Method for manufacturing multilayer coil component

Patent metadata

Field	Value
Publication number	US-12469639-B2
Application number	US-202217686599-A
Country	US
Kind code	B2
Filing date	Mar 4, 2022
Priority date	Mar 9, 2021
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

A method for manufacturing a multilayer coil component 1 includes forming a plurality of insulator layers by a photolithography method using a photosensitive insulator paste, forming a plurality of conductors and via conductors by a photolithography method using a photosensitive conductive paste, a step of forming a first conductor, a step of forming a first insulator layer around the first conductor such that it becomes even with an upper surface of the first conductor, a step of forming a second insulator layer provided with a via hole on the first conductor and the first insulator layer, and a step of forming a second conductor connected to the first conductor via the via hole on the second insulator layer.

First claim

What is claimed is:

1 . A method for manufacturing a multilayer coil component including
an element body formed to have a plurality of insulator layers layered therein, and a coil disposed inside the element body and constituted to include a plurality of conductors and via conductors connecting the corresponding conductors to each other, the method for manufacturing a multilayer coil component comprising:
forming the plurality of insulator layers by a photolithography method using a photosensitive insulator paste;
forming the plurality of conductors and the via conductors by a photolithography method using a photosensitive conductive paste;
a step of forming a first conductor;
a step of forming a first insulator layer provided around the first conductor such that the first insulator layer becomes even with an upper surface of the first conductor;
after the step of forming the first insulator layer, performing a step of forming a second insulator layer with a via hole exposing a part of the first conductor, the via hole extending through the second insulator layer, the second insulator layer being disposed on the first conductor and the first insulator layer; and
a step of forming a second conductor connected to the first conductor via the via hole on the second insulator layer.

2 . The method for manufacturing a multilayer coil component according to claim 1 ,
wherein in the step of forming the first insulator layer, after an entire area of a region including the first conductor is coated with the photosensitive insulator paste, the photosensitive insulator paste on the first conductor is removed.

3 . The method for manufacturing a multilayer coil component according to claim 1 ,
wherein in the step of forming the second conductor, the second conductor and the via conductors are formed at the same time by filling the via hole with the photosensitive conductive paste.

4 . The method for manufacturing a multilayer coil component according to claim 1 ,
wherein in the step of forming the first insulator layer, a thickness of the photosensitive conductive paste for coating an area around the first conductor is caused to be larger than a thickness of the photosensitive conductive paste for coating the first conductor from above.

Assignees

• Tdk Corp

Inventors

• ISHIMA Yuya
• Kondo Shinichi
• Ito Kosuke
• Hattori Shingo

Classifications

• H01F41/12

  Insulating of windings ({impregnating or encapsulating of transformers H01F41/005} ; of conductors in general H01B13/06) · CPC title

• G03F7/0035

  Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface · CPC title

• H01F41/122

  Insulating between turns or between winding layers · CPC title

• H01F41/043 Primary

  by thick film techniques · CPC title

• H01F17/0013 Primary

  with stacked layers · CPC title