Dielectric-filled surface-mounted waveguide devices and methods for coupling microwave energy

Patent metadata

Field	Value
Publication number	US-9979062-B2
Application number	US-201615055636-A
Country	US
Kind code	B2
Filing date	Feb 29, 2016
Priority date	Mar 4, 2015
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

Dielectric-filled surface-mounted waveguide devices and methods for coupling microwave energy. In some embodiments, a radio-frequency (RF) waveguide can include a dielectric block having a first edge that joins a mounting surface and a first adjacent surface. The RF waveguide can further include a conductive coating that substantially covers the dielectric block. The conductive coating can define a wrap-around opening that exposes the dielectric block along the first edge. The wrap-around opening can include a strip on the first adjacent surface along the first edge and a strip on the mounting surface along the first edge.

First claim

What is claimed is:

1. A radio-frequency (RF) waveguide comprising:
a dielectric block having a first edge that joins a mounting surface and a first adjacent surface; and
a conductive coating that substantially covers the dielectric block, the conductive coating defining a wrap-around opening that exposes the dielectric block along the first edge, the wrap-around opening including a strip on the first adjacent surface along the first edge and a strip on the mounting surface along the first edge, such that the first edge of the dielectric block is continuously exposed within the wrap-around opening.

2. The RF waveguide of claim 1 wherein the mounting surface includes a bottom surface when the RF waveguide is oriented to be mounted.

3. The RF waveguide of claim 2 wherein the dielectric block has a rectangular box shape.

4. The RF waveguide of claim 3 wherein the adjacent surface includes a first end wall surface.

5. The RF waveguide of claim 4 wherein the conductive coating further defines a second wrap-around opening along a second edge that joins the bottom surface and a second end wall surface that is opposite the first end wall surface, the second wrap-around opening exposing the corresponding portion of the dielectric block.

6. The RF waveguide of claim 3 wherein the adjacent surface includes a side wall surface.

7. The RF waveguide of claim 6 wherein the wrap-around opening is implemented along the first edge and near a first end of the rectangular box shape.

8. The RF waveguide of claim 7 wherein the conductive coating further defines a second wrap-around opening along the first edge and near a second end of the rectangular box shape, the second wrap-around opening exposing the corresponding portion of the dielectric block.

9. The RF waveguide of claim 2 wherein the wrap-around opening is configured to allow a signal trace on a surface of a circuit board to extend underneath the wrap-around opening and couple to the wrap-around opening.

10. The RF waveguide of claim 9 wherein the wrap-around opening allows coupling with the signal trace without shorting with another portion of the conductive coating about the wrap-around opening.

11. The RF waveguide of claim 10 wherein the wrap-around opening is configured to allow one or more grounding connections to be made on the surface of the circuit board.

12. The RF waveguide of claim 11 wherein the wrap-around opening is dimensioned to allow the grounding connections to be made at both ends of the strip on the bottom surface along the first edge.

13. The RF waveguide of claim 2 wherein the dielectric block includes ceramic material.

14. A method for fabricating a radio-frequency (RF) waveguide, the method comprising:
forming or providing a dielectric block having a first edge that joins a mounting surface and a first adjacent surface; and
covering the dielectric block with a conductive material to define a wrap-around opening that exposes the dielectric block along the first edge, the wrap-around opening including a strip on the first adjacent surface along the first edge and a strip on the mounting surface along the first edge, such that the first edge of the dielectric block is continuously exposed within the wrap-around opening.

15. The method of claim 14 wherein the covering includes masking an area corresponding to the wrap-around opening, metallizing the dielectric block, and removing the mask to yield the wrap-around opening.

16. The method of claim 14 wherein the covering includes metallizing the dielectric block, and removing the metallization at an area corresponding to the wrap-around opening.

17. A radio-frequency (RF) device comprising:
a substrate configured to receive one or more components; and
an RF waveguide mounted on the substrate, the RF waveguide including a dielectric block having a first edge that joins a mounting surface and a first adjacent surface, the RF waveguide further including a conductive coating that substantially covers the dielectric block, the conductive coating defining a wrap-around opening that exposes the dielectric block along the first edge, the wrap-around opening including a strip on the first adjacent surface along the first edge and a strip on the mounting surface along the first edge, such that the first edge of the dielectric block is continuously exposed within the wrap-around opening.

18. The RF device of claim 17 further comprising a signal trace implemented substantially on a surface of the substrate, the signal trace having an end configured to form a direct electrical contact with the conductive coating of the RF waveguide at or near an edge of the strip on the mounting surface of the RF waveguide.

19. The RF device of claim 18 further comprising one or more ground traces implemented substantially on the surface of the substrate, each ground trace having an end configured to form a direct electrical contact with the conductive coating at or near an end of the strip on the mounting surface of the RF waveguide.

20. The RF device of claim 17 wherein the RF device is an RF filter.

Assignees

• Skyworks Solutions Inc

Inventors

• Deriso John Christopher

Classifications

• H01P1/2088

  Integrated in a substrate · CPC title

• H01P1/2002 Primary

  Dielectric waveguide filters (H01P1/212, H01P1/213, H01P1/215, H01P1/219 take precedence) · CPC title

• H01P3/122

  Dielectric loaded (not air) · CPC title

• H04B1/40

  Circuits · CPC title

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title