F.

4. The acoustic wave resonator according to claim 1 , wherein
the first silicon oxide film does not substantially contain the element or molecule.

5. The acoustic wave resonator according to claim 1 , wherein
the first silicon oxide film contains the element or molecule.

6. The acoustic wave resonator according to claim 1 , wherein
an upper surface of a silicon oxide film that is at least one of the first silicon oxide film and the second silicon oxide film that is exposed to air is substantially flat.

7. The acoustic wave resonator according to claim 1 , wherein
the second silicon oxide film is located on at least a part of the bus bar.

8. The acoustic wave resonator according to claim 1 , wherein
in the edge region, the second silicon oxide film is thicker than the first silicon oxide film.

9. The acoustic wave resonator according to claim 1 , wherein
the first silicon oxide film is in contact with the second silicon oxide film.

10. The acoustic wave resonator according to claim 1 , further comprising
a third silicon oxide film that is located on the electrode fingers in the overlap region, a concentration of the element or molecule in the third silicon oxide film being greater the concentration of the element or molecule in the first silicon oxide film and less than the concentration of the element or molecule in the second silicon oxide film, a film thickness of the third silicon oxide film in at least a part of at least one of the edge regions being equal to or less than a film thickness of the third silicon oxide film in the center region.

11. The acoustic wave resonator according to claim 10 , wherein
the third silicon oxide film is located between the first silicon oxide film and the second silicon oxide film.

12. The acoustic wave resonator according to claim 10 , wherein
the third silicon oxide film is located on the first silicon oxide film and the second silicon oxide film.

13. The acoustic wave resonator according to claim 12 , wherein
an upper surface of the third silicon oxide film is exposed to air and is substantially flat.

14. The acoustic wave resonator according to claim 1 , wherein
the piezoelectric substrate is a lithium niobate substrate or a lithium tantalate substrate.

15. A filter comprising:
an acoustic wave resonator including:
a piezoelectric substrate;
an IDT that is located on the piezoelectric substrate, and includes a pair of comb-shaped electrodes facing each other, each of the pair of comb-shaped electrodes including electrode fingers, which excite an acoustic wave, and a bus bar connecting the electrode fingers;
a first silicon oxide film located on the electrode fingers in an overlap region where the electrode fingers of the pair of comb-shaped electrodes overlap, a film thickness of the first silicon oxide film in at least a part of at least one of edge regions being equal to or less than a film thickness of the first silicon oxide film in a center region, the edge regions corresponding to both ends of the overlap region in an extension direction of the electrode fingers, the center region being sandwiched between the edge regions within the overlap region; and
a second silicon oxide film that is located on the electrode fingers in the overlap region and contains an element or molecule that slows an acoustic velocity in a silicon oxide film when being added to the silicon oxide film, a concentration of the element or molecule in the second silicon oxide film being greater than that in the first silicon oxide film, and a film thickness of the second silicon oxide film in at least a part of at least one of the edge regions being greater than a film thickness of the second silicon oxide film in the center region.

16. A multiplexer comprising:
a filter including an acoustic wave resonator, wherein
the acoustic wave resonator includes:
a piezoelectric substrate;
an IDT that is located on the piezoelectric substrate, and includes a pair of comb-shaped electrodes facing each other, each of the pair of comb-shaped electrodes including electrode fingers, which excite an acoustic wave, and a bus bar connecting the electrode fingers;
a first silicon oxide film located on the electrode fingers in an overlap region where the electrode fingers of the pair of comb-shaped electrodes overlap, a film thickness of the first silicon oxide film in at least a part of at least one of edge regions being equal to or less than a film thickness of the first silicon oxide film in a center region, the edge regions corresponding to both ends of the overlap region in an extension direction of the electrode fingers, the center region being sandwiched between the edge regions within the overlap region; and
a second silicon oxide film that is located on the electrode fingers in the overlap region and contains an element or molecule that slows an acoustic velocity in a silicon oxide film when being added to the silicon oxide film, a concentration of the element or molecule in the second silicon oxide film being greater than that in the first silicon oxide film, and a film thickness of the second silicon oxide film in at least a part of at least one of the edge regions being greater than a film thickness of the second silicon oxide film in the center region.

Assignees

• Taiyo Yuden Kk

Inventors

• Nakamura Kentaro
• Matsukura Fumiya
• Imasu Satoshi
• Matsuda Takashi

Classifications

• H03H9/02834 Primary

  of temperature influence (cut angles H03H9/02543) · CPC title

• H03H9/02858

  of wave front distortion · CPC title

• H03H9/6483

  Ladder SAW filters · CPC title

• H03H9/54

  comprising resonators of piezoelectric or electrostrictive material (comprising resonators using surface acoustic waves H03H9/64) · CPC title

• H03H9/02992

  Details of bus bars, contact pads or other electrical connections for finger electrodes · CPC title