Antenna module, antenna supporting substrate and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12476378-B2
Application number	US-202318461497-A
Country	US
Kind code	B2
Filing date	Sep 5, 2023
Priority date	Oct 19, 2022
Publication date	Nov 18, 2025
Grant date	Nov 18, 2025

Abstract

An antenna module is provided, in which an antenna supporting substrate having a step-shaped hollow cavity is disposed on a circuit structure having an antenna part, so that the antenna part is exposed from the step-shaped hollow cavity, and an antenna structure is arranged on the steps of the step-shaped hollow cavity to cover the antenna part and is electromagnetically coupled with the antenna part, and there is no barrier but an air medium between the antenna structure and the antenna part.

First claim

What is claimed is:

1 . An antenna supporting substrate, comprising:
an insulator having a first surface and a second surface opposing the first surface; and a step-shaped hollow cavity connecting the first surface and the second surface and presenting a plurality of steps, wherein the step-shaped hollow cavity has a plurality of openings, and widths of the plurality of openings increase gradually and sequentially from the first surface to the second surface to form the plurality of steps.

2 . The antenna supporting substrate of claim 1 , wherein the insulator further has an electrical conduction circuit.

3 . An antenna module, comprising:
a circuit structure having a first side and a second side opposing the first side, and at least one antenna part formed on the second side; the antenna supporting substrate of claim 1 bonded onto the second side of the circuit structure via the first surface, wherein the antenna part is exposed from the step-shaped hollow cavity; and at least one antenna structure comprising an antenna substrate made of an insulating material and an antenna layer bonded to the antenna substrate, wherein the antenna substrate of the antenna structure is straddled on one of the steps of the step-shaped hollow cavity of the antenna supporting substrate, and the antenna layer of the antenna structure is stacked above corresponding to the antenna part of the circuit structure, so that the antenna layer and the antenna part are electromagnetically coupled to each other, and between the antenna structure and the antenna part is a hollow space with an air medium.

4 . The antenna module of claim 3 , wherein the antenna supporting substrate further has an electrical conduction circuit for electrically connecting the circuit structure and/or the antenna structure.

5 . The antenna module of claim 3 , wherein a plurality of the antenna parts are provided on the second side of the circuit structure, a plurality of the corresponding antenna structures are straddled on a plurality of layers of the steps in the antenna supporting substrate respectively, and a number of layers of the plurality of antenna structures corresponds to the plurality of antenna parts, wherein all the antenna structures between the antenna layer of the antenna substrate of any one of the antenna structures and the antenna part of the circuit structure have an opening corresponding to the antenna part, so that there is no barrier but an air medium between the antenna layer of the antenna substrate of any one of the antenna structures and the corresponding antenna part.

6 . A method of manufacturing an antenna supporting substrate, comprising:
providing a detachable carrier board with a metal surface; forming a photoresist layer with a hollow cavity on the carrier board by patterned exposure and development, and forming a metal layer by electroplating in the hollow cavity of the photoresist layer; repeating processes of the photoresist layer and the metal layer multiple times to form a plurality of other photoresist layers and a plurality of other metal layers stacked on the photoresist layer and the metal layer, wherein a width of each of the stacked metal layers decreases gradually from bottom to top in a stepped shape; removing all the photoresist layers to expose the plurality of metal layers stacked in the stepped shape; forming an insulating layer made of an insulating material on the carrier board to cover the plurality of metal layers stacked in the stepped shape, and removing part of the insulating material to expose an upper surface of the uppermost metal layer; removing the carrier board to expose a lower surface of the lowermost metal layer; and removing all of the plurality of metal layers, so that the insulating layer is formed into the antenna supporting substrate having a step-shaped hollow cavity presenting a plurality of steps.

7 . The method of claim 6 , further comprising simultaneously forming a patterned concave hole around the hollow cavity when the hollow cavity of the photoresist layer of each layer is formed, and simultaneously forming an electrical conduction circuit in the concave hole when each of the metal layers is formed.

8 . A method of manufacturing an antenna supporting substrate, comprising:
providing a detachable carrier board; forming a photoresist layer on the carrier board by patterned exposure and development; repeating processes of the photoresist layer multiple times to form a plurality of other photoresist layers stacked on the photoresist layer, wherein a width of each of the stacked photoresist layers decreases gradually from bottom to top in a stepped shape; forming an insulating layer made of an insulating material on the carrier board to cover all the photoresist layers, and removing part of the insulating material to expose an upper surface of the uppermost photoresist layer; removing the carrier board to expose a lower surface of the lowermost photoresist layer; and removing all of the photoresist layers, so that the insulating layer is formed into the antenna supporting substrate having a step-shaped hollow cavity presenting a plurality of steps.

9 . The method of claim 8 , further comprising forming a patterned electrical conduction circuit around any one of the photoresist layers after forming said any one of the photoresist layers.

10 . A method of manufacturing an antenna supporting substrate, comprising:
providing a detachable carrier board; forming a photosensitive insulating layer made of a photosensitive insulating material on the carrier board, and forming an opening area for defining a hollow cavity by patterning in an exposure manner; repeating processes of the photosensitive insulating layer and the opening area multiple times to form a plurality of other stacked photosensitive insulating layers and define a corresponding plurality of opening areas, wherein a width of each of the stacked opening areas decreases gradually from bottom to top in a stepped shape; removing the carrier board to expose a lower surface of the lowermost photosensitive insulating layer; and removing the photosensitive insulating material in each of the opening areas, so that the plurality of stacked photosensitive insulating layers are formed into the antenna supporting substrate having a step-shaped hollow cavity presenting a plurality of steps.

11 . The method of claim 10 , further comprising simultaneously defining a patterned concave hole around the opening area when the opening area of the hollow cavity of each of the photosensitive insulating layers is defined, and forming an electrical conduction circuit in the concave hole.

Assignees

• Phoenix Pioneer Technology Co Ltd

Inventors

• Chou Pao-Hung
• Hsu Shih-Ping

Classifications

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H05K3/0011

  Working of insulating substrates or insulating layers · CPC title

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q13/18 Primary

  the slot being backed by, or formed in boundary wall of, a resonant cavity (longitudinally slotted cylinder H01Q13/12 ){; Open cavity antennas} · CPC title