Solderable coating for additive manufactured oxidizing metals

Patent metadata

Field	Value
Publication number	US-12465987-B2
Application number	US-201916720445-A
Country	US
Kind code	B2
Filing date	Dec 19, 2019
Priority date	Dec 19, 2019
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

A method of manufacturing a compound object, such as an antenna, is disclosed. The method includes creating, via additive manufacturing, a first component formed at least in part of an oxidizing metal; applying, via vapor deposition, a solderable coating to at least a portion of the first component; and soldering at least a portion of the first component to a second component by applying a solder to the solderable coating of the first component. The oxidizing metal may be a titanium alloy, such as Ti-6Al-4V. The solderable coating may include copper and/or tin-lead.

First claim

Having thus described various embodiments of the invention, what is claimed as new and desired to be protected by Letters Patent includes the following:

1 . A method of manufacturing a radio device compound object, comprising:
creating, via additive manufacturing, an antenna formed at least in part of an oxidizing metal, wherein the antenna is configured to transmit and/or receive wireless signals and includes a base portion with two parallel arms extending transversely from the base portion along a shared plane; applying, via vacuum deposition, a solderable coating to at least a portion of the antenna; and soldering at least a portion of the antenna to a second component by applying a solder to the solderable coating of the antenna.

2 . The method of claim 1 , wherein the oxidizing metal from which at least a portion of the antenna is formed is a titanium alloy.

3 . The method of claim 2 , wherein the titanium alloy is Ti-6Al-4V.

4 . The method of claim 1 , wherein the oxidizing metal from which at least a portion of the antenna is formed is an aluminum alloy.

5 . The method of claim 1 , wherein the solderable coating includes at least one of copper or tin-lead.

6 . The method of claim 1 , further comprising:
preparing a surface of the antenna, such that the antenna will accept the solderable coating.

7 . The method of claim 1 ,
wherein the second component is a radio frequency transmission line.

8 . A method of manufacturing a radio device compound object, the method comprising:
creating, via additive manufacturing, a three-dimensional antenna formed at least in part of an oxidizing metal, wherein the three-dimensional antenna is configured to transmit and/or receive wireless signals and includes a base portion with two parallel arms extending transversely from the base portion along a shared plane; applying, via vacuum deposition, a first solderable coating to at least a portion of the three-dimensional antenna for soldering; and soldering the three-dimensional antenna to a second component by applying a solder to the first solderable coating of the three-dimensional antenna.

9 . The method of claim 8 , wherein the second component comprises an electrically conductive material.

10 . The method of claim 8 , further comprising forming, via additive manufacturing, the second component.

11 . The method of claim 8 , further comprising applying, via physical vapor deposition, a second solderable coating to at least a portion of the second component.

12 . The method of claim 8 , wherein the oxidizing metal comprises a titanium alloy.

13 . The method of claim 12 , wherein the first solderable coating comprises at least one of copper, tin, or lead.

14 . The method of claim 8 , wherein the second component is a radio frequency transmission line.

15 . A method of manufacturing a radio device compound object, the method comprising:
creating, via additive manufacturing, a three-dimensional antenna formed at least in part of a titanium alloy, wherein the three-dimensional antenna is configured to transmit and/or receive wireless signals and includes a base portion with two parallel arms extending transversely from the base portion along a shared plane; applying, via physical vapor deposition, a first solderable coating to at least a portion of the three-dimensional antenna for soldering, the first solderable coating comprising at least one of copper, tin, or lead; forming, via additive manufacturing, a second component formed at least in part of electrically conductive material; and soldering the three-dimensional antenna to the second component by applying a solder to the first solderable coating of the three-dimensional antenna.

16 . The method of claim 15 , further comprising applying, via physical vapor deposition, a second solderable coating to at least a portion of the second component.

17 . The method of claim 15 , wherein the second component is a radio frequency transmission line.

Assignees

• Honeywell Federal Mfg & Tech Llc

Inventors

• Byers Kyle J
• Krueger Daniel Scott
• Walsh Michael
• Price William

Classifications

• B23K2103/12

  Copper or alloys thereof · CPC title

• C23C14/16

  on metallic substrates or on substrates of boron or silicon · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title

• B23K2103/10

  Aluminium or alloys thereof · CPC title

• B23K2103/14

  Titanium or alloys thereof · CPC title