Laser processing apparatus, methods of laser-processing workpieces and related arrangements

Patent metadata

Field	Value
Publication number	US-12454029-B2
Application number	US-202117354680-A
Country	US
Kind code	B2
Filing date	Jun 22, 2021
Priority date	Sep 9, 2015
Publication date	Oct 28, 2025
Grant date	Oct 28, 2025

Abstract

Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.

First claim

What is claimed is:

1 . A method comprising:
scanning a beam of laser energy along a process trajectory to form a via in a workpiece,
wherein the process trajectory defines a sequence of spot locations to be addressed upon irradiating the workpiece with a plurality of laser pulses during formation of the via,
wherein the workpiece comprises an electrical conductor structure in thermal contact with a dielectric structure,
wherein the electrical conductor structure is positioned between a source of the beam of laser energy and the dielectric structure,

wherein characteristics of the beam of laser energy and the scanning are such that laser energy delivered to the spot locations:
a) heat a first region of the electrical conductor structure such that heat accumulating within the first region of the electrical conductor structure is transferred to the dielectric structure to vaporize a first region of the dielectric structure to create a pocket beneath the first region of the electrical conductor structure,
wherein the pocket comprises a high-pressure region between the first region of the dielectric structure and a first region of the electrical conductor structure, and

b) further heats the first region of the electrical conductor structure above the pocket such that the high pressure region ejects at least a portion of the heated first region of the electrical conductor structure from the workpiece.

2 . The method of claim 1 , wherein the beam of laser energy comprises at least one laser pulse has a wavelength of less than 1 μm.

3 . The method of claim 2 , wherein laser pulses are delivered to the workpiece at a pulse repetition rate greater than or equal to 100 MHz.

4 . The method of claim 1 , wherein the beam of laser energy comprises at least one laser pulse has a pulse duration greater than or equal to 1 ns.

5 . The method of claim 1 , wherein the beam of laser energy has an average power greater than or equal to 100 W.

6 . The method of claim 1 , wherein the laser energy delivered to the workpiece comprises a plurality of laser pulses and wherein, according to the scanning technique, a pulse repetition rate at which laser pulses irradiate the workpiece is greater than a rate with which different spot locations of the sequence of spot locations are addressed.

7 . The method of claim 1 , wherein the laser energy delivered to the workpiece comprises a plurality of laser pulses and wherein, according to the scanning technique, a pulse repetition rate at which laser pulses irradiate the workpiece is equal to a rate with which different spot locations of the sequence of spot locations are addressed.

8 . The method of claim 1 , wherein the laser energy delivered to the workpiece comprises a plurality of laser pulses and wherein, according to the scanning technique, a pulse repetition rate at which laser pulses irradiate workpiece is less than a rate with which different spot locations of the sequence of spot locations are addressed.

9 . The method of claim 1 , wherein, according to the scanning technique, the process spot is scanned such that a different spot location of the sequence of spot locations is addressed at a rate in a range from 50 kHz to 10 MHz.

10 . The method of claim 9 , wherein the rate is greater than 1 MHz.

11 . The method of claim 1 , wherein a pitch between one pair of adjacent spot locations in the sequence of spot locations is equal to a pitch between another pair of adjacent spot locations in the sequence of spot locations.

12 . The method of claim 1 , wherein, according to the scanning technique, a pitch between one pair of adjacent spot locations in the sequence of spot locations is different from a pitch between another pair of adjacent spot locations in the sequence of spot locations.

13 . The method of claim 1 , wherein, according to the scanning technique, a period of time during which one spot location of the sequence of spot locations is irradiated by laser energy is equal to a period of time during which another spot location of the sequence of spot locations is irradiated by laser energy.

14 . The method of claim 1 , wherein, according to the scanning technique, a period of time during which one spot location of the sequence of spot locations is irradiated by laser energy is different from a period of time during which another spot location of the sequence of spot locations is irradiated by laser energy.

15 . The method of claim 1 , wherein the process trajectory defines a sequence of spot locations arranged in a circular scan pattern.

16 . The method of claim 1 , wherein the laser energy delivered to the workpiece comprises a plurality of laser pulses and wherein, according to the scanning technique, laser pulses irradiating the workpiece at the sequence of spot locations heat the first region of the electrical conductor structure to at least 50% of the melting point of the electrical conductor structure.

17 . A method comprising:
scanning a beam of laser energy along a process trajectory to form a via in a workpiece,
wherein the process trajectory defines a sequence of spot locations to be addressed upon irradiating the workpiece with a plurality of laser pulses during formation of the via,
wherein the workpiece comprises an electrical conductor structure in thermal contact with a dielectric structure,
wherein the electrical conductor structure is positioned between a source of the beam of laser energy and the dielectric structure,
wherein laser pulses of the plurality of laser pulses have a wavelength of less than 1 μm and a pulse energy in a range from 100 μJ to 50 mJ over a time scale of at least one microsecond,

wherein characteristics of the beam of laser energy and the scanning are such that laser pulses delivered to the workpiece:
a) heat a first region of the electrical conductor structure such that heat accumulating within the first region of the electrical conductor structure is transferred to the dielectric structure to vaporize a first region of the dielectric structure to create a pocket beneath the first region of the electrical conductor structure,
wherein the pocket comprises a high-pressure region between the first region of the dielectric structure and a first region of the electrical conductor structure, and

b) further heats the first region of the electrical conductor structure above the pocket such that the high pressure region ejects at least a portion of the heated first region of the electrical conductor structure from the workpiece.

18 . The method of claim 17 , wherein the beam of laser energy has a wavelength in the visible green range of the electromagnetic spectrum.

19 . The method of claim 17 , wherein at least one laser pulse from the beam of laser energy is delivered to the same location on the workpiece to form the via in the workpiece.

20 . The method of claim 19 , wherein a plurality of laser pulses from the beam of laser energy are delivered to the same location on the workpiece over a time period in a range from 1 μs to 30 μs.

Assignees

• Electro Scient Ind Inc

Inventors

• Kleinert Jan
• Lin Zhibin
• Matsumoto Hisashi

Classifications

• B23K2103/54

  Glass · CPC title

• B23K26/703

  Cooling arrangements (by using a fluid stream B23K26/14) · CPC title

• B23K26/0622

  by shaping pulses · CPC title

• B23K26/082 Primary

  Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head · CPC title

• B23K26/382 Primary

  by boring · CPC title