Antenna filter and electronic device including same in wireless communication system

Patent metadata

Field	Value
Publication number	US-12470259-B2
Application number	US-202318154433-A
Country	US
Kind code	B2
Filing date	Jan 13, 2023
Priority date	Jul 23, 2020
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

The disclosure relates to a 5 th generation (5G) or pre-5G communication system for supporting a higher data transfer rate than a 4 th generation (4G) communication system, such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a filter for filtering a radio frequency (RF) signal, and a sub printed circuit board (PCB), the sub-PCB comprises a passive circuit for processing the RF signal, and, the sub-PCB may be coupled to the filter such that the filter operates as a bumper when being coupled to a filter board.

First claim

What is claimed is:

1 . An antenna module comprising:
at least one antenna array including a plurality of antenna elements; at least one radio frequency (RF) chip; a board including a plurality of RF components for a plurality of RF paths; a plurality of ceramic waveguide filters, each of the plurality of ceramic waveguide filters being disposed in a RF path of the plurality of RF paths; and a plurality of sub-boards functioning as a bumper, each of the plurality of the sub-boards being coupled to a corresponding ceramic waveguide filter, wherein the each of the plurality of the sub-boards includes, for the corresponding ceramic waveguide filter, an input port and an output port formed of a via, and a low-pass filter (LPF) for filtering an RF signal applied to the input port, and wherein the plurality of sub-boards are disposed between the plurality of ceramic waveguide filters and the board.

2 . The antenna module of claim 1 ,
wherein the board includes at least one RF component for a beamforming calibration; and wherein each of the plurality of the sub-boards includes a coupler for beamforming calibration.

3 . The antenna module of claim 2 , wherein each of the plurality of the sub-boards includes a connector for an RF interface.

4 . The antenna module of claim 3 ,
wherein each of the plurality of the sub-boards includes multiple layers.

5 . The antenna module of claim 4 ,
wherein the LPF is mounted on a first layer of the multiple layers, wherein the coupler is mounted on a second layer of the multiple layers, and wherein the connector is mounted on a third layer of the multiple layers.

6 . The antenna module of claim 1 , wherein each of the plurality of the sub-boards includes a groove structure for a direct matching connection unit or a blind matching connection unit.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Jeon Danbi
• Koo Bonmin
• Kim Jonghwa
• Kim Jihye
• Na Inho
• Shin Dongsik
• Yoon Seunghwan
• Zeong Jongwook

Classifications

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H05K2201/1006

  Non-printed filter · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title

• H01P1/207 Primary

  Hollow waveguide filters (H01P1/212, H01P1/213, H01P1/215, H01P1/219 take precedence) · CPC title