Patterned filament for fused filament fabrication

US12459196B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12459196-B2
Application numberUS-202017096112-A
CountryUS
Kind codeB2
Filing dateNov 12, 2020
Priority dateNov 14, 2019
Publication dateNov 4, 2025
Grant dateNov 4, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In general, techniques are described for a patterned filament for fused filament fabrication. An additive manufacturing system may include a substrate defining a major surface, a filament delivery device, and a computing device. The computing device may be configured to control the filament delivery device to deposit a filament on the substrate, the filament including a primary material and a first binder, where the primary material distributed in a pattern having a first cross sectional geometry that differs from a second cross sectional geometry of the filament, and the binder is configured to be substantially removed from the filament.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method comprising: fused filament fabricating a fused filament fabricated component by delivering a filament including a primary material and a sacrificial first binder, wherein the primary material is distributed in a pattern having a first cross sectional geometry that differs from a second cross sectional geometry defined by the filament, the sacrificial first binder supporting the distribution of the primary material in the pattern having the first cross sectional geometry that differs from the second sectional geometry of the filament, wherein: the sacrificial first binder comprises a first polymer that is soluble in a solvent that is an alcohol, the primary material comprises a second binder that comprises a second polymer, and the second polymer is not soluble in the solvent; substantially removing, via the solvent, the sacrificial first binder, wherein the removed sacrificial first binder is substantially free of the primary material; and heating, after substantially removing the sacrificial first binder, the fused filament fabricated component to sinter, at temperatures that avoid melting the filament, the primary material to form a sintered part comprising a metal foam, an alloy foam, or a ceramic foam having cavities. 2 . The method of claim 1 , wherein the primary material comprises a powder, the powder including a metal or an alloy. 3 . The method of claim 1 , wherein the primary material comprises a ceramic powder. 4 . The method of claim 1 , wherein the pattern comprises a regular polygon. 5 . The method of claim 2 , wherein the metal or the alloy includes an alloy that includes 9 to 10.0 wt. % W, 9 to 10.0 wt. % Co, 8 to 8.5 wt. % Cr, 5.4 to 5.7wt. % Al, about 3.0 wt. % Ta, about 1.0 wt. % Ti, about 0.7 wt. % Mo, about 0.5 wt. % Fe, about 0.015 wt. % B, and balance Ni. 6 . The method of claim 3 , wherein the ceramic powder includes silicon carbide (SiC). 7 . The method of claim 1 , wherein the first polymer comprises polystyrene (PS).

Assignees

Inventors

Classifications

  • Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

  • Processes of additive manufacturing · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

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Frequently asked questions

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What does patent US12459196B2 cover?
In general, techniques are described for a patterned filament for fused filament fabrication. An additive manufacturing system may include a substrate defining a major surface, a filament delivery device, and a computing device. The computing device may be configured to control the filament delivery device to deposit a filament on the substrate, the filament including a primary material and a f…
Who is the assignee on this patent?
Rolls Royce Corp, Rolls Royce Nam Tech Inc
What technology area does this patent fall under?
Primary CPC classification B29C64/118. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 04 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).