Electroplating of niobium titanium

US2020136223A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020136223-A1
Application numberUS-201816170760-A
CountryUS
Kind codeA1
Filing dateOct 25, 2018
Priority dateOct 25, 2018
Publication dateApr 30, 2020
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

First claim

Opening claim text (preview).

What is claimed is: 1 . A structure, comprising: a niobium titanium substrate; and a metal layer plated on a portion of the niobium titanium substrate. 2 . The structure of claim 1 , wherein the metal layer comprises an electroplated metal layer plated on the portion of the niobium titanium substrate using electroplating. 3 . The structure of claim 1 , wherein the metal layer comprises a metal selected from a group consisting of copper and nickel. 4 . The structure of claim 1 , wherein the metal layer comprises a first layer of nickel adhered directly to a surface of the portion of the niobium titanium substrate, and second layer of copper adhered to the first layer of nickel. 5 . The structure of claim 1 , further comprising: a metal contact surface soldered to the metal layer. 6 . The structure of claim 5 , wherein the metal contact surface comprises copper. 7 . The structure of claim 5 , wherein the metal contact surface comprises a surface of a coaxial connector. 8 . The structure of claim 7 , wherein the coaxial connector comprises a microwave coaxial connector. 9 . The structure of claim 7 , wherein the coaxial connector comprises a sub-miniature version A (SMA) type connector. 10 . The structure of claim 1 , wherein the niobium titanium substrate comprises a niobium titanium wire. 11 . A cable assembly, comprising: a niobium titanium wire; a metal layer plated on a first portion of the niobium titanium wire; and a metal coaxial connector soldered to the metal layer. 12 . The cable assembly of claim 11 , wherein the metal layer comprises an electroplated metal layer plated on the first portion of the niobium titanium wire using electroplating. 13 . The cable assembly of claim 11 , wherein the metal layer comprises a metal selected from a group consisting of copper and nickel. 14 . The cable assembly of claim 11 , wherein the metal coaxial connector comprises a microwave connector. 15 . The cable assembly of claim 11 , further comprising: a qubit attached to the metal coaxial connector; and an amplifier attached to a second portion of the niobium titanium wire. 16 . A method, comprising: preparing a surface of a niobium titanium substrate, resulting in a prepared surface, wherein the preparing comprises sanding the surface of the niobium titanium substrate; and electroplating a metal film onto the prepared surface, wherein the metal film comprises a metal selected from a group consisting of nickel and copper. 17 . The method of claim 16 , wherein the preparing further comprises, prior to the sanding, polishing the surface of the niobium titanium substrate using a mechanical polishing wheel. 18 . The method of claim 16 , wherein the preparing further comprises, after the sanding, dipping the surface of the niobium titanium substrate in a hydrochloric acid solution. 19 . The method of claim 16 , further comprising: soldering a metal surface to the metal film. 20 . The method of claim 16 , wherein the niobium titanium substrate comprises a niobium titanium wire.

Assignees

Inventors

Classifications

  • Co-axial cables with at least one metal deposit conductor · CPC title

  • mainly consisting of metals or alloys · CPC title

  • Alloys of Nickel and Cobalt and Chromium · CPC title

  • Dissimilar materials · CPC title

  • Multilayered materials · CPC title

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What does patent US2020136223A1 cover?
The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal l…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification B23K1/0016. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Apr 30 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).