Devices and methods for controlling wafer uniformity in plasma-based process

Patent metadata

Field	Value
Publication number	US-12463016-B2
Application number	US-202217874124-A
Country	US
Kind code	B2
Filing date	Jul 26, 2022
Priority date	Jul 31, 2018
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

Devices and methods for controlling wafer uniformity in plasma-based process is disclosed. In one example, a device for plasma-based processes is disclosed. The device includes: a housing defining a process chamber and a gas distribution plate (GDP) arranged in the process chamber. The housing comprises: a gas inlet configured to receive a process gas, and a gas outlet configured to expel processed gas. The GDP is configured to distribute the process gas within the process chamber. The GDP has a plurality of holes evenly distributed thereon. The GDP comprises a first zone and a second zone. The first zone is closer to the gas outlet than the second zone. At least one hole in the first zone is closed.

First claim

What is claimed is:

1 . A method for making a gas distribution plate (GDP) of a semiconductor process chamber, the method comprising:
providing a process chamber, the process chamber comprising a gas inlet configured to receive a process gas and further comprising a gas outlet at a lateral side of the process chamber configured to expel a processed gas; from a top view, determining a first position of the gas outlet and a second position of the gas inlet in the process chamber, wherein the gas outlet does not overlap with the gas inlet from the top view; determining positions of a first zone and a second zone of the GDP that has a plurality of holes evenly distributed thereon; and refining the GDP based on the first position, the second position, and the positions of the first zone and the second zone, wherein the GDP is to be arranged in the process chamber and configured to distribute the process gas within the process chamber, the first zone is closer to the gas outlet than the second zone, and at least one hole in the first zone is closed based on the refining, and wherein the refining comprises:
dividing the second zone into a first sub-zone and a second sub-zone that are located on different sides of the gas inlet based on the second position, wherein the first sub-zone comprises a first plurality of holes each of which has a first diameter and the second sub-zone comprises a second plurality of holes each of which has a second diameter; and
increasing the first diameter to be larger than the second diameter when the first sub-zone is closer to the gas outlet than the second sub-zone.

2 . The method of claim 1 , wherein refining the GDP comprises:
determining the first zone is closer to the gas outlet than the second zone by determining that: a first average distance between each hole of the first zone and the first position of the gas outlet is shorter than a second average distance between each hole of the second zone and the first position of the gas outlet.

3 . The method of claim 1 , wherein refining the GDP comprises:
closing all holes in the first zone; and opening all holes in the second zone.

4 . The method of claim 1 ,
wherein the first plurality of holes have a first density of distribution on the GDP and the second plurality of holes have a second density of distribution on the GDP.

5 . The method of claim 1 , wherein the refining comprises filling the at least one hole in the first zone to close the at least one hole.

6 . A method of making a semiconductor processing system, comprising:
providing a process chamber, the process chamber comprising:
a gas inlet configured to receive a process gas, and
a gas outlet configured to expel a processed gas;
providing a gas distribution plate (GDP) arranged in the process chamber and configured to distribute the process gas within the process chamber to achieve a silicon etching uniformity less than a threshold, the GDP comprising:
an annular body that extends laterally from an inner sidewall to an outer sidewall and consists of a first zone, a second zone, and a third zone positioned within the annular body, wherein the first, second, and third zones form an entirety of the annular body;
a first plurality of holes extending through the third zone of the annular body from a lower surface of the annular body toward an upper surface of the annular body; and
a second plurality of holes extending through the second zone of the annular body from the lower surface of the annular body toward the upper surface of the annular body,
wherein, from a top view, a first average distance between each of the first plurality of holes and a position of the gas outlet is shorter than a second average distance between each of the second plurality of holes and the position of the gas outlet, wherein a minimum value of a first diameter of each of the first plurality of holes is greater than a maximum value of a second diameter of each of the second plurality of holes, and wherein the first plurality of holes is smaller in number than that of the second plurality of holes.

7 . The method of claim 6 , wherein an average cross-sectional area of the first plurality of holes is greater than an average cross-sectional area of the second plurality of holes.

8 . The method of claim 6 , wherein the first zone is closer to the gas outlet than the second and third zones.

9 . The method of claim 6 , wherein the second zone and the third zone are located on different sides of the gas inlet.

10 . The method of claim 6 , wherein a total area of the first plurality of holes is the same as that of the second plurality of holes.

11 . The method of claim 6 , wherein the first zone has no open holes.

12 . The method of claim 6 , wherein:
the first diameter is in a range from about 0.48 mm to about 0.52 mm; and the second diameter is in a range from about 0.4 mm to about 0.46 mm.

13 . The method of claim 6 , wherein:
the second zone and the third zone are located on different sides of the gas inlet; the third zone comprises the first plurality of holes, which have a first average cross-sectional area; and the second zone comprises the second plurality of holes, which have a second average cross-sectional area that is less than the first cross-sectional average area.

14 . A method of making a semiconductor processing system, comprising:
providing a process chamber, the process chamber comprising:
a gas inlet configured to receive a process gas, and
a gas outlet configured to expel a processed gas; and
providing a gas distribution plate (GDP) arranged in the process chamber and configured to distribute the process gas within the process chamber to achieve a silicon etching uniformity less than 10%, the GDP comprising:
an annular body that extends laterally from an inner sidewall to an outer sidewall and consists of a first zone, a second zone, and a third zone positioned within the annular body, wherein the first, second, and third zones form an entirety of the annular body;
a first plurality of holes extending through the third zone of the annular body from a lower surface of the annular body toward an upper surface of the annular body; and
a second plurality of holes extending through the second zone of the annular body from the lower surface of the annular body toward the upper surface of the annular body,

wherein, from a top view, a first average distance between each of the first plurality of holes and a position of the gas outlet is shorter than a second average distance between each of the second plurality of holes and the position of the gas outlet,
wherein a first diameter of each of the first plurality of holes is in a range of 0.48 to 0.52 millimeters (mm) and a second diameter of each of the second plurality of holes is in a range of 0.4 to 0.46 mm, and
wherein the first plurality of holes is smaller in number than that of the second plurality of holes.

15 . The method of claim 14 , wherein the second zone and the third zone are located on different sides of the gas inlet.

16 . The method of claim 14 , wherein the first zone has no open holes.

17 . The method of claim 14 , wherein a total cross-sectional area of the first plurality of holes in the third zone is the same as a total cross-sectional area of the second plurality of holes in the second zone.

18 . The method of claim 14 , wherein the first zone is closer to the gas outlet than the second and third zones, and wherein the second zone and the third zone are located on different sides of

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Jr-Sheng
• Li An-Chi
• Huang Shih-Che
• Hsu Chih-Hsien
• Huang zhi-hao
• Wang Ming Chih
• Chiang Yu-Pei
• Chen chun yan

Classifications

• H10P72/0421

  for drying etching · CPC title

• G06F30/00

  Computer-aided design [CAD] · CPC title

• H01J37/3211

  Antennas, e.g. particular shapes of coils · CPC title

• H01J2237/3341

  Reactive etching · CPC title

• H01J2237/3343

  Problems associated with etching · CPC title