Roll film, method for producing roll film, method for producing copper-clad laminate and method for producing printed board

Patent metadata

Field	Value
Publication number	US-12466927-B2
Application number	US-202418588831-A
Country	US
Kind code	B2
Filing date	Feb 27, 2024
Priority date	Apr 20, 2018
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

To provide a dielectric film which is excellent in dielectric properties and stability in the electric corrosion test and which is suitable for producing a high-precision printed board.A roll film comprising a melt-processable fluororesin as the main component and having a thickness of from 1 to 100 μm, the dimensional change rate of which is less than 1.0%, in terms of an absolute value, in each of MD and TD, when heated at 150° C. for 30 minutes and then cooled to 25° C., based on the dimension at 25° C.

First claim

What is claimed is:

1 . A method for producing a roll film, the method comprising:
subjecting a film comprising a melt-processable fluororesin as the main component and having a thickness of from 1 to 100 μm to annealing treatment at from a temperature lower by 210° C. than the melting temperature (Tm) of the melt-processable fluororesin to a temperature lower by 20° C. than Tm and then winding the film, wherein the roll film comprises a melt-processable fluororesin as the main component, has a thickness of from 1 to 100 μm, and has a dimensional change rate of less than 1.0%, in terms of an absolute value, in each of MD and TD, when heated at 150° C. for 30 minutes and then cooled to 25° C., based on the dimension at 25° C., and wherein the annealing treatment is carried out with a tension of from 1 to 10 N/m applied to the film.

2 . The method of claim 1 , wherein the annealing treatment is carried out with a tension of 1 to 5 N/m applied to the film.

3 . The method of claim 1 , wherein the film is wound with a tension of at most 500 N/m applied on the film.

4 . A method for producing a copper-clad laminate, the method comprising producing a roll film using the method of claim 1 ;
unwinding the roll film to produce an unwound film; and forming a copper layer on a surface of the unwound film.

5 . The method of claim 4 , which forms a copper layer having an AC resistance value of higher than 1.0×10 −9 Ω·cm.

6 . A method for producing a printed board, the method comprising
producing a copper-clad laminate by the method of claim 4 and etching the copper layer to form a patterned circuit.

Assignees

• Agc Inc

Inventors

• Kotera Seigo
• Kasai Wataru
• Nakamura Junetsu
• Yaoita Takatoshi

Classifications

• H05K2201/015

  Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] · CPC title

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title

• H05K1/056

  the metal substrate being covered by an organic insulating layer · CPC title

• C08J2327/18

  Homopolymers or copolymers of tetrafluoroethylene · CPC title

• C08J5/121

  by heating · CPC title