Ultra-High Resolution Conductive Traces Flexible Biocomposites by Resist Stenciling
US-2020096869-A1 · Mar 26, 2020 · US
US12453014B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12453014-B2 |
| Application number | US-202117794026-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 22, 2021 |
| Priority date | Jan 23, 2020 |
| Publication date | Oct 21, 2025 |
| Grant date | Oct 21, 2025 |
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Official abstract text for this publication.
There is described a method of recovering parts of an electronic circuit having a self-supporting substrate having graphene oxide (GO) paper, and at least a conductive trace on the self-supporting substrate. The method generally has a step of immersing the electronic circuit into an environment-friendly solvent, the GO paper thereby dissociating from the conductive trace; and a step of recovering the GO paper from the environment-friendly solvent. The present disclosure also describes an electronic circuit generally having a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold; and at least a conductive trace on said self-supporting substrate. Further, there is also described a substrate for an electronic circuit in which the substrate generally has a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold.
Opening claim text (preview).
What is claimed is: 1. A method of recovering parts of an electronic circuit having a self-supporting substrate having graphene oxide (GO) paper and at least a conductive trace on said self-supporting substrate, the method comprising: immersing said electronic circuit into an environment-friendly solvent, said GO paper thereby dissociating from said conductive trace and forming a suspension within an upper layer of said environment-friendly solvent; and recovering at least one of said conductive trace and said GO paper from said environment-friendly solvent. 2. The method of claim 1 wherein said immersing said electronic circuit into an environment-friendly solvent comprises immersing said electronic circuit into water. 3. The method of claim 1 wherein said immersing comprises said conductive trace settling to a bottom layer of said environment-friendly solvent. 4. The method of claim 3 wherein said recovering comprises isolating said top layer and said bottom layer from one another and removing said at least one of said conductive trace and said GO paper from said environment-friendly solvent. 5. The method of claim 3 wherein said recovering comprises evaporating said environment-friendly solvent. 6. The method of claim 1 further comprising fabricating another electronic circuit using said recovered at least one of said conductive trace and said GO paper.
Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials · CPC title
Using an aqueous solution, e.g. for cleaning or during drilling of holes · CPC title
Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773 · CPC title
Paper sheets (used as reinforcing materials for organic insulating substrates H05K1/0366) · CPC title
Non-siliceous fibres, e.g. from metal oxides · CPC title
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